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Printed circuit board with enhanced heat dissipation and heat resistance.
There are two types of printed circuit boards that enhance heat dissipation and heat resistance: a metal base substrate with circuits formed on a metal plate, and a metal core substrate with a metal plate sandwiched inside the substrate. The metal materials can be selected from aluminum, copper, and others.
A high-current board that can minimize current loss compared to the design value!
The substrate is a high-current board that allows for the selection of circuit formation methods based on conductor thickness. If the conductor thickness is 300μm or more, half-etching can be accommodated. This method can reduce the top and bottom widths of the pattern compared to conventional etching methods, minimizing current loss relative to design values. 【Features】 ■ Selection of circuit formation methods based on conductor thickness ■ Half-etching can be accommodated with a conductor thickness of 300μm or more ■ Ability to reduce the top and bottom widths of the pattern ■ Minimal current loss relative to design values *For more details, please refer to the catalog or feel free to contact us.
High heat dissipation aluminum heat sink substrate with an integrated structure of aluminum base substrate and heat sink.
The "Aluminum Heat Sink Substrate" is a substrate that layers a high thermal conductivity insulating layer and circuits onto extruded aluminum heat sink material. It features surface roughening effects and weather resistance due to anodizing treatment, securing more than five times the surface area compared to conventional products. By combining with high thermal conductivity resin, it offers heat dissipation specifications that far exceed those of conventional products. There is absolutely no thermal transport loss, unlike retrofitted heat sinks. It also enables cost reduction in assembly due to its integrated structure, leading to a decrease in total costs. 【Features】 ■ Significantly improved heat dissipation characteristics ■ No thermal transport loss ■ Increased design flexibility for fins ■ Increased design flexibility for enclosures ■ Reduction in assembly costs ■ No need for material procurement *For more details, please refer to the PDF document or feel free to contact us.
It is possible to handle large currents on the printed circuit board due to the thick copper pattern!
The "Thick Copper Substrate" enables the realization of circuits with copper thicknesses up to 2000μm, making it possible to handle large currents. It is highly effective for miniaturizing devices with high loads. Additionally, due to its excellent thermal characteristics, it can also be used as a substrate that has a GND function while excelling in thermal diffusion. Furthermore, by stacking the conventional external bus bar as an inner layer circuit, EMI control becomes easier, reducing noise interference with peripheral devices. It frees you from three-dimensional wiring, reduces bus bar processing costs and assembly costs, and achieves space-saving. 【Features】 ■ Enables handling of large currents on printed circuit boards with thick copper patterns ■ Achieves a circuit thickness of 2000μm ■ Ideal for mounting power devices ■ Patent obtained *For more details, please refer to the PDF document or feel free to contact us.
大電流への対応を可能とした厚銅基板
一般的なプリント基板の回路厚が35μmであるのに対し、2000μmまでの厚銅による回路を実現することにより、大電流への対応を可能とした厚銅基板です。 通常のエッチング工程による回路形成の場合、回路断面は“台型”をしていますが、弊社の大電流基板は“そろばん型”をしているのを特徴としており、 設計値に対してトップ寸法と断面積をより広く確保できます。
Metal core substrate with excellent heat dissipation and heat resistance.
By machining the substrate to expose the metal core and directly mounting heat dissipation components such as heat sinks, it is possible to efficiently release the heat from components that operate at high temperatures to the outside.
Similar to metal base substrates, layer configurations such as 2-layer and 4-layer can also be produced.
The thickness, height, pitch, and shape of the fins can be ordered freely. Additionally, depending on the specifications of the parts, the type of insulation layer can be selected. 1.8W: 3W: 6.5W: 12W → Please select from four types. (FR-5 is also possible.) Both sides of the circuit section can be multilayered and support high current. (It is also possible to combine with high current boards using our patented method.) We also support mass production and component mounting.
Glass substrate
【Features】 The glass substrate not only has excellent transparency but also exhibits minimal warping and dimensional changes, resulting in superior flatness. It has high stability in material coefficients such as dielectric constant, excellent chemical resistance and heat dissipation, and is a cost-effective and easy-to-handle product that offers high precision and performance compared to ceramic substrates. Additionally, by using thin-film metal formation technology for circuit formation, not only the substrate but also the circuit itself achieves high smoothness, making it optimal for high-frequency signal transmission. For these reasons, our company believes that glass substrates are the leading candidates for next-generation high-performance substrates. 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓 For more details, please refer to "Contact Us" and "Catalog Download." 〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓〓
Industry first! We can manufacture bendable metal substrates!
