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substrate Product List and Ranking from 548 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Oct 22, 2025~Nov 18, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Oct 22, 2025~Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 太洋テクノレックス 本社 和歌山 Wakayama//Electronic Components and Semiconductors
  2. 山下マテリアル Kanagawa//Electronic Components and Semiconductors
  3. JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室 Tokyo//Trading company/Wholesale
  4. 4 沖電気工業 産業営業本部 産業営業統括室 Tokyo//Information and Communications
  5. 5 null/null

substrate Product ranking

Last Updated: Aggregation Period:Oct 22, 2025~Nov 18, 2025
This ranking is based on the number of page views on our site.

  1. 【TTL_Exhibition Participation Information】The 20th Messe Nagoya 2025 太洋テクノレックス 本社 和歌山
  2. Long-sized printed circuit board ☆ up to 1500mm ☆ Ally Japan 横浜本社
  3. All LCP Flexible Printed Circuit Board (FPC) 山下マテリアル
  4. 4 Electronic Component Reel Management System "Smart Reel Rack" JFE商事エレクトロニクス プロセスソリューション営業部 実装プロセス営業室
  5. 5 <Super Short Delivery Time> Base Material Specification Sheet スクリーンプロセス

substrate Product List

1456~1470 item / All 1843 items

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Heat-dissipating molded cast products [Resin molded products that combine heat dissipation and insulation properties]

Proposals for EV vehicles with increasing heat dissipation requirements, high-efficiency motors, power devices, etc.

We solve heat problems caused by the miniaturization of devices with the power of resin. We offer proposals for applications such as EV vehicles, high-efficiency motors, and power devices, where the demand for heat dissipation is increasing. Leveraging our unique position as both a manufacturer and a trading company, we suggest suitable resins from multiple manufacturers based on the usage environment and other factors. Additionally, we can collaborate with resin manufacturers to custom blend resins to achieve desired properties. Please feel free to consult us with any other requests. 【Features】 ■ Achieves thermal conductivity of 2.6 W/m·K ■ Breakdown voltage of 17 kV/mm *For more details, please refer to the PDF document or feel free to contact us.

  • 【昭和化成】モールド注型品_PR資料ver1 220606_004_page-0001.jpg
  • Other Auto Parts

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Bus bar (bus bar) high current substrate

By substrate-izing the busbar, high insulation and compactness are achieved!

We have substrate-ized busbars used for high current applications. By utilizing our special technology for substrate-ization, we achieve high insulation properties and a compact, lightweight design. We can accommodate lengths of up to 1,000mm. Additionally, substrate-ization offers the following benefits: - Mounting of power devices such as IGBTs and SiCs on the substrate. - After substrate mounting, installation into equipment is possible, leading to reduced assembly time and prevention of miswiring. - Space-saving due to simplified substrate and wiring, resulting in overall equipment miniaturization. - The greatest advantage of substrate-ization is its high insulation performance and usability. The insulation layer made with prepreg has a consistent thickness, eliminating concerns about variations in thickness like those seen with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

  • kyoei_A4_大電流基盤_1.png
  • Printed Circuit Board
  • Circuit board design and manufacturing

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[Equipment Introduction] Leave implementation technology and circuit board assembly to us.

We offer a lead-free compatible line, discrete component inserters, inspection equipment, and more!

We would like to introduce the equipment owned by World Electronics Co., Ltd. The SMT L6 line (lead-free compatible line) includes a cream solder printer, adhesive applicator, high-speed component mounter, odd-form component mounter, and a lead-free compatible N2 reflow oven. Additionally, the high-speed axial component inserter "AVK3" supports self-insertion for board sizes (mm) with a maximum of 508×381 and a minimum of 50×50. 【Equipment Owned (Excerpt)】 ■ Flow Soldering Line - Spray Fluxer - Automatic Soldering Equipment: 3 lines for lead-free solder, 1 line for eutectic solder *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment
  • Circuit Board Inspection Equipment
  • X-ray inspection equipment

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Transaction Flow

First, please feel free to contact us via the inquiry form or by phone!

We would like to introduce the flow of transactions with World Electronics Co., Ltd. First, please contact us via the inquiry form or by phone, and we will gather necessary information such as the type of product, quantity, and delivery date. Based on the information provided, we will create and present a quotation. Once you agree to it, we will proceed with the contract. Next, we will create a prototype and respond sincerely until the desired product is completed. Once the prototype is finished, we will manufacture the product and deliver it according to the desired delivery date. 【Transaction Flow】 1. Inquiry 2. Requirements Hearing 3. Quotation 4. Contract 5. Prototype Creation 6. Manufacturing 7. Delivery *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services

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Board "SY-KUS-01"

PCI Express board capable of high-capacity data transmission and reception using high-speed serial communication.

