Metal materials can be selected from aluminum and copper! Utilizing thermal conductivity to enhance thermal diffusion.
A "metal substrate" is a printed circuit board that enhances thermal diffusion by utilizing the thermal conductivity of metal. Metal materials can be selected from aluminum or copper, and when using a copper core substrate, through-hole conduction with the copper core is also possible, allowing for applications such as ground and thermal conduction through-holes. As a common heat dissipation method, metal base substrates dissipate heat through the base metal on the back via heat sinks or enclosures, while metal core substrates can be mounted on the circuit side of the board or machined to expose the base metal, allowing contact with heat sinks or enclosures for heat dissipation. 【Features】 ■ Enhances thermal diffusion by utilizing the thermal conductivity of metal ■ Two types: metal base substrate and metal core substrate ■ Metal materials can be selected from aluminum or copper ■ Through-hole conduction with the copper core is possible when using a copper core substrate *For more details, please refer to the PDF document or feel free to contact us.
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【Applications and Use Cases】 ■ As a printed circuit board for heat dissipation measures for traffic lights and outdoor displays ■ Extracting performance beyond the rated current of high-brightness LEDs and power devices ■ Reliability measures for electronic components due to heat ■ EMI countermeasures utilizing the shielding properties of metals ■ Alternative to ceramic substrates focusing on cost and impact resistance ■ Electronic control in high-temperature environments in conjunction with cooling units ■ Heat dissipation measures for power devices with high heat generation, such as IGBTs and power MOSFETs, and reliability measures for electronic components due to heat ■ Reduction of assembly costs and space-saving through integrated busbars (copper core substrates) ■ Low capacitance and large current electromagnetic field control through microstrip structures (copper core substrates) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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TSS Corporation has been pursuing heat management substrate technology for over twenty years, counting from its predecessor company. Furthermore, we have incorporated element technologies such as product development technology, thermal design, and evaluation technology to create a unique business model. We have achieved remarkable results, particularly in the growing fields of LED-related and power electronics-related sectors. TSS aims to be the top brand in heat management substrates through our unique technology, and we aspire to continue growing together with our customers while contributing to the growth of the electronics industry in our country.