Technical silicon wafer substrates and foundry services.
SOI,SiSi,DSOI,CSOI,Thin SOI,TSOI,TSV
We offer custom products such as 100-200mm bonded wafers (SOI, SiSi), dielectric separation, and deep trench etching with a high aspect ratio.
Icemos Technology is a best-in-class supplier of MEMS and advanced engineering substrates. With over 20 years of experience, Icemos promises that all customers will receive excellent service from inquiry to product delivery, backed by exceptional manufacturing skills and the latest technological developments. Our engineering team provides technical support for innovative product development, design proposals, and special services. If existing products are not listed, we will also develop unique special products in collaboration with our customers. This is the service that sets us apart. SOI = Silicon on Insulator SiSi = Silicon Silicon bonded DSOI = Double SOI DSP = Double Sided Polished CSOI = Cavity SOI Thin SOI TSOI = Trench SOI TSV = Through-Silicon Vias Foundry services Please feel free to contact us. http://jp.icemostech.com/products.html
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basic information
Our company specializes in wafer bonding, deep reactive ion etching (DRIE), and wafer polishing. Using DRIE, we apply trench etching and embedding services to bulk silicon and SOI wafers, providing our customers with unique dielectric insulating substrates. SOI materials are applied in a wide range of fields, including telecommunications products, optical devices, IC insulation, contactless relays, MEMS sensor micro-machined structures, actuators, and silicon parts for the Swiss luxury watch industry. Based on over 10 years of experience, we respond to ensure that our customers receive excellent service from inquiry to product supply through our manufacturing skills and cutting-edge technology development. Our technical team provides designs and services for innovative product development. While continuously maintaining ISO 9001, ISO 14001, and IATF 16949, we emphasize employee training and strive to acquire the latest technologies as a high-tech industry.
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Applications/Examples of results
SOI MEMS/MST Biomedical MEMS RF MEMS Optoelectronics Smart Power Analog IC Luxury Watches TSOI MEMS Solid-State Relay Photovoltaic Generator Solar Cells and Optoelectronic Devices/IC High Voltage Analog IC for Telecom High Performance Bipolar Circuits Smart Power IC Integrated Sensors DSOI SOI Solutions for MEMS/MST Biomedical MEMS RF MEMS Optoelectronics/Optical Micro Machines DSP MEMS/MST Biomedical MEMS RF MEMS Optoelectronics SiSi PIN Diode RF Attenuator Optical Detector X-ray Detector IR Infrared Sensor Power Devices Replacement from Epitaxial Material CSOI Pressure Sensors Microphones Inertial MEMS Microfluidic Devices Resonators Thin SOI RF Filters Optoelectronics Image Detection Wireless Connection Flexible Hybrid Electronics RF MEMS
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Company information
Our company was established in 2004 as a best-in-class supplier providing high-voltage power MOSFETs and MEMS technology processes that deliver high performance for power supplies, advanced technology base wafers, SOI (silicon on insulator), and bonded silicon substrates at a high cost-effectiveness. (Headquartered in the U.S., with manufacturing facilities in the U.K. and R&D in Tokyo) We have developed and realized high-voltage super junction MOSFETs with innovative deep trench etching MEMS structures through a simple and low-cost process. Please feel free to contact us if you have any inquiries.
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