Single crystal super high thermal conductivity diamond substrate
Highest grade thermal conductivity
High-output electronic devices, laser systems, heat dissipation management, etc.
- Company:Semi Next 本社、三重事業所
- Price:Other
Last Updated: Aggregation Period:Aug 27, 2025~Sep 23, 2025
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Aug 27, 2025~Sep 23, 2025
This ranking is based on the number of page views on our site.
Last Updated: Aggregation Period:Aug 27, 2025~Sep 23, 2025
This ranking is based on the number of page views on our site.
1786~1800 item / All 1848 items
Highest grade thermal conductivity
High-output electronic devices, laser systems, heat dissipation management, etc.
World Market for Flexible Circuit Boards: Single-Sided Boards, Double-Sided Boards, Curved Boards, Multi-Layer Boards, Rigid-Flex Boards, Electronics, Automotive, Medical Devices ...
This research report (Global Flexible Circuit Board Market) investigates and analyzes the current state and outlook for the global flexible circuit board market over the next five years. It includes information on the overview of the global flexible circuit board market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the flexible circuit board market include single-sided boards, double-sided boards, curved boards, multilayer boards, and rigid-flex boards, while the segments by application cover electronics, automotive, medical devices, telecommunications, and aerospace & defense. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of flexible circuit boards. It also includes the market share of major companies in the flexible circuit board sector, product and business overviews, and sales performance.
World Market for Alumina DBC (DBC Substrates): Alumina 96%, Others, Power Electronics, Automotive Electronics, Home Appliances & C ...
This research report (Global Alumina DBC (Direct Bond Copper Substrate)) investigates and analyzes the current state and future outlook of the global alumina DBC (DBC substrate) market over the next five years. It includes information on the overview of the global alumina DBC (DBC substrate) market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type for alumina DBC (DBC substrate) focus on alumina 96% and others, while the segments by application cover power electronics, automotive electronics, home appliances & CPV, aerospace & others. The regional segments calculate the market size of alumina DBC (DBC substrate) by dividing it into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the alumina DBC (DBC substrate) sector, product and business overviews, and sales performance.
World Market for Aluminum Nitride Substrates: Molded Products, Laser Marking, High-Power Switches, Motor Control, UV Laser Diodes ...
This research report (Global Aluminum Nitride Substrate Market) investigates and analyzes the current status and outlook for the global aluminum nitride substrate market over the next five years. It includes information on the overview of the global aluminum nitride substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include molded products and laser marking, while the segments by application cover high-power switches, motor control, UV laser diodes, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of aluminum nitride substrates. It also includes the market share of major companies in the aluminum nitride substrate sector, product and business overviews, and sales performance.
World Market for Gallium Nitride (GaN) Substrates: Sapphire on GaN, Si on GaN, SiC on GaN, GaN on GaN, Others, ...
This research report (Global Gallium Nitride (GaN) Substrates Market) investigates and analyzes the current status and outlook for the global market of gallium nitride (GaN) substrates over the next five years. It includes information on the overview of the global gallium nitride (GaN) substrates market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the gallium nitride (GaN) substrates market include Sapphire on GaN, Si on GaN, SiC on GaN, GaN on GaN, and others, while the segments by application cover medical, automotive, consumer electronics, general lighting, and military/defense. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of gallium nitride (GaN) substrates. The report also includes the market share of major companies in the gallium nitride (GaN) substrates market, product and business overviews, and sales performance.
World Market for Semi-Insulating SiC Substrates: 2-inch and 3-inch SiC Substrates, 4-inch SiC Substrates, 6-inch SiC Substrates, IT & Consumer, LE ...
This research report (Global Semi-insulating SiC Substrates Market) investigates and analyzes the current status and outlook for the global market of semi-insulating SiC substrates over the next five years. It includes information on the overview of the global semi-insulating SiC substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semi-insulating SiC substrate market focus on 2-inch and 3-inch SiC substrates, 4-inch SiC substrates, and 6-inch SiC substrates, while the segments by application target IT & consumer, LED lighting, automotive, and industrial sectors. The regional segments calculate the market size of semi-insulating SiC substrates by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the semi-insulating SiC substrate market, product and business overviews, and sales performance.
World Market for PCBs (Printed Circuit Boards): Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Electronics Industry, Intelligent Control Devices
This research report (Global PCB (Printed Circuit Board) Market) investigates and analyzes the current state of the global PCB (Printed Circuit Board) market and its outlook for the next five years. It includes information on the overview of the global PCB market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the PCB market by type include single-sided boards, double-sided boards, and multi-layer boards, while the segments by application focus on the electronics industry and intelligent control devices. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of PCBs. It also includes the market share of major companies in the PCB market, product and business overviews, and sales performance.
World Market for Direct Bonding Copper (DBC) Substrates: Alumina (Al2O3), Aluminum Nitride (AlN), Beryllia (BeO), Home Appliances, Communication ...
This research report (Global Direct Bonding Copper (DBC) Substrate Market) investigates and analyzes the current status and outlook for the global market of Direct Bonding Copper (DBC) substrates over the next five years. It includes information on the overview of the global Direct Bonding Copper (DBC) substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the Direct Bonding Copper (DBC) substrate market by type include alumina (Al2O3), aluminum nitride (AlN), and beryllium oxide (BeO), while the segments by application cover home appliances, telecommunications, industrial, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of Direct Bonding Copper (DBC) substrates. It also includes the market share of major companies in the Direct Bonding Copper (DBC) substrate market, product and business overviews, and sales performance.