The "SY-KUS-01" is a PCI Express board equipped with a Xilinx Kintex UltraScale FPGA. It enables high-speed serial communication for large-capacity data transmission and reception. It features two channels of DDR4 as external memory. It is equipped with the FPGA XCKU035-2FFVA1156C, and options for 025, 040, and 060 are also available. Additionally, it includes two QSPI (totaling 512Mbit). 256Mbit can be used as user space. 【Features】 ■ PCI Express (supports up to Gen3 x 8) ■ Oscillator ・ Equipped with 100MHz, 200MHz, and 250MHz ■ Two channels of DDR4 (1 channel = 32Gbit 64bit_DataBus) ■ SFP+ 4ch ■ MMCX 2Lane (Tx/Rx) + RefCLK ■ 8-pin PinHeader external interface *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Contract manufacturing

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Printed circuit board

Developing printed circuit boards that support technology! Bringing products to life that meet various needs.

Daishin Sangyo Co., Ltd. develops printed circuit boards with a skilled and experienced design team specializing in technical expertise. We are capable of manufacturing special substrates, including build-up boards, Teflon boards, and aluminum boards. We offer a wide range of services from circuit tracing to power supply, analog, digital, high frequency, impedance, and FPGA design. 【Features】 ■ Possible to ship as soon as the next day ■ Supports small lots to mass production ■ Circuit design ■ Artwork design (pattern design) ■ Metal mask production *For more details, please refer to the PDF document or feel free to contact us.

  • IPROS51674970813232955168.png
  • Circuit board design and manufacturing
  • Printed Circuit Board

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[Information] Daishin Sangyo Co., Ltd. Manufacturing Supplement

Introducing numerous examples of high-difficulty substrates, such as 0.5 pitch BGA mounted 8-layer through resin-filled boards (t0.6)!

This document is a supplementary manufacturing material from Oshin Industry Co., Ltd. It includes information such as the lineup of standard substrate materials, maximum sizes of multilayer boards, and maximum board thickness. Additionally, as examples of high-difficulty substrates, we introduce technologies such as "0.4 pitch BGA mounted 8-layer through resin-filled substrate (t1.6)" and "0.4 pitch BGA mounted 16-layer L1-2/L1-3…L1-8 continuous IVH substrate (t3.2)." We encourage you to read it. 【Contents (partial)】 ■General - Standard substrate materials - Maximum sizes of multilayer boards - Maximum board thickness ■Technology (Examples of high-difficulty substrate achievements) - 0.5 pitch BGA mounted 12-layer 2-8-2 build-up substrate (t1.6) - 0.5 pitch BGA mounted 16-layer L1-8/L9-16 IVH + through resin-filled substrate (t2.0) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Other processing machines

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Printed circuit board "10-layer 3-4-3 build-up board"

Introducing a printed circuit board with a core section of 4-layer TH, resin-filled and lid-plated! It features a 0.4 pitch 256-pin BGA.

Daishin Sangyo Co., Ltd. was founded in the early Showa period in the Fukushima Ward of Osaka and has been a trading company primarily selling electrical and electronic products for many years. The "10-layer 3-4-3 build-up substrate" is a printed circuit board equipped with a 0.4 pitch 256 pin BGA. It features via-on-via with via fill copper plating. The resist is exposed using DI laser, with a laser hole diameter of φ0.1. 【Features】 ■ Via-on-via with via fill copper plating ■ Core section 4-layer TH is resin-filled and covered with plating ■ L5/6 layer clearance φ0.35 (TH φ0.2 drill) *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Circuit board processing machine
  • Circuit board design and manufacturing

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Solid State Lighting (SSL) Printed Circuit Board (PCB) Solutions Guide

ODM services from research and development to mass production of solid-state lighting (SSL). Proven delivery records to major multinational companies worldwide. [Catalog available]

We provide comprehensive services from the idea stage to the design and implementation of circuit boards, thermal management solutions for light source design and production, and final lighting fixture production. From IMS, PCB, and MCPCB to assembly and system integration, we have manufactured world-class products in fields such as automotive, medical, and industrial equipment, building a solid track record. Please feel free to entrust us with your needs. [Content] ■ Consistent support from concept design → prototyping → product development → manufacturing. ■ Solid State Lighting (SSL) solutions. ■ Solutions for IMS, PCB, MCPCB, and more. *For more details, please download our catalog or feel free to contact us.

