We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for substrate.
ipros is IPROS GMS ・ IPROS One of the largest technical database sites in Japan that collects information on.

substrate(IGBT) - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Last Updated： Aggregation Period:Jul 15, 2026～Aug 11, 2026
This ranking is based on the number of page views on our site.

substrate Product List

1～15 item / All 15 items

Displayed results
Ceramic substrate (alumina, aluminum nitride)

Ceramic substrate (alumina, aluminum nitride)

Alumina (Al2O3) and aluminum nitride (AlN) compatible. High thermal conductivity substrate for IGBT and power devices.

We provide ceramic substrates for power devices and IGBT applications that require high heat dissipation and high insulation. We offer two types: alumina (Al2O3, thermal conductivity ≧ 24W/m·K) and aluminum nitride (AlN, thermal conductivity ≧ 170W/m·K). Our products support DPC (operating temperature -55 to 350℃) and DBC (-55 to 800℃), with high-precision processing capabilities for maximum dimensions of 128×178mm, minimum pattern width of 0.100mm/pattern spacing of 0.075mm, and minimum hole diameter of 0.1mm.

  • Circuit board design and manufacturing
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Metal matrix composite substrate Baseplate

Metal matrix composite substrate Baseplate

High thermal conductivity, low expansion, high rigidity, strong bonding, good weldability.

AlSiC substrates are widely used in equipment equipped with high-power IGBT modules due to their excellent thermodynamic and mechanical properties.

  • Other metal materials
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Bus bar (bus bar) high current substrate

Bus bar (bus bar) high current substrate

By substrate-izing the busbar, high insulation and compactness are achieved!

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and a compact, lightweight design. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization offers the following benefits: - Mounting of power devices such as IGBTs and SiCs on the substrate. - After substrate mounting, installation into equipment is possible, leading to reduced assembly time and prevention of miswiring. - Space-saving due to simplified substrate and wiring, resulting in overall equipment miniaturization. - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

  • kyoei_A4_大電流基盤_1.png
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm]

Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm]

By substrate-izing busbars and coils used for high current applications, high insulation properties and a reduction in labor hours are achieved!

We have substrate-mounted busbars and coils used for high current applications in the heavy electrical and automotive industries. By substrate mounting, the following effects can be expected: - Substrate mounting of power devices such as IGBTs and SiCs - Installation on equipment after substrate mounting → Reduction of assembly work and prevention of miswiring - Space-saving due to substrate mounting and simplification of wiring → Miniaturization of the entire device - Generally, a thick copper substrate refers to a substrate with a copper foil thickness of 200μ (0.2mm) or more, but we have also achieved substrate mounting with 3000μ (3mm) copper plates. - The greatest advantage of substrate mounting is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, so there is no concern about variation in thickness like with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

  • img02.jpg
  • img09.jpg
  • img11.jpg
  • IPROS10697054468954836760.jpeg
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Metal-based heat dissipation substrate with low thermal expansion coefficient

Metal-based heat dissipation substrate with low thermal expansion coefficient

For the electrical wiring in the engine room and the gasoline tank meter! Compared to glass epoxy substrates, it has a lower coefficient of thermal expansion and stronger resistance to heat.

The "metal-based heat dissipation substrate" is a substrate that improves heat dissipation through thermal conduction, alleviating thermal issues. There are applications in high-brightness LED lighting (for vehicles and floodlights), as well as in automotive electrical components, ECUs, EPS, and DC/DC converters. Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat. 【Features】 ■ A substrate that improves heat dissipation through thermal conduction by using metal as the base ■ Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat *For more details, please refer to the PDF materials or feel free to contact us.

  • 2021-05-10_11h12_04.png
  • 2021-05-10_11h12_09.png
  • 2021-05-10_11h12_12.png
  • Wiring materials
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Special Printed Circuit Board "Metal Substrate"

Special Printed Circuit Board "Metal Substrate"

Metal materials can be selected from aluminum and copper! Utilizing thermal conductivity to enhance thermal diffusion.

A "metal substrate" is a printed circuit board that enhances thermal diffusion by utilizing the thermal conductivity of metal. Metal materials can be selected from aluminum or copper, and when using a copper core substrate, through-hole conduction with the copper core is also possible, allowing for applications such as ground and thermal conduction through-holes. As a common heat dissipation method, metal base substrates dissipate heat through the base metal on the back via heat sinks or enclosures, while metal core substrates can be mounted on the circuit side of the board or machined to expose the base metal, allowing contact with heat sinks or enclosures for heat dissipation. 【Features】 ■ Enhances thermal diffusion by utilizing the thermal conductivity of metal ■ Two types: metal base substrate and metal core substrate ■ Metal materials can be selected from aluminum or copper ■ Through-hole conduction with the copper core is possible when using a copper core substrate *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • others
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Printed circuit board, metal substrate

Printed circuit board, metal substrate

Metal core substrate with excellent heat dissipation and heat resistance.