World Market for Sapphire Composite Substrates: C-Plane Sapphire Substrates, R/M-Plane Sapphire Substrates, Patterned Sapphire Substrates ...
This research report (Global Sapphire Compound Substrate Market) investigates and analyzes the current state and outlook for the global sapphire compound substrate market over the next five years. It includes information on the overview of the global sapphire compound substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the sapphire compound substrate market include C-Plane sapphire substrates, R/M-Plane sapphire substrates, and patterned sapphire substrates, while the segments by application include LED, RFIC, laser diodes, silicon-on-sapphire (SoS) ICs, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of sapphire compound substrates. It also includes the market share of major companies in the sapphire compound substrate market, product and business overviews, and sales performance.
World Market for SERS Substrates: Gold, Silver, Others, Biotechnology/Pharmaceuticals, Chemical Industry, Food Industry, Others
This research report (Global SERS Substrate Market) investigates and analyzes the current state and outlook for the global SERS substrate market over the next five years. It includes information on the overview of the global SERS substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the SERS substrate market focus on gold, silver, and others, while the segments by application cover biology & pharmaceuticals, chemical industry, food industry, and others. The regional segments calculate the market size of SERS substrates by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the SERS substrate market, product and business overviews, and sales performance.
Global Market for Semiconductor and IC Packaging Materials: Organic Substrates, Bonding Wires, Lead Frames, Ceramic Packages, Automotive Industry ...
This research report (Global Semiconductor & IC Packaging Materials Mark) investigates and analyzes the current state and future outlook of the global semiconductor and IC packaging materials market over the next five years. It includes information on the overview of the global semiconductor and IC packaging materials market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semiconductor and IC packaging materials market include organic substrates, bonding wires, lead frames, and ceramic packages, while the segments by application cover the automotive industry, electronics industry, telecommunications, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of semiconductor and IC packaging materials. It also includes the market share of major companies in semiconductor and IC packaging materials, product and business overviews, and sales performance.
World Market for Single-Sided Printed Circuit Boards: Glass Fiber, Metal, Ceramics, Others, Computers, Phones, Faxes, Automotive Electronics, Others
This research report (Global Single Sided Printed Circuit Board Market) investigates and analyzes the current state and outlook for the global market of single-sided printed circuit boards over the next five years. It includes information on the overview of the global single-sided printed circuit board market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the single-sided printed circuit board market focus on glass fiber, metal, ceramics, and others, while the segments by application cover computers, phones, faxes, automotive electronics, and others. The regional segments calculate the market size of single-sided printed circuit boards by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. The report also includes the market share of major companies in the single-sided printed circuit board market, product and business overviews, and sales performance.
We respond to the various needs for printed circuit boards required in the development of electronic components and the production process!
We would like to introduce our "Printed Circuit Boards for Electronic Component Evaluation." We can offer various printed circuit boards required at each stage of the engineering chain and value chain for electronic component manufacturers. We provide a seamless service for all tasks related to printed circuit board development. With the LDI process, both patterns and solder resist (SR) can be finished with high precision. 【Benefits for Customers】 ■ We can provide a seamless service for all tasks related to printed circuit board development. ■ The LDI (Laser Direct Imaging) process allows for high-precision finishing of both patterns and solder resist (SR). ■ There is no concept of end-of-life (EOL) due to the absence of original artwork, film plates, and screen plates, allowing for orders to be placed at any time. *For more details, please download the PDF or feel free to contact us.
Achieving short delivery times! Smooth flow from pattern design to circuit board manufacturing to assembly.
Our company offers pattern design focused on the manufacturing of printed circuit boards. We achieve short delivery times through simultaneous parallel design. We have approximately 10,000 design achievements ranging from communication and measurement equipment to space and defense products. Furthermore, all designers hold first and second-class qualifications as printed circuit board manufacturing technicians and can propose analyses through various simulations. 【Features】 ■ Short delivery times ■ Abundant track record ■ Pattern design considering board quality and assembly quality ■ Design quality check system through the introduction of proprietary verification tools ■ All designers hold qualifications as printed circuit board manufacturing technicians An article about our company has been published in MONOist. 【How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing a cumulative 480 hours over three years】 https://monoist.atmarkit.co.jp/mn/articles/2011/04/news050.html *For more details, please refer to the PDF document or feel free to contact us.
Printed Circuit Board: Introducing OKI Circuit Technology's custom printed circuit boards.
This document is a catalog of "various custom printed circuit boards" handled by OKI Circuit Technology Co., Ltd., which develops, designs, and manufactures printed circuit boards. We introduce various custom printed circuit boards, including "copper coin (heat dissipation structure) printed circuit boards" embedded with copper coins for efficient heat dissipation from heat-generating parts, "high current, high voltage, and high heat dissipation compatible printed circuit boards" for applications requiring high current and voltage, and "high-speed, large-capacity transmission compatible printed circuit boards" supporting high-speed transmission of 25 to 400 Gbps. [Contents] ■ Copper coin (heat dissipation structure) printed circuit boards ■ High current, high voltage, high heat dissipation specification printed circuit boards ■ High-speed, large-capacity transmission printed circuit boards ■ High-density component compatible printed circuit boards ■ High-density build-up printed circuit boards ■ Flex-rigid printed circuit boards ■ Composite board thickness printed circuit boards (T-SEC-Board) An article from our company has been published in MONOist. [How we advanced smart manufacturing in a small-lot, diverse-product factory, reducing cumulative hours by 480 over three years] https://monoist.atmarkit.co. *For more details, please download the PDF or feel free to contact us.