High-precision semiconductor manufacturing supported by high heat resistance and low loss flexible substrates.
In the semiconductor manufacturing industry, high-precision process control and stable performance are required. Particularly in situations involving high-temperature environments and high-frequency signals, the heat resistance and low-loss characteristics of substrates are crucial. Conventional substrates may suffer from deformation due to heat and signal attenuation, which can compromise manufacturing precision and product reliability. Our all-LCP flexible substrates offer high heat resistance, low-loss characteristics, and low outgassing, supporting high-precision processes in semiconductor manufacturing. 【Application Scenarios】 - Semiconductor manufacturing equipment - High-frequency circuits - Cleanroom environments 【Benefits of Implementation】 - Stabilization of manufacturing processes - Improvement in product reliability - Enhancement of yield
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**Features** - High heat resistance and low outgassing due to adhesive-free structure - Stable properties even in high humidity environments due to low moisture absorption - Suitable for reducing loss of high-frequency signals due to low dielectric constant - Chemical resistance: oil resistance against engine oil, brake oil, and ATF - Thickness adjustment possible due to material composition, allowing flexible adaptation to applications **Our Strengths** Yamashita Material is an electronic circuit board manufacturer engaged in the development, production, and sales of FPCs. Our motto is to contribute to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times). We also accommodate short delivery requests. Please feel free to consult with us.
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Applications/Examples of results
- Automotive applications: Wiring, sensors, and ADAS (Advanced Driver Assistance Systems) in the engine room - 5G and communication devices: Antennas, RF modules, and network equipment handling high-frequency signals - Medical devices: Cleanroom equipment utilizing low outgassing properties and wearable medical devices - Aerospace: Satellite and avionics equipment requiring heat and chemical resistance - Industrial equipment: Robots and automation devices leveraging high heat and chemical resistance, various sensor substrates
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We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.
![[In Development] GND Slit Structure Flexible Circuit Board](https://image.mono.ipros.com/public/product/image/f49/2001077731/IPROS79423087762742399024.jpeg?w=280&h=280)