By machining the substrate to expose the metal core and directly mounting heat dissipation components such as heat sinks, it is possible to efficiently release the heat from components that operate at high temperatures to the outside.

  • Printed Circuit Board
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Thick copper busbar substrate and coil substrate for electric vehicles

Thick copper busbar substrate and coil substrate for electric vehicles

Contributing to the miniaturization of devices! Proven performance exceeding 100A, achieving high insulation and reduced labor for high current applications.

In the high-power supply of the electric vehicle industry, components that can safely and efficiently transmit large currents are required. In particular, reliable connections to power devices and placement within limited space significantly impact the overall performance and design flexibility of the vehicle. Improper wiring or insufficient insulation can lead to performance degradation and safety issues. Our thick copper busbar substrates and coil substrates address these challenges by substrate-mounting busbars and coils used in high-current applications. 【Usage Scenarios】 - Inverters, converters, and charging systems for electric vehicles - High-power battery systems - Power control units 【Benefits of Implementation】 - Substrate mounting of power devices such as IGBTs and SiCs - Reduction of assembly labor and prevention of miswiring - Miniaturization of the entire device

  • img02.jpg
  • img09.jpg
  • img11.jpg
  • IPROS10697054468954836760.jpeg
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Thick copper busbar substrates and coil substrates for ships.

Thick copper busbar substrates and coil substrates for ships.

Contributing to the control of ship propulsion! Improving reliability and efficiency through substrate technology for high current applications.

In ship propulsion control systems, the reliability and efficiency of components handling high currents are essential. In particular, complex wiring and high-voltage control can lead to issues such as miswiring troubles and space constraints. To address these challenges, by integrating busbars and coils into a substrate, we can achieve high insulation and simplify wiring, contributing to the construction of a safe and efficient propulsion control system. 【Application Scenarios】 - Consolidation of high-current circuits in propulsion control systems - Implementation of power devices (IGBT, SiC, etc.) - Effective utilization of onboard space 【Benefits of Implementation】 - Reduction in assembly labor and risk of miswiring - Space-saving and miniaturization of the entire device - Improved reliability due to high insulation performance

  • img02.jpg
  • img09.jpg
  • img11.jpg
  • IPROS10697054468954836760.jpeg
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Thick copper busbar substrate and coil substrate for data centers

Thick copper busbar substrate and coil substrate for data centers

Contributing to the improvement of cooling efficiency in data centers! Achieving space-saving through substrate design for high current applications.

In data centers, the stable operation of equipment and the maintenance of cooling efficiency are prioritized. Particularly in areas where large currents flow, heat suppression and safety assurance are required. Conventional busbars and coils face challenges in securing wiring space and insulation processing, which can impact the overall cooling efficiency of the equipment. Our thick copper busbar substrates and coil substrates address these issues by simplifying wiring through substrate integration and providing high insulation performance, contributing to space-saving and improved cooling efficiency in data centers. 【Usage Scenarios】 - High current wiring within server racks - High current transmission in cooling systems - Wiring around power supply units 【Benefits of Implementation】 - Reduction of installation space due to overall equipment miniaturization - Increased efficiency in assembly work through reduced wiring labor and prevention of miswiring - Enhanced safety due to high insulation performance - Assurance of reliability through a consistent insulation layer thickness

  • img02.jpg
  • img09.jpg
  • img11.jpg
  • IPROS10697054468954836760.jpeg
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Busbar for Data Centers - High Current Board

Busbar for Data Centers - High Current Board

A substrate for data centers that achieves high insulation properties and miniaturization.

In data center power supply systems, stable power supply and space-saving are required. Especially as density increases, improving power supply efficiency and addressing heat generation are crucial. The reliability of busbars is directly linked to the stable operation of the system, making high insulation and secure connections essential. Our busbars (bus bars) for high current substrates address these challenges. 【Usage Scenarios】 - Power units for data centers - Power supply within server racks - Power systems requiring high-density mounting 【Benefits of Implementation】 - Improved safety due to high insulation - Enhanced system efficiency through space-saving - Reduced assembly labor and prevention of wiring errors - Miniaturization of the entire device

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Search Keywords Related to substrate

IPROS Services
COPYRIGHT © 2001-2026 IPROS CORPORATION ALL RIGHTS RESERVED.