Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
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64-Channel Latching or Momentary Relay Board with Built-in-Test
The VME-2210 provides 64 One Form C (SPDT) contacts to the user via two 96-pin DIN connectors. These relays are the magnetic latching type which means that, once a contact is set it will remain set (even if power is removed from the relay) until it is reset.
128-bit High-Voltage Digital Input Board
VME-1129 128-bit High-Voltage Digital Input Board with Built-in-Test and Input Filter. This product complies with the VMEbus specification (ANSI/IEEE STD 1014-1987, IEC 821 and 297), with the following mnemonics: A24:A16: D32/D16/D08 (EO): Slave:39/3D: 29/2D Form Factor: 6U
LEX Zero Thermal Expansion Material CTE = 0 (Zero)
Providing Materials and fabrication services Both Casted and Forged materials available 3D Additive Manufacturing service A variety of product line up from Zero expansion. Temperature range: -269 to 350 degree Celsius (selectable from product lineup)
A super low loss of 0.00045 can be achieved at 18GHz.
Polifron Corporation has developed high-frequency substrates that utilize the properties of PTFE through its unique technology. This high electrical characteristic cannot be achieved with other substrates. By using high-purity PTFE with a dielectric constant of "2.1" as the dielectric material, an ultra-low loss of 0.00045 at 18GHz can be realized. 【Features】 ○ Ultra Low Loss ○ Very Low Dk ○ Isotropic Properties For more details, please contact us or download the catalog. *This catalog is in English.
ECC support! A high-grade board equipped with 10Gb Ethernet and an extended temperature range.
Gofeltec's "Knight Frogs WINE" is a compact, high-grade COM Express module equipped with Intel's third-generation 64-bit SoC Intel Xeon/Pentium processors. The main memory is DDR4 SO-DIMM, supporting up to 8GB and ECC. In addition to the standard I/O of COM Express Type 6, the carrier board can be equipped with 2 channels of 10G Ethernet. 【Features】 ■ 10Gb Ethernet equipped ■ ECC support ■ Extended temperature range (-5℃ to 70℃) ■ Available in Basic Module Size (125×95mm) *For more details, please refer to the PDF document or feel free to contact us.
PCI Express board capable of high-capacity data transmission and reception using high-speed serial communication.
The "SY-KUS-01" is a PCI Express board equipped with a Xilinx Kintex UltraScale FPGA. It enables high-speed serial communication for large-capacity data transmission and reception. It features two channels of DDR4 as external memory. It is equipped with the FPGA XCKU035-2FFVA1156C, and options for 025, 040, and 060 are also available. Additionally, it includes two QSPI (totaling 512Mbit). 256Mbit can be used as user space. 【Features】 ■ PCI Express (supports up to Gen3 x 8) ■ Oscillator ・ Equipped with 100MHz, 200MHz, and 250MHz ■ Two channels of DDR4 (1 channel = 32Gbit 64bit_DataBus) ■ SFP+ 4ch ■ MMCX 2Lane (Tx/Rx) + RefCLK ■ 8-pin PinHeader external interface *For more details, please refer to the PDF document or feel free to contact us.
![[Research Material] Global Market for Semi-Insulating SiC Substrates](https://image.mono.ipros.com/public/product/image/db3/2001463731/IPROS32029003209614041608.jpeg?w=280&h=280)
World Market for Semi-Insulating SiC Substrates: 2-inch and 3-inch SiC Substrates, 4-inch SiC Substrates, 6-inch SiC Substrates, IT & Consumer, LE ...
This research report (Global Semi-insulating SiC Substrates Market) investigates and analyzes the current status and outlook for the global market of semi-insulating SiC substrates over the next five years. It includes information on the overview of the global semi-insulating SiC substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the semi-insulating SiC substrate market focus on 2-inch and 3-inch SiC substrates, 4-inch SiC substrates, and 6-inch SiC substrates, while the segments by application target IT & consumer, LED lighting, automotive, and industrial sectors. The regional segments calculate the market size of semi-insulating SiC substrates by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the semi-insulating SiC substrate market, product and business overviews, and sales performance.
![[Research Material] World Market for Single-Sided Printed Circuit Boards](https://image.mono.ipros.com/public/product/image/adf/2001481416/IPROS43792779215493735878.jpeg?w=280&h=280)
World Market for Single-Sided Printed Circuit Boards: Glass Fiber, Metal, Ceramics, Others, Computers, Phones, Faxes, Automotive Electronics, Others
This research report (Global Single Sided Printed Circuit Board Market) investigates and analyzes the current state and outlook for the global market of single-sided printed circuit boards over the next five years. It includes information on the overview of the global single-sided printed circuit board market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the single-sided printed circuit board market focus on glass fiber, metal, ceramics, and others, while the segments by application cover computers, phones, faxes, automotive electronics, and others. The regional segments calculate the market size of single-sided printed circuit boards by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. The report also includes the market share of major companies in the single-sided printed circuit board market, product and business overviews, and sales performance.
![[Research Material] World Market for Double-Sided Printed Circuit Boards](https://image.mono.ipros.com/public/product/image/362/2001460676/IPROS25088691762923591273.jpeg?w=280&h=280)
World Market for Double-Sided Printed Circuit Boards: Glass Fiber, Paper, Metal, Ceramic, Others, Industrial/Medical, Home Appliances, Military/Aerospace, Others
This research report (Global Double Sided Printed Circuit Board Market) investigates and analyzes the current state and outlook for the global market of double-sided printed circuit boards over the next five years. It includes information on the overview of the global double-sided printed circuit board market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the double-sided printed circuit board market include fiberglass, paper, metal, ceramic, and others, while the segments by application cover industrial/medical, home appliances, military/aerospace, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of double-sided printed circuit boards. The report also includes the market share of major companies in the double-sided printed circuit board sector, product and business overviews, and sales performance.
![Substrates, etc. Brain Power [Authorized Dealer]](https://image.mono.ipros.com/public/product/image/4b3/2001525336/IPROS2031350881699948693.png?w=280&h=280)
From memory modules to 5G optical transceivers and rigid-flex. PCB technology that excels in high density and high reliability.
Brain Power (Qing Yuan) Co., Ltd. is a PCB specialized manufacturer and a JEDEC member headquartered in Guangdong, China, with a large-scale factory. The company handles double-sided, multilayer, HDI, FPC, rigid-flex, high-frequency, and optical module compatible boards, with a maximum monthly production capacity of 120,000 square meters and an average of 1,200 employees, developing high-density and high-performance products for the global market. Major customers include memory module, SSD, automotive equipment, and communication equipment manufacturers.
