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substrate×JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office - List of Manufacturers, Suppliers, Companies and Products

substrate Product List

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AuSn solder

AuSn solder

By pre-applying AuSn solder to the circuit board, it becomes possible to directly mount chip components, thereby reducing assembly labor.

【Features】 ○ AuSn composition: Au:Sn=7:3 (standard) (other compositions are also available) ○ Standard film thickness (t): 3μm ○ Film thickness tolerance: ±20% ○ Pattern minimum dimension (D): 50μm ○ Pattern tolerance: ±10μm ● For other functions and details, please contact us.

  • Other electronic parts

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Electronic Ceramics (Thin film integrated circuit components & Substrates)

Electronic Ceramics (Thin film integrated circuit components & Substrates)

A thin film integrated circuit pattern will be formed on a ceramic substrate.

By using alumina with a purity of 99.9%, we provide fine circuit patterns (line/space=30um/30um) that enable operation in the 30GHz band required for next-generation wireless communication systems. 【Thin Film Integrated Circuits】 We pattern integrated circuits on various ceramic substrates. ●Side patterns (over 0.3t), and AuSn solder patterns is possible. ● Simultaneous mounting of conductors, thin film resistors, and thin film inductors is possible. ● The combination of our unique 99.9% alumina substrate and fine patterns allows for the formation of circuits with low dielectric loss and low noise in high-frequency bands. ● For substrate materials, we also accommodate aluminum nitride (ALN) substrates, quartz substrates, and more. 【High-Quality Alumina Substrates】 ● Dense ● The three-point bending strength is 660MPa, which is significantly higher than conventional products (about twice as much). ● Excellent electrical properties with low dielectric loss in high-frequency bands.

  • High frequency/microwave parts
  • Fine Ceramics
  • Circuit board design and manufacturing

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Characteristics and Applications of Various Ceramic Substrates

Characteristics and Applications of Various Ceramic Substrates

Consistent production from manufacturing ceramics substrates with low dielectric loss in the microwave band, microwave dielectric substrates, to the formation of thin film patterns.

【High-Quality Alumina Substrate】 ○ Dense ○ The three-point bending strength is 660 MPa, which is significantly higher, about twice that of conventional products ○ Excellent electrical properties with low dielectric loss in the high-frequency range 【Zirconia Substrate】 ○ High strength and high toughness ○ Large elastic deformation capacity in bendable ceramics 【High Dielectric Substrate】 ○ Due to its high relative permittivity, it enables miniaturization of high-frequency circuits compared to alumina substrates ○ Low dielectric loss even in the high-frequency range 【Thin Film Integrated Circuit】 (Circuit formation on various ceramic substrates) ○ Formation of air bridges, side patterns (0.5t or more), and AuSn solder patterns is possible ○ Simultaneous mounting of conductors, thin-film resistors, and thin-film inductors is possible ○ By combining a unique 99.9% alumina substrate with fine patterns, it enables the formation of low-loss and low-noise circuits in the high-frequency range ○ Substrate materials also include high dielectric substrates, aluminum nitride substrates (AlN substrates), and quartz substrates.

  • High frequency/microwave parts
  • Fine Ceramics

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3D processing ceramic products

3D processing ceramic products

The use of ceramics has expanded due to high-precision processing of complex shapes and curved surfaces using 5-axis machining.

The introduction of a 5-axis machining machine, which adds the C-axis (table rotation) and A-axis (table tilt axis) to the X, Y, and Z axes, has made it possible to achieve high-precision machining of complex shapes and curved surfaces, thereby expanding the applications of ceramics. Cost reduction is also expected due to the reduction in setup time.

  • Fine Ceramics
  • Other molds
  • Other machine elements

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Formation of thin-film integrated circuits on stepped ceramic substrates.

Formation of thin-film integrated circuits on stepped ceramic substrates.

