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substrate Product List and Ranking from 42 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. トリコ 東京支店 Tokyo//Industrial Electrical Equipment
  2. null/null
  3. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  4. 4 太洋テクノレックス 本社　和歌山 Wakayama//Electronic Components and Semiconductors
  5. 5 DAIKIN FINETECH, LTD. Nara//Resin/Plastic
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substrate Product ranking

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
This ranking is based on the number of page views on our site.

  1. Equipment Repair and Lifespan Extension: Trico's Repair Service for Industrial Equipment トリコ 東京支店
  2. PICLIA Ribbon Dual Sensor (Piezoelectric & Capacitive) *Evaluation Kit DAIKIN FINETECH, LTD.
  3. Ceramic Laminated Substrates You Might Not Know: HTCC Substrates and LTCC Substrates
  4. 4 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス
  5. 5 Noise countermeasures in the artwork design of DC/DC converters グロース

substrate Product List

1471～1485 item / All 1853 items

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Power supply unit design and development

Power supply unit design and development

Support for miniaturization, high efficiency, and low noise in design! For servers, inspection, industrial equipment, and more.

In our company's efforts in "Power Supply Unit Design and Development," we propose solutions for noise reduction, heat dissipation measures, optimal component selection, and layout design. We share advanced technologies and product trends in collaboration with semiconductor manufacturers. We also accept prototypes of passive components such as power transformers. Additionally, we have numerous achievements in energy harvesting power supplies, battery-free DC-DC converters, chargers for mobile batteries, and low-current power supplies for lighting. 【Features】 ■ Sharing advanced technologies and product trends in collaboration with semiconductor manufacturers ■ Proposing high-efficiency power units through the application of heat dissipation technologies such as copper inlay substrates ■ Designing with a long product lifecycle in mind and updating to advanced technologies ■ Accepting prototypes of passive components such as power transformers *For more details, please download the PDF or feel free to contact us.

  • power supply
  • Other power sources

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Heat dissipation substrate

Heat dissipation substrate

Achieving both heat dissipation measures for high-heat-generating components and ensuring transmission characteristics! Application to low-loss materials is also possible.

We create "heat dissipation substrates" that allow for the selection of substrate materials and configurations tailored to specific applications and heat dissipation challenges. Thick copper plated substrates form circuits for heat dissipation from heat-generating components directly to conductors and the back surface of the substrate through copper plating. In metal base substrates, a dielectric (insulation layer) and copper foil are laminated on copper or aluminum, and by connecting to copper or aluminum plates through filled vias, high heat dissipation is achieved. Additionally, we have extensive experience in the mechanical design and manufacturing of various heat dissipation carriers and enclosures, as well as the selection and assembly of heat sinks and TIM materials, allowing us to provide consistent support. 【Application Fields】 ■ High Frequency ■ Automotive ■ Power Modules ■ High Power LEDs ■ Inverters *For more details, please download the PDF or feel free to contact us.

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  • Circuit board design and manufacturing

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Wireless communication module development

Wireless communication module development

Providing a wide range of applications! Proposing high-frequency design technology and wireless communication know-how.

Our company is engaged in the development of wireless communication modules. We have a wealth of experience in developing various types of wireless communication and can propose wireless media tailored to your applications and requirements. We provide gadgets equipped with wireless communication functions through integration with various sensors. Additionally, we support the essential construction design required for the market launch of wireless communication devices. 【Features】 ■ Extensive experience in developing various types of wireless communication ■ Proposals for wireless media based on applications and requirements ■ Provision of gadgets with wireless communication functions through integration with various sensors ■ Suggestions for energy harvesting technologies such as microcurrent charging and solar panels ■ Support for the essential construction design required for the market launch of wireless communication devices *For more details, please download the PDF or feel free to contact us.

