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substrate×スクリーンプロセス - List of Manufacturers, Suppliers, Companies and Products

substrate Product List

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Printed Circuit Board "Pad on Via"

Printed Circuit Board "Pad on Via"

Filling holes on pads is possible for a board thickness of up to 4.8t! We support the manufacturing of BGA and CSP areas.

"Pad on Via" is a printed circuit board that supports the manufacturing of BGA and CSP areas. The filling of Pad on Via holes can accommodate a board thickness of up to 4.8t, with drill diameters ranging from φ0.105mm to φ1.0mm. (Consultation available depending on specifications) Additionally, we can achieve permanent filling of vias according to customer requests. The permanent filling ink is processed smoothly through polishing. 【Process Example】 ■ NC drilling ■ Primary copper plating ■ Hole filling ■ Curing and polishing ■ Secondary copper plating ■ Pattern formation *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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プリント基板　ハロゲンフリー・鉛フリー対応基板

プリント基板　ハロゲンフリー・鉛フリー対応基板

ニーズにお応えする為に高品質・高精度・短納期を追求し、低価格化のニーズにも的確に対応できるように尽力致します。

ハロゲンフリー化及び鉛フリー化に各種、対応しております。

  • Printed Circuit Board

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Base aluminum substrate

Base aluminum substrate

It is a new feature that adds "heat dissipation" and "mechanical rigidity" to the functions of conventional printed circuit boards.

Aluminum substrates are designed to add new functions of "heat dissipation" and "mechanical rigidity" to the conventional printed circuit boards. Additionally, compared to resin-based printed circuit board materials, aluminum substrates have a temperature rise of about 1/10 or less at the same power consumption, making them very suitable for components that generate heat, such as resistors carrying large currents, power transistors, and high-power LEDs.

  • Printed Circuit Board

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Substrate for narrow pitch BGA/CSP and PGA specification high-density substrate

Substrate for narrow pitch BGA/CSP and PGA specification high-density substrate

There are various variations depending on the board thickness and pitch.

There are various variations depending on the thickness of the board and the pitch.

  • Printed Circuit Board

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Substrate IVH specification substrate

Substrate IVH specification substrate

Compatible with minimum hole diameter φ0.125.

The maximum interlayer thickness of IVH is 0.4mm, and it can accommodate a minimum hole diameter of φ0.125. In the future, it is also planned to support multi-layer laminated press specifications.

  • Printed Circuit Board

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Substrate "Impedance Control"

Substrate "Impedance Control"

Impedance measurement creates test coupons outside the product! The design values for the impedance line can be simulated by our company.

In recent years, there has been a growing demand for substrates that implement impedance control. To meet such needs, our company is capable of manufacturing various impedance substrates. By providing us with impedance specifications and other details before or during the design phase, we can propose the necessary values for the design. 【Introduction of Software and Equipment】 ■ Polar Instruments Impedance Simulator Si8000m v12.01 ■ Polar Instruments Impedance Measurement Device CITS800s4 *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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