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substrate(aln) - List of Manufacturers, Suppliers, Companies and Products

substrate Product List

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Composite Material MMC for Solar Cell Manufacturing Equipment

High thermal conductivity surpassing ceramics! Achieving low thermal expansion comparable to silicon!

By combining SiC ceramics with metallic silicon, we have achieved high thermal conductivity that surpasses ceramics and low thermal expansion comparable to silicon. Thermal conductivity that exceeds SiC and AlN! By changing the composite ratio, various properties can be realized. Surface treatment (plating) is possible, and it can also be used for electrostatic chucks. It can be made larger than ceramics. We also offer a combination of SiC and aluminum. For more details, please refer to the PDF catalog.

  • Ceramics
  • Fine Ceramics
  • Other metal materials

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Electronic Ceramics (Thin film integrated circuit components & Substrates)

A thin film integrated circuit pattern will be formed on a ceramic substrate.

By using alumina with a purity of 99.9%, we provide fine circuit patterns (line/space=30um/30um) that enable operation in the 30GHz band required for next-generation wireless communication systems. 【Thin Film Integrated Circuits】 We pattern integrated circuits on various ceramic substrates. ●Side patterns (over 0.3t), and AuSn solder patterns is possible. ● Simultaneous mounting of conductors, thin film resistors, and thin film inductors is possible. ● The combination of our unique 99.9% alumina substrate and fine patterns allows for the formation of circuits with low dielectric loss and low noise in high-frequency bands. ● For substrate materials, we also accommodate aluminum nitride (ALN) substrates, quartz substrates, and more. 【High-Quality Alumina Substrates】 ● Dense ● The three-point bending strength is 660MPa, which is significantly higher than conventional products (about twice as much). ● Excellent electrical properties with low dielectric loss in high-frequency bands.

  • High frequency/microwave parts
  • Fine Ceramics
  • Circuit board design and manufacturing

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Thin-film integrated circuit components

Consistent production from low-loss ceramic substrates in the microwave band to thin film pattern formation. Providing high-quality products at low prices and short delivery times, from prototyping to mass production.

We provide thin film integrated circuit components with circuit formation on substrates that have undergone various through-hole processing and slitting. 【Features】 ○ Formation of side patterns (0.38t or more) and AuSn solder patterns ○ Simultaneous mounting of conductors, thin film resistors, and thin film inductors ○ Low loss and low noise circuit formation in high-frequency bands made possible by the combination of our unique 99.9% alumina substrate and fine patterns ○ Substrate materials: Aluminum nitride substrates (AlN substrates), quartz substrates, etc. ○ Total technology development, quality assurance, and problem-solving made possible by being a substrate manufacturer ○ We provide quality according to product functions and specifications, and we respond quickly to short delivery times and design changes. For other functions and details, please contact us.

  • Other electronic parts

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