1～10 item / All 10 items
By eliminating the symbol mark printing process, it becomes possible to reduce resource and energy consumption, as well as decrease defective waste.
A printed circuit board with a pattern formed on the product surface that incorporates a URL for viewing symbol mark information in a two-dimensional code. By scanning the two-dimensional code with a smartphone or similar device, the symbol mark can be viewed on the device's screen.
Proposal for eco-friendly circuit boards using solderless technology.
- The press-fit structure allows for a reduction in labor during the assembly process, and by eliminating soldering, it enables a decrease in energy consumption and manufacturing costs. - It has excellent corrosion resistance and connection stability, making it suitable for products that experience significant changes such as temperature fluctuations and vibrations.
It is suitable for high current and high heat dissipation substrates, including those for vehicle-mounted and power supply applications.
- It can accommodate both double-sided and multi-layer configurations. - It can be used as a high-current board for automotive and power supply applications, as well as a high heat dissipation board. - With support from the development and design stage, we can propose appropriate specifications tailored to the customer's needs.
Significant heat dissipation effects can be achieved without making major changes to the circuit design or specifications of the board.
- It can be manufactured in the same production period as rigid substrates. (There is no need for bonding processes with base materials like metal base substrates, or insulation inspection processes, etc.) - High reflection efficiency can be achieved without separately attaching a reflector. (There is no need for separate manufacturing or installation processes for the reflector.) * We also accept orders using general resist inks that do not use "high-gloss resist ink." - It offers high tracking resistance, ensuring electrical fire safety. (CTI value: 600 V or higher)
We provide metal base substrates that achieve high current and high heat dissipation.
- This is a substrate that can protect components from thermal destruction with high thermal conductivity and heat dissipation characteristics. (Base material nominal heat dissipation characteristic: 3.0 W/m·K or higher) - It offers high tracking resistance, ensuring electrical fire safety. (CTI value: 600 V or higher) - This substrate has high dielectric strength, allowing for safe use. (Through thickness dielectric strength: 3.0 kV / 100 μm) - UL certified.
We also accept orders starting from one piece. For small quantities, we offer reasonable prices without using a die.
- It has thinness and flexibility, allowing it to be bent repeatedly for use, and it maintains its electrical characteristics even when deformed. - We also offer rigid-flex PCBs, flexible PCBs with resist specifications, and flexible PCBs that excel in noise countermeasures, so please feel free to contact us.
I excel at pinpoint heat dissipation.
- Utilizing the thermal conductivity properties of copper, heat from the heating components is directly dissipated to the back side. - Copper pins are inserted only in the areas of the components where heat needs to be dissipated, resulting in weight reduction. - This is a substrate with copper pins inserted into a familiar copper-clad laminate.
It is compatible with impedance control for both characteristics and differential.
By adopting the TDR measurement device (manufactured by Agilent Technologies), we can handle not only prototype-level impedance measurements and process capability management for mass-produced products but also impedance measurements alone. With support from the development design stage, we can quickly respond to customer requests and propose optimal specifications.
Through the screen printing method, any through holes are filled with resin to protect the through holes.
- By finishing the surface smoothly with special polishing, it does not hinder component mounting. - UL certified... Limited to multilayer printed circuit boards (4-layer, 6-layer) (Detailed specifications to be discussed separately).
The adoption of IVH enables miniaturization and high density.
- You can choose a specification that suits your needs from three options (IVH specification, BVH specification, IVH-BVH combined specification). - With support from the development design stage, we can quickly respond to customer requests and propose the optimal specification.
