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substrate×三和電子サーキット - List of Manufacturers, Suppliers, Companies and Products

substrate Product List

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High thermal conductivity substrate "Copper Inlay Substrate"

High thermal conductivity substrate "Copper Inlay Substrate"

We provide a substrate embedded with copper coins to efficiently dissipate heat.

Among the diversifying electronic components, there are those that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, Sanwa Electronic Circuit offers substrates embedded with copper coins. These are ideal for applications such as power supply boards and high-frequency boards. 【Features】 ○ Solutions for heat dissipation measures (enhanced heat dissipation effect and improved design flexibility) ○ Heat dissipation measures for high heat-generating elements → Various copper-inlay substrates can be adopted, ranging from 2-layer to high-multilayer boards. For more details, please contact us or download the catalog.

  • Printed Circuit Board

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Printed circuit board "Flexible substrate"

Printed circuit board "Flexible substrate"

Fine pattern formation and support for high-density wiring compatible with small-diameter vias are also possible!

"Flexible printed circuit boards" are printed wiring boards formed on a flexible insulating film that can be significantly deformed, such as by bending. They excel in flexibility and bending characteristics, allowing for wiring in movable parts and three-dimensional wiring. Our company offers products that meet various needs, including single-sided FPC, double-sided FPC, and others. 【Features】 ■ Excellent bending and flexural properties ■ Ability to bend freely ■ Capable of wiring in movable parts and three-dimensional wiring ■ Supports high-density wiring compatible with fine pattern formation and small-diameter vias *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing

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Printed Circuit Board "Fluororesin Substrate"

Printed Circuit Board "Fluororesin Substrate"

High-density wiring compatible with thin plates, fine pattern formation, and small-diameter vias is also possible!

"Fluororesin substrate" is a printed circuit board made from materials such as fluororesin-impregnated glass cloth. It has a very low dielectric constant and dielectric loss tangent, providing excellent high-frequency characteristics, making it suitable for high-frequency equipment applications. We offer products tailored to needs such as thin plates and small sizes. 【Features】 ■ Excellent high-frequency characteristics (relative permittivity and dielectric loss tangent) ■ Capable of high-density wiring that supports thin plates, fine pattern formation, and small-diameter vias ■ Products tailored to your needs *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin]"

High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin]"

Efficiently dissipate heat from the copper coin to the back side! It is possible to reduce the heat generation of the entire circuit board.

We would like to introduce our high thermal conductivity substrate, the "Copper Inlay Substrate [Copper Coin]." Among the diverse electronic components, there are some that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, we offer substrates embedded with copper coins. 【Features】 ■ Efficiently dissipates heat to the backside by incorporating copper coins ■ Reduces overall heat generation of the substrate *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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High Thermal Conductivity Substrate "Thick Copper Substrate"

High Thermal Conductivity Substrate "Thick Copper Substrate"

Using thick copper foil of 105μm or more! We provide substrates that enhance large current and heat dissipation.

We would like to introduce our high thermal conductivity substrate, the "Thick Copper Substrate." By increasing the copper thickness, it becomes possible to carry more current and improve heat dissipation. We offer substrates that enhance high current and heat dissipation by using copper foil thicker than 105μm. 【Product Lineup】 ■ Double-sided Printed Circuit Boards - Copper foil thickness: 70, 105, 140, 175μm ■ Multilayer Printed Circuit Boards - Copper foil thickness (outer layer, inner layer): 70, 105μm *For more details, please refer to the PDF document or feel free to contact us.

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High thermal conductivity substrate "Metal base substrate"

High thermal conductivity substrate "Metal base substrate"

Used in products that require high heat dissipation, such as power boards and LED boards!

The "metal base substrate" is a high thermal conductivity substrate made by laminating aluminum or copper. By using metals with high thermal conductivity, it is possible to efficiently dissipate heat from heat-generating components. Additionally, by changing the resist ink from a standard white to a white suitable for LEDs, a high reflectivity is achieved. This enables the production of high-brightness LED substrates. 【Lineup】 ■ Copper base substrate ■ Aluminum base substrate ■ Double-sided aluminum base *For more details, please refer to the PDF document or feel free to contact us.

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High-speed signal and high-density substrate "Back Drill Substrate"

High-speed signal and high-density substrate "Back Drill Substrate"

Providing high-speed transmission boards with better characteristics! Applications include base stations, communication devices, and high-speed routers.

We would like to introduce our high-speed signal and high-density substrate, the "Back Drill Substrate." By removing unnecessary through-hole stubs through back drilling, we eliminate signal disturbances. Furthermore, it becomes possible to reduce attenuation, allowing us to provide high-speed transmission substrates with better characteristics. 【Features】 ■ Back drilling process ■ Capability to eliminate signal disturbances and reduce attenuation *For more details, please refer to the PDF document or feel free to contact us.

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High-speed signal, high-density substrate "Build-up substrate"

High-speed signal, high-density substrate "Build-up substrate"

Build-up structure! Supports various interlayer connections with laser VIA, IVH, and through VIA.

