Next-generation flexible substrate with high heat resistance, low loss, and chemical resistance, all made of LCP!
All LCP is a high-performance flexible printed circuit board (FPC) made entirely of liquid crystal polymer (LCP) without the use of adhesives. Compared to conventional polyimide FPCs, it features high heat resistance, low moisture absorption, low loss characteristics, chemical resistance, and low outgassing properties, providing stable performance even in harsh environments. It is particularly suitable for applications that require reduced transmission loss of high-frequency signals and improved durability in environments where oils and chemicals are used.
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basic information
【Specifications】 Structure: LCP (Liquid Crystal Polymer) base material + copper foil + LCP cover layer Thickness: Adjustable based on material composition 【Characteristics】 High heat resistance: Excellent long-term heat resistance due to adhesive-free structure Low moisture absorption: Low water absorption rate, ideal for high humidity environments Low loss characteristics: Reduced loss of high-frequency signals due to low dielectric constant Chemical resistance: Oil resistance against engine oil, brake oil, and ATF Low outgassing: Minimal outgassing during heating, suitable for clean environments
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Applications/Examples of results
- Automotive applications: Wiring, sensors, and ADAS (Advanced Driver Assistance Systems) in the engine room - 5G and communication devices: Antennas, RF modules, and network equipment handling high-frequency signals - Medical devices: Cleanroom equipment utilizing low outgassing properties and wearable medical devices - Aerospace: Satellite and avionics equipment requiring heat and chemical resistance - Industrial equipment: Robots and automation devices leveraging high heat and chemical resistance, various sensor substrates
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We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.