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substrate×名東電産 - List of Manufacturers, Suppliers, Companies and Products

substrate Product List

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Improved heat dissipation and miniaturization of substrates with 'copper embedded (copper inlay) substrates'

Improved heat dissipation and miniaturization of substrates with 'copper embedded (copper inlay) substrates'

Achieves high heat dissipation! A lightweight substrate with a highly thermally conductive copper plate embedded beneath the heat dissipation component.

"Implanted copper substrates" are boards that embed high thermal conductivity copper plates (398W/mk) beneath heat dissipation components. By locally embedding copper plates in areas that need heat dissipation, they are more cost-effective and lighter than copper core substrates. 【Reasons to Choose This Product】 - Compatible with any base material! - Cost-effective heat dissipation compared to increasing copper thickness! - Takes up less space compared to using heat sinks, enabling miniaturization! - The size of the embedded copper can start from 2.0mm in width (negotiable). For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Printed circuit board "Side plating / Dissimilar material bonding / Cavity substrate"

Printed circuit board "Side plating / Dissimilar material bonding / Cavity substrate"

Achieve shield effect! Side plating substrate capable of forming half-through holes on the side parts.

At Meito Electric Co., Ltd., we manufacture and sell printed circuit boards such as "side-plated substrates," "dissimilar material laminated substrates," and "cavity substrates." The "side-plated substrate" achieves a shielding effect by applying plating treatment to the outer edge surface of the substrate. The "dissimilar material laminated substrate" allows for combinations tailored to your needs, such as laminating high-frequency materials with epoxy resin. The "cavity substrate" can be produced more easily than structures that embed electronic components into the substrate. 【Features】 ○ Side-plated substrate: → Half through-holes can be formed on the side surface → Plating can also be formed around the entire circumference of the substrate's side surface ○ Dissimilar material laminated substrate: → Various sizes are available to accommodate small quantities of diverse multilayer workpieces → Supports surface treatments such as heat-resistant flux, lead-free solder leveling, and gold plating ○ Cavity substrate: → Enables low-profile modules *For more details, please refer to the PDF document or contact us directly.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Technical documentation on "high heat dissipation of substrates" necessary for product miniaturization.

Technical documentation on "high heat dissipation of substrates" necessary for product miniaturization.

Handbook on 'Improving Heat Dissipation of PCBs' is now available! High heat dissipation of PCBs is essential for miniaturizing products! Includes advantages and disadvantages of using copper and aluminum.

In the miniaturization of products, enhancing the thermal dissipation of the substrate is essential. Heat sinks are used to improve thermal conductivity, but they take up extra space, which contradicts the goal of miniaturization. Meito Electric specializes in processing that improves the thermal dissipation of substrates by using aluminum and copper as conductors. ★ We have a proven track record in various fields, including automotive substrates and LED substrates! We are currently offering technical materials related to improving substrate thermal dissipation for free! These materials also include the advantages and disadvantages of substrates made from copper and aluminum. *If you would like the technical materials, please feel free to download them or contact us.

  • Contract manufacturing

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Improving heat dissipation across the entire substrate! The "aluminum core substrate" is lighter than the copper core substrate.

Improving heat dissipation across the entire substrate! The "aluminum core substrate" is lighter than the copper core substrate.

For high current substrate applications! The "aluminum core substrate," lighter than copper core substrates, also improves overall heat dissipation.

"Aluminum core substrate" is a suitable substrate when you want to improve heat dissipation throughout the substrate while also reducing weight compared to copper core substrates. 【Features】 ● Excellent thermal conductivity ● Industry's highest dielectric breakdown voltage ● Lower dielectric constant compared to epoxy resin substrates *For more details, please refer to the PDF materials or contact us directly.

  • LED Module

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PTFE material IVH substrate *Technical documentation available

PTFE material IVH substrate *Technical documentation available

Non-through IVH substrate made of polytetrafluoroethylene material! We also offer high-quality, highly reliable custom-made substrates using our unique technology.

The PTFE IVH substrate is a non-through IVH substrate made from polytetrafluoroethylene material. Our company manufactures composite multilayer substrates composed of bonded dissimilar materials. (We also produce various other types of substrates.) IVH and BVH structures using composite materials such as Teflon + FR-4 and PPE + FR-4 are possible. We can also bond copper and aluminum with substrate materials or multilayer substrates, and we can develop our processing technology to create custom substrates that meet your requirements. 【Substrate Specifications】 ● Bonded material thickness: 0.1t and above ● Line space: 100/100μm, intersection ±50μm ● Surface treatment: water-soluble heat-resistant flux, lead-free solder leveling, Au flash, etc. *For more details, please refer to the PDF document or contact us directly.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Meito Electric Industry Aluminum Substrate (MX Series)

Meito Electric Industry Aluminum Substrate (MX Series)

This substrate is laminated and bonded with an insulating sheet of high thermal conductivity between an aluminum plate and copper foil.