  • others

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FSM Adapter Board

The substrate dimensions are 70×47×1.4mm! A product for the RZ/V2M Evaluation Board Kit.

We would like to introduce the "FSM Adapter Board for RZ/V2M Evaluation Board Kit" that we handle. This product is compatible with the "RZ/V2M ISP Support Package" provided by Renesas Electronics. It allows you to connect FRAMOS sensor modules to the V2M_EVK. Please feel free to contact us if you have any inquiries. 【Features】 ■ Image sensor conversion board for RZ/V2M Evaluation Board Kit ■ Capable of connecting FRAMOS sensor modules to V2M_EVK ■ Compatible with the "RZ/V2M ISP Support Package" provided by Renesas Electronics *For more details, please refer to the PDF document or feel free to contact us.

  • Evaluation Board

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Numerous adoption achievements for aerospace applications - power control boards & battery modules.

Many achievements in mounting on satellites! The satellite is alive because the power supply is operational. The heart of electronic devices, power control board and battery module [Catalog available].

Numerous achievements in mounting on space probes and satellites! The satellites are alive because the power supply is operational. Here is an introduction to our power control boards and lithium-ion batteries, which have been widely adopted. 【Adoption Achievements】 ◆ The University of Tokyo TRICOM-1R (SS-520:5) ◆ NESTA Hodoyoshi No. 3 and No. 4 (Dnepr), among many others 【Product Introduction】 ◆ Multi-functional lithium-ion battery models ◆ Hodoyoshi-mounted EPS modules, among many others *For more details, please download the catalog or feel free to contact us.

  • Secondary Cells/Batteries
  • Fuel Cells
  • Lithium-ion battery

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Coated prisms for electrical components, perforated substrates, medical polishing substrates, etc.

Actively responding to customer requirements such as flatness and surface roughness in grinding.

Our company specializes in the polishing and molding of optical glass for electronic devices. We are capable of purchasing and manufacturing various materials such as single crystal LiNbO3, LiTaO3, La3Ga5SiO14, and SrTiO3. We actively respond to customer requirements regarding flatness and surface roughness in polishing. 【Features】 ■ Advanced technology and extensive know-how accumulated in the field of parallel plane polishing of optical glass for electronic devices ■ Proven track record in special glass processing for environmental numerical measuring instruments, with high evaluations from major glass manufacturers ■ High quality and short delivery times. We carefully respond to customer needs to ensure greater satisfaction. 【Photo Content】 1) BK-7 glass substrate 2) Drilled substrate 3) Polished substrate for medical use 4) Drilled substrate 5) Polished substrate with coating for electrical components prism *For more details, please feel free to contact us.

  • Glass
  • Processing Contract

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Long-sized printed circuit board ☆ up to 1500mm ☆

Leave everything related to printed circuit boards to us! We can handle everything from single-sided to build-up, aluminum core, and rigid-flex, even in small quantities.

Our company provides electronic devices, including printed circuit boards, based on our unique value chain and network with "high quality," "low price," and "short delivery time." ---------------------------- ◆ Quality <Q> We ensure reliable quality by having a QA organization centered around Japanese personnel that works closely with the factory. We can accommodate from AW design, enabling designs that consider manufacturing. ◆ Price <C> Depending on the type and quantity of the circuit boards, we can procure them at prices 30% to over 50% lower than domestic products. ◆ Delivery <D> We have a dedicated organization for delivery management, minimizing delivery issues through detailed management. ---------------------------- Our feature is that we can provide "Chinese-produced products at low prices with Japanese quality." We can flexibly utilize short delivery domestic manufacturing and low-cost overseas manufacturing, accommodating a wide range from single-sided boards to build-up mass production. We have our own factory in China, and we are also equipped to produce special-shaped boards, such as long boards over 1 meter and thin boards of 0.2 mm. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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Plywood composite substrate

Achieving the quality desired by customers by combining various raw materials.

We achieve and provide the quality that our customers seek by combining various raw materials, such as plywood + plywood and plywood + MDF, to meet strength and surface characteristics based on their applications. By thoroughly managing press time, press pressure, and adhesive, we guarantee reliable traceability and adhesive performance. Furthermore, with high-precision thickness adjustment and surface finishing, we deliver more user-friendly products. 【Features】 ■ We combine various raw materials to meet the quality that our customers seek. ■ We guarantee reliable traceability and adhesive performance. ■ We deliver more user-friendly products. *For more details, please contact us.

  • wood
  • Wood products
  • Contract manufacturing

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