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substrate×サトーセン - List of Manufacturers, Suppliers, Companies and Products

substrate Product List

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Ultra-thin multilayer printed circuit board

Ultra-thin multilayer printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-Sen Co., Ltd., we offer optimal heat dissipation technology through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. 【Features】 The thinnest 4-layer printed circuit board with a thickness of 0.15mm * For detailed information such as "specifications," please refer to the catalog. * For more information, please contact us or download the catalog.

  • Printed Circuit Board

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Package printed circuit board (PCB) / Chip-on-Board (COB)

Package printed circuit board (PCB) / Chip-on-Board (COB)

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-sen Co., Ltd., we offer optimal heat dissipation technology through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. Regarding high brightness, the use of LED-specific white substrates and solder resist improves reflectivity and reduces discoloration caused by thermal degradation during assembly and use. We have a lineup that includes "COB for optical communication," "package printed circuit boards," and "ultra-thin multilayer printed circuit boards." *For more details, please contact us or download the catalog.*

  • Printed Circuit Board

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Package printed circuit board

Package printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology.

At Sato-Sen Co., Ltd., we propose optimal heat dissipation technologies through our extensive experience in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating technology. 【Necessary Technical Elements】 ○ Selection of package materials that reduce warping ○ High-density circuit formation technology with L/S = 25/25μm ○ Surface treatment technology with high connection reliability ○ Film solder resist method to improve yield in C4 mounting * Detailed information such as "specifications" is available in the catalog. * For more details, please contact us or download the catalog.

  • Printed Circuit Board

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High thermal conductivity printed circuit board

High thermal conductivity printed circuit board

We will propose optimal heat dissipation technology through rich heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques.

At Sato-Sen Co., Ltd., we offer optimal heat dissipation technology through our extensive expertise in heat dissipation circuit design, high brightness, selection of heat dissipation materials, and plating techniques. A "high heat dissipation printed circuit board" is a board characterized by its ability to dissipate heat when mounted with components that generate significant amounts of heat. 【Necessary Technical Elements】 ○ Proposals for material selection and circuit design suitable for heat dissipation ○ Proposals for heat dissipation structures applicable to a wide variety of uses * Detailed information such as "specifications" is available in our catalog. * For more information, please contact us or download the catalog.

  • Printed Circuit Board

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Paper substrate *Circuit formed with silver paste

Paper substrate *Circuit formed with silver paste

Using high heat-resistant paper, a foldable/flexible paper substrate! Suitable for applications such as disposable uses!

We would like to introduce the "Paper Substrate" handled by Sato-Sen Co., Ltd. It uses a special paper with high heat resistance and can be bent/folded. The line spacing is 200/200, and circuits are formed using silver paste. It offers good cost performance and is suitable for disposable applications. Please feel free to contact us when you need it. 【Features】 - Uses a special paper with high heat resistance - Can be bent/folded - Line spacing is 200/200 - Circuits are formed using silver paste - Good cost performance *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Paper and pulp products

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