A DBC alternative substrate ideal for applications such as power device circuit boards and high-brightness LED boards!
The substrate is a metal base substrate made of high heat-resistant and high thermal conductivity resin. It is mainly used for power device circuit substrates and high-brightness LED substrates. The substrate consists of copper foil with a thickness of 18μm to 800μm, an insulating layer, and a base metal. 【Features】 ■ Uses high heat-resistant and high thermal conductivity resin ■ Suitable for power devices *For more details, please refer to the catalog or feel free to contact us.
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basic information
【Board Specifications (General Specifications)】 ■ Copper Foil ・Thickness: 18μm to 800μm ■ Insulation Layer ・Thermal Conductivity: 5W/m·k, Thickness: 75μm ・Thermal Conductivity: 10W/m·k, Thickness: 120μm ・Thermal Conductivity: ※15W/m·k, Thickness: 120μm ■ Base Metal ・Thickness: 0.3mm to 3.0mm ※For more details, please refer to the catalog or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Power device circuit boards ■ High-brightness LED boards, etc. *For more details, please refer to the catalog or feel free to contact us.
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Company information
TSS Corporation has been pursuing heat management substrate technology for over twenty years, counting from its predecessor company. Furthermore, we have incorporated element technologies such as product development technology, thermal design, and evaluation technology to create a unique business model. We have achieved remarkable results, particularly in the growing fields of LED-related and power electronics-related sectors. TSS aims to be the top brand in heat management substrates through our unique technology, and we aspire to continue growing together with our customers while contributing to the growth of the electronics industry in our country.