The "GND slit structure technology" solves the issues of "dielectric thickness" and "transmission loss" that arise in microstrip line structures.
The "GND slit structure" under development addresses the challenges of "dielectric thickness" and "transmission loss" that arise in microstrip line structures. This technology allows for the reduction of dielectric thickness while maintaining transmission characteristics by incorporating a slit design in the GND plane directly beneath the RF line. As a result, it minimizes signal loss while maximizing flexibility. For high-speed transmission compatible YFC products (RFM, RFS series), we provide cable FPCs that reduce transmission loss by adopting the GND slit design, enabling low-loss signal transmission. Please refer to the PDF catalog for the measurement results of transmission loss and flexibility.
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basic information
【Product Features】 - The adoption of a GND slit reduces transmission loss and improves flexibility. - RFM features a differential line specification based on a microstrip line structure. - RFS features a differential line specification based on a strip line structure. - The terminal sections at both ends can be inserted and mated with FPC connectors. - By using laser processing and other methods, initial costs can be kept under control. 【Product Specifications Example】 - Number of layers: 2 layers - Base material: Liquid Crystal Polymer (LCP) - Coverlay: 25μm or 50μm thick coverlay + shielding film as needed - Conductor thickness: 27μm - Impedance matching: Differential 100Ω ±10% - Connector terminal surface treatment: Gold plating ★ This product is developed based on the results of a collaborative industry-academia-government project promoted jointly by Aoyama Gakuin University, Kanagawa Prefectural Institute of Industrial Technology, and Yamashita Material Co., Ltd.
Price range
P3
Delivery Time
P4
Applications/Examples of results
【Intended Use】 - Signal harness between PCBs - Signal harness between LCD module and PCB - Signal harness between sensor module and PCB
Company information
We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.
