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The functions of electronic devices are becoming increasingly complex, and their sizes are getting smaller. If you need multilayer substrates, please consult us here.
Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.
4-layer high-density wiring circuit board
Number of layers: Four layers Material: FR-4 Board thickness: 1.57 +/- 0.13 mm Surface treatment: Electroless gold plating Copper foil thickness: H/H~1/1 oz Remark: Impedance control 75 OHM Differential pair: 85/90/100 OHM
It is a composite board of rigid and flexible substrates. Most rigid substrates are multilayer boards.
Number of Layers: Eight Layers Material: FR-4/Polyimide Board Thickness: FR4: 1.0 +/- 10% PI: 0.05mm Surface Treatment: Electroless Gold Plating 2µ" (min), Ni 100µ" (min) Copper Foil Thickness: 1/H~H/1 oz Remark: Camera Lens
It is a commonly used circuit board.
It is a two-layer FR-4 substrate.
Generally, high multi-layer lamination technology is adopted in manufacturing.
Number of layers: 4 layers Material: FR4 Board thickness: 2.28 +/- 0.23 mm Surface treatment: Electroless gold plating Copper foil thickness: 1/3/0.85 OZ
It is a commonly used circuit board.
It is a two-layer FR-4 TG140 board.
Priority selection of various electronic products is relatively easy to produce at low cost. They are used in small household electrical appliances, such as computers, radios, and printers.
Low cost! Easy to design and produce! Furthermore, short delivery time!
We can meet the diverse design needs of our customers.
The advantages of copper foil circuits are their ability to withstand high temperatures and their rigidity. They are suitable for various types of handheld mobile devices, printers, and table equipment.
For computers, cameras, automobiles, etc.
Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.
The functions of electronic devices are becoming increasingly complex and their sizes are getting smaller. If you need multilayer substrates, please consult us here.
Can handle more complex functions. Higher quality. Greater power, greater operational capability, and faster speed. Improved durability. Smaller size and lighter weight.
Generally, high multilayer lamination technology is adopted in manufacturing.
Number of Layers: Six Layers Material: FR-4 (High TG 170) Board Thickness: 1.6 +/- 0.1mm Surface Treatment: Electroless Nickel/Electroless Gold Copper Foil Thickness: H/1/1/1/1H OZ Remark: Blind Holes: L1/L2 & Blind Holes
4-layer rigid flex circuit board
Number of Layers: Four Layers Materials: FR4 + Polyimide + Copper Foil + Carbarelay Board Thickness: FR4: 0.8 +/- 0.1mm PI: 0.175mm Surface Treatment: Electroless Gold Plating Au 2µ", Ni 80µ" Copper Foil Thickness: 1/H~H/1 OZ Blind Holes: L1~L2 / L3~L4 Remark: Smartwatch
Generally, high multilayer stacking technology is adopted in manufacturing.
Number of layers: 12 layers Material: FR4 TG175 Board thickness: 2.0 +/- 10% mm Surface treatment: Electroless nickel/electroless gold plating Copper foil thickness: H/1/1/1/1H OZ Remark: Blind holes: L1/L2 & blind holes
