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substrateの製品一覧

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Impedance control compatible board

Impedance control compatible board

We propose appropriate line widths, clearances, and layer configurations during pattern design!

We would like to introduce the "Impedance Control Compatible Boards" handled by Matsuwa Sangyo Co., Ltd. In recent years, there has been a significant increase in the demand for boards that require impedance control for the purpose of stabilizing signal quality and reducing noise due to high-speed communication in circuits. With our extensive manufacturing experience and achievements cultivated over many years, we support various impedance simulations such as characteristic, differential, common, and coplanar, as well as TDR measurements, and we propose appropriate line widths, clearances, and layer configurations during pattern design. 【Features】 ■ Supports various impedance simulations including characteristic, differential, common, and coplanar, as well as TDR measurements ■ Proposes appropriate line widths, clearances, and layer configurations during pattern design *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

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Rigid-flexible substrate

Rigid-flexible substrate

The flexible parts can be multilayered, and there are also specifications for the rigid parts that are multilayered or have a build-up structure!

We would like to introduce the "Rigid Flexible Circuit Board" handled by Matsuwa Sangyo Co., Ltd. This board integrates rigid and flexible circuit boards and is also referred to as rigid flex or rigid FPC. Our product not only combines the features of rigid and flexible circuit boards but also eliminates the need for connectors in the interconnection between boards, making it effective for lightweight, compact, and three-dimensional assembly and wiring. 【Example Specifications for Flexible Circuit Board Manufacturing (Excerpt)】 ■ Base Material Thickness: 25μm, 50μm ■ Copper Foil Thickness: 18μm, 35μm ■ Copper Foil Types: Rolled Copper Foil, Special Electrolytic Copper Foil ■ Coverlay Color: Amber ■ Resist Color: Amber, Green, Black, White *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Thick copper substrate

Thick copper substrate

By increasing the finished copper thickness to around 210μm, it can also accommodate high current circuits!

We would like to introduce the "thick copper substrate" handled by Matsuwa Sangyo Co., Ltd. The typical copper foil thickness for printed circuit boards is 18μm or 35μm, but by increasing the finished copper thickness to about 210μm, it can accommodate high current circuits. In recent years, thick copper substrates (high current substrates) have been increasingly required, particularly for automotive and power electronics applications, and the demand is growing. [Example of Thick Copper Substrate Manufacturing Specifications] ■ Copper foil thickness: 70μm, 105μm, 140μm, 175μm (excluding copper foil thickness below 35μm) ■ Finished copper thickness after plating: can be 210μm or more *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Copper inlay substrate

Copper inlay substrate

By directly contacting heat-generating components with copper, which has a high thermal conductivity, excellent heat dissipation is achieved!

We would like to introduce the "Copper Inlay Substrate" handled by Matsuwa Sangyo Co., Ltd. This substrate is designed to partially improve heat dissipation characteristics by using copper pins pressed directly under heat-generating components. By making direct contact with heat-generating components, it achieves high heat dissipation due to the high thermal conductivity of copper. Compared to metal-based substrates, it can reduce weight, and it is also advantageous that the existing layer structure of substrates can be applied as is. 【Features】 ■ A substrate aimed at partially improving heat dissipation characteristics ■ Achieves high heat dissipation by making direct contact with heat-generating components using high thermal conductivity copper ■ Reduces weight compared to metal-based substrates ■ Existing layer structures of substrates can be applied as is *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Copper bump substrate

Copper bump substrate

Effective when it is required to make contact between the substrate pad and mounted components at a high position!

We would like to introduce the "copper bump substrate" handled by Matsuwa Sangyo Co., Ltd. Thanks to a special plating method, it is possible to form bumps of approximately 30 to 100 μm in the necessary areas of the pattern. This is effective in cases where it is required to make contact between the substrate pad and mounted components at a high position. 【Copper Bump Substrate Manufacturing Specifications Example】 ■Bump Diameter/Bump Size: φ0.4mm/0.3mm×0.25mm ■Bump Height: 100μm *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Release the heat - Matsuwa's heat dissipation board

Release the heat - Matsuwa's heat dissipation board

Hot summer. Matsuwa's circuit boards are super COOL! Thick copper, metal, copper inlay boards, etc. For heat dissipation boards, please consult Matsuwa Industries.

Matsuwa Industries, renowned for its top-notch short delivery times in domestic printed circuit board manufacturing, offers a variety of heat dissipation boards with quick turnaround times. We pride ourselves on our flexibility, with a minimum order quantity starting from just one piece. If you have any issues related to heat dissipation boards, please feel free to consult us. 【Examples of Heat Dissipation Board Manufacturing】 - Thick copper boards (maximum copper thickness of 500µm) - Aluminum and copper base boards - Copper core boards - Copper inlay boards - Conductive paste resin-filled boards - High thermal conductivity materials - Ceramic boards - Thick copper FPC 【Examples of Short Delivery Manufacturing】 - Aluminum base boards: as fast as 2 days (standard 4 days and up) *For detailed services, please refer to the catalog available for download below.

  • Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Heat dissipation substrate

Heat dissipation substrate

Cool down the substrate!

In printed circuit boards, heat dissipation measures have become a very significant issue. Our company offers various heat dissipation substrates, including metal bases, thick copper, copper inlays, conductive paste filling, and thermal conductive materials such as ceramics. Please feel free to contact us.

  • Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録
Special substrate

Special substrate

The era is 【SPECIAL PCB!】

Recently, the specifications for substrates have diversified, and at Matsuwa Industries, we are trying various special substrates. The substrates listed all started from customer requests. We have been working together with customers who have said, "Other companies have turned us down, but perhaps Matsuwa Industries can make it happen?" Thick copper substrates ⇒ MAX 500μ * foil thickness 400μ in stock, inner layer core material foil thickness 140μ Copper inlays ⇒ round and square shapes * board thickness t1.0 to t3.0mm, round: φ1.0 to φ8.0mm, square: please consult Rigid FPC (build structure) ⇒ available in 1-layer and 2-layer Matsuwa Industries has established a prototype development room, so please contact us at the following for inquiries. TEL: 0598-52-1855

  • Circuit board design and manufacturing
  • EMS
  • Printed Circuit Board

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

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