We have made it possible to form thin-film integrated circuits on "stepped ceramic substrates," which eliminate the need for customer bonding processes and reduce thermal conduction loss.

This product was originally used by users who bonded two circuit boards together (after joining with solder, paste, and adhesive), and it was created with the concept of providing it as a "single integrated component." By making it a single component, (1) the user's effort and costs for joining are reduced, and (2) thermal conduction loss from joining materials has been eliminated. Furthermore, it has become possible to form thin-film integrated circuits on stepped ceramic substrates. [Application Example] The step difference between the upper and lower circuit boards is adjusted to match the thickness of the laser element, which is mounted on the lower board. This allows the top surface of the laser element and the upper circuit board to be at the same height, enabling wire bonding at the shortest distance.

  • High frequency/microwave parts
  • Fine Ceramics

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High-strength alumina substrate for thin films

High-strength alumina substrate for thin films

Ideal for thin film circuit formation! JFC's unique alumina substrate with high strength, high purity, and excellent planar smoothness.

The high-strength alumina substrates for thin films manufactured by our company feature a dense and smooth surface achieved through the use of fine and uniform raw powder, making them suitable for the formation of fine thin film circuits. Due to their high purity and bending strength, they are resistant to cracking even when the substrates are made thin, and they excel in handling, contributing to the miniaturization and thinning of the substrates. They are increasingly being adopted for temperature sensors and chip resistors.

  • High frequency/microwave parts
  • Fine Ceramics

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Composite Material MMC for Solar Cell Manufacturing Equipment

Composite Material MMC for Solar Cell Manufacturing Equipment

High thermal conductivity surpassing ceramics! Achieving low thermal expansion comparable to silicon!

By combining SiC ceramics with metallic silicon, we have achieved high thermal conductivity that surpasses ceramics and low thermal expansion comparable to silicon. Thermal conductivity that exceeds SiC and AlN! By changing the composite ratio, various properties can be realized. Surface treatment (plating) is possible, and it can also be used for electrostatic chucks. It can be made larger than ceramics. We also offer a combination of SiC and aluminum. For more details, please refer to the PDF catalog.

  • Ceramics
  • Fine Ceramics
  • Other metal materials

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High-quality alumina substrate

High-quality alumina substrate

Birth of a substrate utilizing new materials.

■Low surface roughness ■High bending strength ■Low dielectric loss ■Dense

  • Printed Circuit Board

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[Example of Use] Sensor 99.9% Alumina Substrate

[Example of Use] Sensor 99.9% Alumina Substrate

A high-purity, high-strength alumina substrate that can be made thin and resistant to cracking. Its thinness maximizes sensor performance.

A high-purity alumina substrate created from our unique ceramic thin plate manufacturing technology. Its high strength, resulting from high purity, makes it less prone to cracking and allows for thinner substrates, making it suitable for high-performance sensors.

  • Printed Circuit Board
  • Fine Ceramics
  • Other electronic parts

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Thin-film integrated circuit components

Thin-film integrated circuit components

Consistent production from low-loss ceramic substrates in the microwave band to thin film pattern formation. Providing high-quality products at low prices and short delivery times, from prototyping to mass production.

We provide thin film integrated circuit components with circuit formation on substrates that have undergone various through-hole processing and slitting. 【Features】 ○ Formation of side patterns (0.38t or more) and AuSn solder patterns ○ Simultaneous mounting of conductors, thin film resistors, and thin film inductors ○ Low loss and low noise circuit formation in high-frequency bands made possible by the combination of our unique 99.9% alumina substrate and fine patterns ○ Substrate materials: Aluminum nitride substrates (AlN substrates), quartz substrates, etc. ○ Total technology development, quality assurance, and problem-solving made possible by being a substrate manufacturer ○ We provide quality according to product functions and specifications, and we respond quickly to short delivery times and design changes. For other functions and details, please contact us.