Using this substrate is suitable for applications of printed circuit boards that require heat dissipation due to high current handling and the heat generated by electronic components.

  • LED Module

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Lightweight Conductor High Heat Dissipation Substrate "L&H Board"

Lightweight Conductor High Heat Dissipation Substrate "L&H Board"

Achieving lighter weight and higher heat dissipation! Lightweight conductor high heat dissipation substrate using aluminum.

The "L&H Board (Light body and high Heat radiation Board)" is a substrate that achieves lightweight and high heat dissipation by using aluminum. By employing metal conductors, direct soldering for component mounting is possible. It is suitable for applications such as high-brightness LED mounting substrates, automotive substrates (HCV/EV vehicle power substrates), high-current power substrates, various inverter substrates, high-frequency substrates, and solar power generation substrates. 【Features】 - Ensures strong adhesion through proprietary technology - Thickness of core aluminum material and surface aluminum material can be changed - Insulation layers can use both epoxy resin and special resin - Custom manufacturing available according to your needs For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Meito Electric Co., Ltd. Company Profile

Meito Electric Co., Ltd. Company Profile

High technology supporting the industrial society! Meito Electric Co., Ltd. plays a part in that.

Meito Electric Co., Ltd. is involved in the electric and electronic machinery and equipment automotive manufacturing industry, which has undergone significant and diverse transformations. The printed circuit boards and other products handled by Meito Electric have also made great advancements in technology, quality, and quantity. Since its establishment, the company's philosophy in manufacturing has been to "create the best possible products" and to adhere to "quality-oriented" management, which has led to the accumulation of trust from our business partners and stable transactions to this day. 【Business Activities】 - Manufacturing, processing, and sales of printed circuit boards and nameplates - Processing and sales of electrical insulation materials, plastic molded products, and various related materials - Press processing and sales of general metal materials - Processing, assembly, and sales of electrical machinery, automotive parts, and other related components - Manufacturing of precision press molds and jigs, among others For more details, please contact us or download our catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Contract measurement

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Heat dissipation (special) substrate for LED

Heat dissipation (special) substrate for LED

Heat-dissipating substrates and special substrates available! We develop products tailored to our customers' needs together.

Meito Electric Co., Ltd. is engaged in the development of LED products that are attracting attention as environmentally friendly lighting for the Earth. We offer not only LED lighting suitable for a wide range of applications, such as illuminated signs and indirect lighting for stores, but also various customized LEDs. Additionally, leveraging our expertise in circuit board manufacturing, we also design and manufacture metal heat dissipation substrates. Our company handles heat dissipation substrates, including metal base substrates (such as aluminum base substrates and copper base substrates), as well as substrates for special applications. We are committed to developing products in collaboration with our customers to meet their needs. For more details, please refer to our catalog or feel free to contact us.

  • Circuit board design and manufacturing
  • LED Module

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If you are struggling with thick copper substrates for inverters, converters, and electric power circuits.

If you are struggling with thick copper substrates for inverters, converters, and electric power circuits.

Do you have any requests such as wanting to allow more current to flow than a standard circuit board, wanting to suppress the resulting temperature rise, or not wanting to increase the size of the board?

Do you have any requests such as wanting to flow more current than a standard board while keeping temperature rise to a minimum, or not wanting to increase the size of the board too much? At Meito Electric, as a board manufacturer, we assist in the development of thick copper boards tailored to your needs by considering the line/space during pattern design, the current values flowing through through-holes, selecting copper thickness, and choosing high heat dissipation materials and layer counts. 【Do you have any of the following requests?】 ■ Want to reduce bus bars on the board ■ Want to form power circuits and control circuits on the same board ■ Want to dissipate heat from components to prevent failures 　and more *For detailed information on thick copper, please download the PDF or feel free to contact us.

  • Contract manufacturing

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Small lot for development! For automotive and power supply use. Thick copper substrate (high current substrate).

Small lot for development! For automotive and power supply use. Thick copper substrate (high current substrate).

With a maximum copper thickness of 400μm, it is suitable for heat dissipation measures and power supply for power devices! It can also be formed on substrates such as transformers and motors.

Meito Electric's "Thick Copper Substrate (High Current Substrate)" is suitable for heat dissipation and current supply in heating devices used in automotive and power supply applications. By increasing the conductor (copper) thickness compared to the conventional 35μm, power circuits and control circuits can be formed on the same substrate. The creation of thick copper coil patterns allows for the construction of transformer circuits and motor circuits on the substrate. 【Substrate Specifications】 ■ Outer layer copper foil thickness: 70μm to 200μm ■ Inner layer copper foil thickness: 70μm to 400μm ■ High thermal conductivity resin: up to 8W/mK ■ Bonding: High thermal conductivity resin and copper, etc. ■ Number of layers: Proven from 2 layers to 10 layers (specifications to be discussed) ■ Copper plate: C1020 (oxygen-free) or C1100 (tough pitch) *For detailed information, please download the PDF or feel free to contact us.

  • Contract manufacturing

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