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substrate Product List

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Rigid substrate

Rigid substrate

Rigid substrate for flip chip mounting compatible with various test chips □Product name... JKIT Type1 / JKIT Type2 / JKIT Type3 / JKIT Type4 / JKIT Type5 / JKIT Type6

  • Other electronic parts
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  • Processing Contract

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Metal base CCL substrate for high-power LEDs

Metal base CCL substrate for high-power LEDs

Standard indicator LEDs (bulb-type LEDs) have been primarily used with resin substrates (glass cloth epoxy substrates) due to their low heat generation. However, power LEDs used for lighting applications generate more heat, making metal-based substrates effective for improving LED performance and reliability against heat, as well as extending their lifespan due to their excellent thermal conductivity and cost performance. Well's MCCL substrate is based on a ferrous alloy with excellent heat dissipation, designed to keep the temperature rise of high-power LED elements within a certain range. By utilizing the ferrous alloy base material as a heat sink, it is possible to significantly disperse and dissipate heat generated from the LED, thereby reducing the heat generated by the LED itself and minimizing the decrease in LED lifespan. Additionally, by combining this with Well's heat sink coated with carbon nanotubes, we achieve further improvements in heat dissipation characteristics, leading to an extended lifespan for the LEDs.

  • Other electronic parts

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Flexible circuit board

Flexible circuit board

Flexible substrate compatible with the "JTEG Phase6" test chip for LCD driver evaluation □ Product names JKIT COF TEG_50-A / JKIT COF TEG_50-B JKIT COF TEG_50-C / JKIT COF TEG_40-A JKIT COF TEG_40-B / JKIT COF TEG_40-C JKIT COF TEG_35-A / JKIT COF TEG_35-B JKIT COF TEG_30-A / JKIT COF TEG_30-B JKIT COF TEG_25-A

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  • Processing Contract

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Glass substrate

Glass substrate

Glass substrate compatible with the liquid crystal driver evaluation test chip "Phase 6" □Product name ... JKIT Type G1 / JKIT Type G2 / JKIT Type G3 / JKIT Type G4 / JKIT Type G5

  • Other electronic parts
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  • Processing Contract

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