  • Communications
  • Other electronic parts

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Diagonal comb-shaped electrode substrate

Diagonal comb-shaped electrode substrate

Limited quantity for shipment! Line & Space 4μm/10.5μm

We would like to introduce the "Diagonal Comb Electrode Substrate" handled by EHC Corporation. This is a test substrate with an ITO pattern that has a tilt of 15° and a line and space of 4μm/10.5μm. It is a limited quantity product. The glass substrate material is EAGLE-XG, and the substrate glass size is 30x35x0.7mm. The electrode material is ITO, and the electrode film thickness is 70nm. 【Specifications】 ■ Glass substrate material: EAGLE-XG ■ Substrate glass size: 30x35x0.7mm ■ Electrode material: ITO ■ Electrode film thickness: 70nm ■ Electrode line width: 4μm ■ Electrode space: 10.5μm *For more details, please download the PDF or feel free to contact us.

  • 2.PNG
  • Printed Circuit Board

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Transparent substrate "SPET"

Transparent substrate "SPET"

Due to its reflow heat resistance of 180°C and high-temperature storage resistance of 120°C, it is suitable for soldering electronic components.

"SPET" is a highly heat-resistant and low-resistance transparent substrate that, despite being PET, enhances LED driving, increases the sensitivity of electrostatic switches, and improves antenna characteristics. The total light transmittance of the substrate is 90.0%, with a haze of 0.8, and it features fine wiring that is difficult to see. Additionally, the sheet resistance of the conductor is 0.95 mΩ/□, and the conductor thickness is 18 μm, making it suitable for use as a substrate. [Features] ■ High transparency substrate ■ Low resistance conductor ■ High heat-resistant substrate *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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What is SPET?

What is SPET?

Tightly laminated resist, copper foil, adhesive layer, and PET! Introducing our transparent substrate.

"SPET" is a single-sided substrate made by laminating copper foil onto a PET base material. The base material thickness is 100μm/188μm, and the copper foil thickness is 12μm/18μm. It is a product that is tightly laminated with resist, copper foil, adhesive layer, and PET. Additionally, we also offer "SPET-MM," which has wiring that is nearly invisible. Please feel free to contact us when you need assistance. 【Features】 ■ High transparency flexible substrate ■ Low-resistance conductor due to copper foil lamination ■ Compatible with low-temperature soldering (180°C) *For more details, please refer to the related links or feel free to contact us.

  • Printed Circuit Board

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Printed circuit board design high-frequency board

Printed circuit board design high-frequency board

We accept artwork design for various types of boards, including high-frequency impedance control boards and power supply boards.

We specialize in the design of impedance control PCBs, with proven experience in high-frequency boards ranging from 10GHz to 40GHz and high-speed transmission boards from 40Gbps to 100Gbps. Additionally, we consider various aspects from PCB manufacturing to component mounting and propose the optimal layout.

  • others

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Flexible printed circuit board (FPC) impedance control

Flexible printed circuit board (FPC) impedance control

Impedance control of flexible substrates and UL certification can be achieved with short lead times and small lot production.

We can respond to circuit board manufacturing and component assembly in just one working day at the shortest. Additionally, we manufacture high-performance flexible circuit boards with impedance control during the artwork design phase. We can also accommodate small lot production. Please feel free to consult with us.

  • others
  • Prototype Services

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Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]

Flexible printed circuit board (FPC) [Solving the issues in the prototype development of flexible printed circuit boards!]

Solving the issues of prototype development for flexible PCBs with many limitations! We manufacture high-performance flexible PCBs!

We can respond to circuit board manufacturing and component mounting in as little as one working day each. Additionally, we manufacture high-performance flexible circuit boards with impedance control during artwork design. We also accommodate small lot production. 【We can also support the following specifications】 ■ Component mounting FPC (double-sided mounting, lead-free mounting, mounter/reflow, bare chip mounting) ■ Bonding processing with other boards using ACF (FPC + FPC, FPC + PBC, FPC + glass substrate, etc.) ■ Multi-layer FPC (supports 3 to 6 layers; double-sided mounting is also possible) ■ Fine pitch FPC (single-sided board... minimum L/S 12/30μm; double-sided board... minimum L/S 25/50μm) *For details, please request materials or view the PDF data from the download.

  • others

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Tokaishin'e Electronics Industry Multi-layer Circuit Board

Tokaishin'e Electronics Industry Multi-layer Circuit Board

We have a variety of products available to meet the diverse needs of our customers.

It is a substrate with copper foil on both sides and inside of a glass epoxy insulating board.

