End face electrode substrate "Partial etching through-hole substrate"
Only the copper in the cut section of the through hole is removed by etching! The board thickness can be accommodated from 0.04 to 0.3 mm.
We would like to introduce our "Partial Etching Through-Hole Substrate." In printed circuit boards used as substrate for devices, after component mounting, through-holes may be diced and used as soldering electrodes. However, cutting the copper plating of the through-holes inevitably leads to burr formation. Our company enables the production of cut-through-hole substrates without burrs by selectively etching away only the copper at the cut portions of the through-holes. [Applications] ■ Substrate boards for devices with through-hole electrodes, etc. *For more details, please refer to the PDF document or feel free to contact us.
- Company：三和電子サーキット
- Price：Other
