Substrate "High Current Substrate (Thick Copper Circuit Substrate)"
A high-current board that can minimize current loss compared to the design value!
The substrate is a high-current board that allows for the selection of circuit formation methods based on conductor thickness. If the conductor thickness is 300μm or more, half-etching can be accommodated. This method can reduce the top and bottom widths of the pattern compared to conventional etching methods, minimizing current loss relative to design values. 【Features】 ■ Selection of circuit formation methods based on conductor thickness ■ Half-etching can be accommodated with a conductor thickness of 300μm or more ■ Ability to reduce the top and bottom widths of the pattern ■ Minimal current loss relative to design values *For more details, please refer to the catalog or feel free to contact us.
- Company：ＴＳＳ
- Price：Other
