Technical silicon wafer substrates and foundry services.
We offer custom products such as 100-200mm bonded wafers (SOI, SiSi), dielectric separation, and deep trench etching with a high aspect ratio.
Icemos Technology is a best-in-class supplier of MEMS and advanced engineering substrates. With over 20 years of experience, Icemos promises that all customers will receive excellent service from inquiry to product delivery, backed by exceptional manufacturing skills and the latest technological developments. Our engineering team provides technical support for innovative product development, design proposals, and special services. If existing products are not listed, we will also develop unique special products in collaboration with our customers. This is the service that sets us apart. SOI = Silicon on Insulator SiSi = Silicon Silicon bonded DSOI = Double SOI DSP = Double Sided Polished CSOI = Cavity SOI Thin SOI TSOI = Trench SOI TSV = Through-Silicon Vias Foundry services Please feel free to contact us. http://jp.icemostech.com/products.html
- 企業：アイスモス・テクノロジー・ジャパン
- 価格：Other
![[Research Material] World Market for Double-Sided Printed Circuit Boards](https://image.mono.ipros.com/public/product/image/362/2001460676/IPROS25088691762923591273.jpeg?w=280&h=280)
