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substrate(aln) - List of Manufacturers, Suppliers, Companies and Products

Last Updated: Aggregation Period:Aug 27, 2025~Sep 23, 2025
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substrate Product List

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[Research Material] Global Market for Direct Bonding Copper (DBC) Substrates

World Market for Direct Bonding Copper (DBC) Substrates: Alumina (Al2O3), Aluminum Nitride (AlN), Beryllia (BeO), Home Appliances, Communication ...

This research report (Global Direct Bonding Copper (DBC) Substrate Market) investigates and analyzes the current status and outlook for the global market of Direct Bonding Copper (DBC) substrates over the next five years. It includes information on the overview of the global Direct Bonding Copper (DBC) substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments of the Direct Bonding Copper (DBC) substrate market by type include alumina (Al2O3), aluminum nitride (AlN), and beryllium oxide (BeO), while the segments by application cover home appliances, telecommunications, industrial, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of Direct Bonding Copper (DBC) substrates. It also includes the market share of major companies in the Direct Bonding Copper (DBC) substrate market, product and business overviews, and sales performance.

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Substrate, submount substrate

Substrate, submount substrate

1) If you are having trouble with heat generation and dissipation on the substrate due to the integration of heating chips, please consult Toyo Seimitsu Kogyo. 2) We will support you from development design to mass production.

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  • Printed Circuit Board
  • Ceramics

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Free sample giveaway! Overseas ceramic substrate

Proposal for stable procurement of overseas-made ceramic substrates!

Narasaki Sangyo Co., Ltd. will propose overseas-manufactured ceramic substrates through our overseas subsidiaries! ● Domestic procurement is unstable ● We would like to consider new procurement sources ● We want to reduce costs with lower-grade overseas products If you are facing any of these issues, please feel free to contact us! Customers who download our materials will receive alumina substrate samples free of charge!

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  • Fine Ceramics

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Thick copper base, AMB substrate printed circuit board for power modules.

Leave it to us for circuit boards for power modules! We manufacture thick copper base wiring boards and boards that bond thick copper to ceramics using the AMB method.

We would like to introduce the "Thick Copper Base Wiring Boards" and "AMB Boards" that we handle. The "Thick Copper Base Wiring Board" is available with three grades of insulation layers. We manufacture thick copper base boards for power modules as an alternative to DBC boards and AMB boards (high thermal conductivity and high current). We also handle "AMB Boards," which are thick copper boards bonded to ceramics using the AMB method. These thick copper ceramic boards are designed for power devices and offer high insulation, heat dissipation, and reliability. We can accommodate small quantities, so please feel free to consult with us. 【Specifications of Thick Copper Base Wiring Boards (Partial)】 <Insulation Layer> ■ Thermal Conductivity: 10.0 W/m·K Thickness: 120 μm ■ Young's Modulus: 53 GPa ■ Copper Thickness (Base): 0.5, 1.0, 1.5, 2.0, 3.0 mm ■ Copper Thickness (Wiring): 0.2, 0.3, 0.5, 0.8, 1.0 mm *For more details, please download the PDF or feel free to contact us.

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  • Printed Circuit Board

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