Rigid substrate
Rigid substrate for flip chip mounting compatible with various test chips □Product name... JKIT Type1 / JKIT Type2 / JKIT Type3 / JKIT Type4 / JKIT Type5 / JKIT Type6
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basic information
The JTEG and JKIT from Hitachi Ultra LSI Systems, which we are introducing here, ceased production of all products as of December 2009. For the latest information on Well's original open TEG chip "JCHIP," please visit here: http://well-teg.jp/
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Applications/Examples of results
Our test chips are standard TEG chips developed to support various methods for SIP development, PKG development, implementation method development, PCB substrate development, assembly and inspection equipment development, and material development applications, and are already used by over 200 customers both domestically and internationally. We also accept orders for custom chips with special specifications.
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Company information
Well develops and implements a packaging solution business centered on test chips for advanced implementation evaluation, covering everything from bare chip packaging equipment development and contract implementation to reliability evaluation. ~ Corporate Philosophy ~ ■ With "Profitable Relationship" as the core of our management philosophy, we aim to be a company that contributes to the prosperity of our customers and the development of the globally expanding electronics components industry. ■ Through the provision of products that support next-generation semiconductor packaging development, we contribute to the promotion of our customers' development and the enhancement of their profits. ■ We aim to create valuable markets by providing "innovative products" and "cutting-edge services."
![[Case Study] Rigid Substrate Product Delivery Performance](https://image.mono.ipros.com/public/product/image/9d7/2000321557/IPROS7548787927017114497.jpg?w=280&h=280)