  • Other services

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Daichang Electronics Flex-Rigid Circuit Boards

Daichang Electronics Flex-Rigid Circuit Boards

We aim to be a company where everyone can thrive and enjoy their work.

The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.

  • Other network tools

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Daichang Electronics Build-Up Multilayer Circuit Board

Daichang Electronics Build-Up Multilayer Circuit Board

We aim to be a company where everyone can thrive and enjoy their work.

The business environment surrounding our company has become characterized by significant changes akin to turbulence. In order to achieve sustainable development without being swayed by economic trends, we will take the initiative to lead change and proactively embrace challenges.

  • Other network tools

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Small lot for development! For automotive and power supply use. Thick copper substrate (high current substrate).

Small lot for development! For automotive and power supply use. Thick copper substrate (high current substrate).

With a maximum copper thickness of 400μm, it is suitable for heat dissipation measures and power supply for power devices! It can also be formed on substrates such as transformers and motors.

Meito Electric's "Thick Copper Substrate (High Current Substrate)" is suitable for heat dissipation and current supply in heating devices used in automotive and power supply applications. By increasing the conductor (copper) thickness compared to the conventional 35μm, power circuits and control circuits can be formed on the same substrate. The creation of thick copper coil patterns allows for the construction of transformer circuits and motor circuits on the substrate. 【Substrate Specifications】 ■ Outer layer copper foil thickness: 70μm to 200μm ■ Inner layer copper foil thickness: 70μm to 400μm ■ High thermal conductivity resin: up to 8W/mK ■ Bonding: High thermal conductivity resin and copper, etc. ■ Number of layers: Proven from 2 layers to 10 layers (specifications to be discussed) ■ Copper plate: C1020 (oxygen-free) or C1100 (tough pitch) *For detailed information, please download the PDF or feel free to contact us.

  • Contract manufacturing

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[Case Study] IH Soldering Equipment

[Case Study] IH Soldering Equipment

We are engaged in environmentally friendly manufacturing using equipment and processes that minimize the use of CO2, solder, and VOCs.

We would like to introduce a case where we switched from point dip soldering to our "IH soldering equipment." This change was implemented with the goals of "reducing the amount of solder and flux used" and "contributing to carbon neutrality while enhancing corporate value." As a result of the implementation, we achieved a 29% reduction in solder usage, zero liquid flux usage, and an 85% reduction in power consumption. While production efficiency may decrease slightly, we can perform environmentally conscious soldering, and by manufacturing with Dainikko, we believe we can create environmentally friendly products. We encourage you to consider manufacturing with Dainikko to enhance your corporate value. [Purpose of Implementation] ■ Improve yield rate ■ Reduce the amount of solder and flux used ■ Contribute to carbon neutrality and enhance corporate value *For more details, please download the PDF or feel free to contact us.

  • Soldering Equipment

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3D circuit board (MID wiring) / substrate with embedded electronic components

3D circuit board (MID wiring) / substrate with embedded electronic components

3D circuit board [MID wiring (Molded Interconnect Device)] / substrate with embedded electronic components

Our company provides contract design and development of electronic devices (ODM) as well as contract manufacturing services for electronic devices (EMS). We are involved not only in the design and manufacturing of flexible printed circuits but also in circuit design, structural design, software development, cable and harness production, and we collaborate with product development personnel from the planning stage to bring products to market. Various industries are advancing in miniaturization and weight reduction. To differentiate ourselves from competitors while considering mass production efficiency, we propose a wide range of solutions, not limited to flexible printed circuits, including 3D-MID wiring cases with conductor formation on resin housing surfaces and embedded substrates that incorporate electronic components into printed circuit boards. Etching, plating, vacuum deposition, EB deposition, sputtering, thin film formation, photolithography, ion plating, thermal CVD, plasma CVD, dry etching, film ITO, film metal patterning, fine patterns, WLP, silicon wafers, RDL, bump formation, TEG, dry etching, wet etching, MEMS, organic EL, metallization, glass etching, semi-additive etching, transparent resist, transparency, high heat-resistant resin.

  • Printed Circuit Board
  • Circuit board design and manufacturing
  • EMS

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