Curved lighting substrates, LED lighting, and light source substrates that match the casing and design are optimal. It is possible to bend a single substrate to fit the curves of automotive and scooter turn signals and tail lamps. The basic specifications as a heat dissipation substrate are equivalent to those of standard aluminum substrates, with the added performance of being bendable, making it the latest metal substrate.
This is a high heat dissipation, high insulation metal substrate that achieves "thin film high insulation" by applying a 20μ thick layer of Nippon Paint's "Insulid" using ED electrophoretic coating.
Insulreed is applied to the base metal plate during the bath to form an electroplated coating, creating an insulation layer. The 20μ thick Insulreed insulation layer has an insulation performance of over 5kV and is the highest specification resin layer for thin film high insulation. On top of the insulation layer, circuits can be low-temperature fired with a highly conductive paste, allowing all processes to be completed through printing. Since it does not require treatment with strong acids or strong alkalis involved in substrate manufacturing, it is possible to directly print circuits onto die-cast molded products or heat sinks exceeding 200mm in height as an integrated heat dissipation substrate. As everything is manufactured using printing methods, it is also an eco-friendly substrate that is gentle on the environment.
A DBC alternative substrate ideal for applications such as power device circuit boards and high-brightness LED boards!
The substrate is a metal base substrate made of high heat-resistant and high thermal conductivity resin. It is mainly used for power device circuit substrates and high-brightness LED substrates. The substrate consists of copper foil with a thickness of 18μm to 800μm, an insulating layer, and a base metal. 【Features】 ■ Uses high heat-resistant and high thermal conductivity resin ■ Suitable for power devices *For more details, please refer to the catalog or feel free to contact us.
Metal materials can be selected from aluminum and copper! Utilizing thermal conductivity to enhance thermal diffusion.
A "metal substrate" is a printed circuit board that enhances thermal diffusion by utilizing the thermal conductivity of metal. Metal materials can be selected from aluminum or copper, and when using a copper core substrate, through-hole conduction with the copper core is also possible, allowing for applications such as ground and thermal conduction through-holes. As a common heat dissipation method, metal base substrates dissipate heat through the base metal on the back via heat sinks or enclosures, while metal core substrates can be mounted on the circuit side of the board or machined to expose the base metal, allowing contact with heat sinks or enclosures for heat dissipation. 【Features】 ■ Enhances thermal diffusion by utilizing the thermal conductivity of metal ■ Two types: metal base substrate and metal core substrate ■ Metal materials can be selected from aluminum or copper ■ Through-hole conduction with the copper core is possible when using a copper core substrate *For more details, please refer to the PDF document or feel free to contact us.
We will solve all the problems related to the decrease in reflectivity due to aging degradation and countermeasures against sulfide!
The "Mirror Surface Cavity Substrate" is a substrate that achieves sulfurization countermeasures and high reflectivity. It eliminates the need for silver plating, preventing the occurrence of reflectivity reduction due to sulfurization. Furthermore, the circuit improves bonding performance through gold plating, achieving a stable reflectivity of 95%. 【Features】 ■ Achieves sulfurization countermeasures and high reflectivity ■ No need for silver plating ■ No occurrence of reflectivity reduction due to sulfurization ■ Improved bonding performance through gold plating in the circuit ■ Stable reflectivity of 95% *For more details, please refer to the PDF document or feel free to contact us.
Low thermal expansion iron-based substrates can be manufactured! We support everything from quick-turn prototypes to mass production.
The "iron-based substrate" is an optimal substrate for preventing solder cracks in ceramic packages and other applications due to its low thermal expansion. Iron-based substrates with low thermal expansion can be manufactured. The metal part features an 8μ high thermal conductivity resin coating on both sides, significantly improving voltage resistance and rust prevention. We can accommodate everything from short lead-time prototypes to mass production, so please feel free to contact us. 【Features】 ■ Iron-based substrates with low thermal expansion can be manufactured ■ Insulation layer: Thermal conductivity 2W/mk ■ Base metal: Iron PCM (pre-coated metal) adopted ■ Ideal for preventing solder cracks in ceramic packages and other applications ■ Support from short lead-time prototypes to mass production *For more details, please refer to the PDF document or feel free to contact us.