  • Other electronic parts

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[Performance Introduction] Measures for Longevity Using Ceramics

[Performance Introduction] Measures for Longevity Using Ceramics

By changing metal parts to ceramics, significant improvements in lifespan are expected. Here are some examples of improvements.

Ceramics are lightweight materials with excellent wear resistance and corrosion resistance compared to metals, and their adoption is progressing for extending the lifespan of equipment parts and addressing wear issues. By replacing metal components of equipment with ceramics such as silicon carbide or silicon nitride, the lifespan of the parts is extended, significantly reducing maintenance work for part replacements. JFC offers a lineup of five types of silicon carbide and two types of silicon nitride. Silicon nitride SNP03 is a high-strength type with enhanced fracture toughness and bending strength compared to the standard SNP02. Please consider JFC's ceramics for the long lifespan of your equipment parts. *For more details, please download the catalog. Additionally, JFC also manufactures and sells composite materials made of ceramics and metals. For example, SA701, featured in the PDF materials, is a composite of SiC ceramics and aluminum. It is effective when a material that is resistant to cracking is required.

  • Ceramics
  • Fine Ceramics
  • Composite Materials

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[Useful Information] Alumina Alternative Composite Material SA701

[Useful Information] Alumina Alternative Composite Material SA701

To customers struggling with large alumina parts - that problem can be solved with ceramic composite materials.

With the expansion of the semiconductor manufacturing equipment market, procurement issues related to ceramics have arisen. In particular, large alumina components have limited suppliers, and extended lead times are impacting equipment development schedules. The ceramic-metal composite material SA701 has slightly lower Young's modulus and bending strength compared to alumina, but it has high fracture toughness and is less prone to cracking, making it easy to handle. Its density is about 3/4 that of alumina, and it can be machined for direct threading, eliminating the need for metal bushings and enabling weight reduction. We encourage you to consider the adoption of metal-ceramic composite materials, which excel in producing larger components compared to alumina. *For more details, please refer to the materials available for download via the PDF button. We also welcome any questions or inquiries through the contact button.*

  • Other metal materials
  • Ceramics
  • Fine Ceramics

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Lighter than aluminum, with the rigidity of steel - the birth of Super Material SA001.

Lighter than aluminum, with the rigidity of steel - the birth of Super Material SA001.

The silicon/aluminum composite material SA001, created by our unique composite technology, is lighter than aluminum and has the Young's modulus of cast iron, while also accommodating hollow structures through bonding technology.

We have developed a composite material SA001 made of metallic silicon and aluminum. This super material is lighter than aluminum, has a higher Young's modulus than cast iron, and boasts a specific stiffness that is twice that of aluminum. Thanks to our joining technology, it can also accommodate hollow structures and built-in flow paths. ● Adoption achievements: Parts for high-precision 3D measuring machines, parts for semiconductor manufacturing equipment ● Application proposal: Temperature control plates for electrostatic chucks * By changing the material from aluminum to SA001, we can resolve the thermal expansion difference issue with alumina ESC.

  • Other metal materials
  • aluminum
  • Composite Materials

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[Design Examples and Technical Introduction] High-Frequency Solutions

[Design Examples and Technical Introduction] High-Frequency Solutions

Providing circuit boards with high simulation reproducibility by combining low dielectric loss alumina substrate manufacturing technology, high-precision patterning technology, and design and evaluation techniques.

In the millimeter wave and terahertz wave regions used in Beyond 5G (6G), low-loss substrate characteristics and fine patterning technology are required. In addition to the manufacturing technology of low dielectric loss ceramic substrates that we have cultivated over many years, high-precision patterning technology, and design technology that meets customer requests, we have also become capable of simulation and measurement at high frequencies. As a result, we can provide high-frequency circuit substrates with high reproducibility in simulations. Please feel free to consult us with any requests or questions, such as "I want this kind of passive component." We will solve problems with our technological development capabilities and comprehensive strength that only a substrate manufacturer can provide.

  • High frequency/microwave parts

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