We would like to introduce our high-speed signal and high-density substrate, the "Build-Up Substrate," which we handle. It supports build-up substrates from 4 layers to 16 layers, and thanks to its build-up structure, it accommodates various interlayer connections using laser vias, IVH, and through vias. It allows for the mounting of narrow-pitch components and high-density designs. Please feel free to consult us when you need assistance. 【Features】 ■ Supports build-up substrates from 4 layers to 16 layers ■ Allows for the mounting of narrow-pitch components and high-density designs *For more details, please refer to the PDF document or feel free to contact us.

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High-frequency hybrid substrate "Hybrid substrate"

High-frequency hybrid substrate "Hybrid substrate"

The intended use is for base stations and communication equipment! We offer circuit boards with excellent cost performance.

The "Hybrid Substrate" is a high-frequency hybrid substrate that enables the manufacturing of multilayer substrates combining a variety of materials. By using expensive materials with excellent high-frequency characteristics only in the necessary layers, we provide cost-effective substrates. We will propose combinations of materials (high-frequency materials and FR-4 materials) considering electrical characteristics, material reliability, and more. 【Features】 ■ Capable of manufacturing multilayer substrates combining a variety of materials ■ Expensive materials with excellent high-frequency characteristics are used only in the necessary layers ■ Combinations of materials are proposed considering electrical characteristics, material reliability, etc. *For more details, please refer to the PDF document or feel free to contact us.

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High-frequency compatible substrate "Fluororesin substrate"

High-frequency compatible substrate "Fluororesin substrate"

Materials with excellent frequency characteristics! Capable of high-frequency performance tailored to specific applications.

"Fluororesin substrates" are printed circuit boards with low dielectric constant and low dielectric loss, exhibiting very good frequency characteristics. They can be tailored to high-frequency characteristics according to the application. Additionally, we can handle products from both domestic and overseas manufacturers. Please feel free to consult us when you need assistance. 【Material Types】 ■ General FR-4 material ■ PPE material ■ LCP material ■ Fluororesin material *For more details, please refer to the PDF document or feel free to contact us.

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Side-coated substrate

Side-coated substrate

Coating on the substrate side! Prevents powder drop from the edge caused by rubbing against the guide rail.

We would like to introduce our "Side Coated Substrate." Powder shedding from the opened sides of laminated substrates can affect the assembly process and become a source of foreign matter within the mold. By coating the sides of the openings, we contribute to solving problems during assembly. By applying a coating to the sides of the substrate, we prevent powder shedding from the edges that occurs when the substrate rubs against guide rails during transport. [Applications] ■ Device substrates ■ Substrates requiring resin molding, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Tent Through Hole PCB

Tent Through Hole PCB

Prevent the flow of sealing resin and flux during component mounting!

The "Tent Through Hole Substrate" is a substrate that forms a tent membrane over the through-hole sections using a dry film type solder resist. It prevents the flow of sealing resin and other resins after component mounting, as well as the wicking of flux and solder during the mounting process. Please feel free to contact us when you need assistance. [Applications] ■ Device substrates ■ Substrates that require resin molding, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Silicone embedded substrate

Silicone embedded substrate

By changing the height of the circuit, it is possible to form silicone ink on the circuit as well!

We would like to introduce our "Silicone Embedded Substrate." By filling the gaps between the circuits where LED elements are mounted with silicone ink that has high reflectivity and weather resistance, we can suppress the degradation of the resin substrate. Additionally, by combining this with a step process, it is possible to form silicone ink on the circuit by changing the height of the circuit. 【Applications】 ■ Substrate boards for chip LEDs, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Functional step substrate

Functional step substrate

Suitable for applications such as power supplies, inverters, and high-current circuit boards and device components!

We would like to introduce our "Function Step Board." Through our step circuit process, we can arrange high-current circuits using thick copper foil, such as 70μm, and fine wire control circuits using copper foil, such as 18μm, on the same substrate, enabling the provision of copper-thick hybrid circuit boards through continuous wiring. By forming unevenness through step formation in part of the circuit, we can provide height adjustment of mounted components and functions based on shape and structure in substrates used for device components. 【Specifications (Partial)】 ■ Base material copper foil thickness: 18μm, 35μm, 70μm, 105μm ■ Maximum step height - 18μm copper foil: 12μm - 35μm copper foil: 25μm - 70μm copper foil: 50μm - 105μm copper foil: 80μm *For more details, please refer to the PDF document or feel free to contact us.

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Ultra-thin rigid substrate

Ultra-thin rigid substrate

It is possible to manufacture a double-sided board with a substrate thickness of 0.04t, while being a rigid substrate!

We would like to introduce our "Ultra-Thin Rigid Substrate." Thanks to our technology, we can manufacture double-sided substrates with a thickness of 0.04 mm, while still being rigid. This is ideal for applications such as circuit boards for ultra-thin high-density devices. Please feel free to contact us when you need assistance. 【Applications】 ■ Circuit boards for ultra-thin high-density devices, etc. *For more details, please refer to the PDF document or feel free to contact us.

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