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substrate(film) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Aug 27, 2025～Sep 23, 2025
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substrate Product List

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Flexible Printed Circuit Board "Low-Rebound FPC"

Flexible Printed Circuit Board "Low-Rebound FPC"

Customize softness! We offer a variety that meets low rebound needs!

We have revamped the lineup of Maruwa Manufacturing's thin FPC representative brand "MK Series" to offer variations that meet the demand for low rebound. Here are solutions for making devices thinner and more compact. 【Applications】 ○ Suppressing springback in thin LCD modules, etc. ○ Sliding applications in compact areas such as small camera modules, etc. For more details, please contact us or download the catalog.

  • Printed Circuit Board
  • Circuit board design and manufacturing

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Thin FPC "Low Resilience FPC"

Thin FPC "Low Resilience FPC"

Custom softness! We offer variations to meet low-rebound needs.

"Low-Rebound FPC" is a solution that addresses the challenges of making devices thinner and smaller. We have refreshed the lineup of our flagship thin FPC brand, the "MK Series," to offer variations that meet low-rebound needs. 【Features】 ■ In-house developed products ■ Customizable softness ■ Thinner and smaller devices ■ High flexibility and low recovery rate *For more details, please refer to the PDF document or feel free to contact us.

  • Other machine elements
  • Other electronic parts
  • others

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[Research Document] Global Market for Thick Film Substrates

[Research Document] Global Market for Thick Film Substrates

World Market for Thick Film Substrates: Single-layer Thick Film Substrates, Multi-layer Thick Film Substrates, Chip Resistors, Electronic Modules, Others

This research report (Global Thick Film Substrates Market) investigates and analyzes the current state and outlook for the global thick film substrates market over the next five years. It includes information on the overview of the global thick film substrates market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The market segments by type include single-layer thick film substrates and multi-layer thick film substrates, while the segments by application focus on chip resistors, electronic modules, and others. The regional segments are categorized into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa to calculate the market size of thick film substrates. It also includes the market share of major companies in the thick film substrates sector, product and business overviews, and sales performance.

  • Other services

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[Research Material] Global Market for Thick Film Circuit Boards

[Research Material] Global Market for Thick Film Circuit Boards

World Market for Thick Film Circuit Boards: Single-layer Thick Film Circuit Boards, Multi-layer Thick Film Circuit Boards, LEDs, Chip Resistors, Electronic Modules, Others

This research report (Global Thick Film Circuit Substrates Market) investigates and analyzes the current status and outlook for the global thick film circuit substrate market over the next five years. It includes information on the overview of the global thick film circuit substrate market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segments by type in the thick film circuit substrate market focus on single-layer thick film circuit substrates and multi-layer thick film circuit substrates, while the segments by application cover LEDs, chip resistors, electronic modules, and others. The regional segments calculate the market size of thick film circuit substrates by dividing them into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa. It also includes the market share of major companies in the thick film circuit substrate market, product and business overviews, and sales performance.

  • Other services

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Introduction to Color Filter Substrates

Introduction to Color Filter Substrates

Capable of supporting colorization for EL and electronic paper! Flexible glass color filter substrate.

Kiso Komamicro Co., Ltd. began mass production of color filters (CF) for liquid crystal displays (LCD) in 1993, following the completion of the Micro Technology Research Institute and Kiso Komagata Factory. In 2000, in response to the colorization of mobile phones, we adapted to mass production of reflective CF. Additionally, we can mass-produce bendable glass CF with high precision and complete barrier properties, known as aimic-CF. Aimic-CF features glass that is made as thin as possible, bonded to a film as a support, allowing it to accommodate curved surfaces. We are also capable of partial mass production and prototyping of thin film metal patterning, such as ITO. 【Color Filter Substrates】 ■ Color filters for liquid crystal displays ■ Bendable glass (aimic) color filters ■ Film-based color filters (PET, PEN, etc.) under development ■ Thin film patterning technology *For more details, please refer to our catalog or feel free to contact us.

  • Circuit board design and manufacturing

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Thin Film on Substrate: A-Z

Thin Film on Substrate: A-Z

We deliver high-quality and affordable crystals and materials from MTI Corporation in the United States.

We offer high-quality and affordable crystals and materials from MTI Corporation, a top-class company in the industry. You can purchase from as little as one piece. MTI's stock items can be delivered in as little as 1 to 2 weeks. For more details, please visit our website.

  • Secondary Cells/Batteries
  • Other metal materials

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Improving thermal conductivity of alumina substrates with printed circuit technology [For mounting power devices!]

Improving thermal conductivity of alumina substrates with printed circuit technology [For mounting power devices!]

Leveraging the strengths of a "ceramics substrate specialized manufacturer," we have achieved "high thermal conductivity of alumina substrates" through via formation technology and printed circuit technology!

In the implementation of power devices, where applications are expanding in areas such as home appliances and EV vehicles, expectations for "thermal conductivity performance of the substrate" are rising significantly. Through the mass production achievements of our flagship high-power LED packages, we have developed technologies to improve heat dissipation performance associated with higher power output. In particular, we have received many inquiries regarding "improving thermal conductivity using general-purpose alumina ceramic substrates compared to aluminum nitride substrates, which excel in thermal conductivity" for ceramic circuit boards. We have achieved improvements in thermal conductivity by applying through-hole processing technology (via formation) and printed circuit technology, filling the via sections of alumina ceramic substrates with "metallic materials," while using general-purpose alumina ceramic substrates. For high-power LED package substrates, we have achieved a thermal conductivity of "369 W/mk" with alumina ceramic substrates. If you are facing challenges with "thermal measures" for ceramic substrate implementation of high-power power devices, please consult with us.

  • Fine Ceramics
  • Circuit board design and manufacturing
  • Other electronic parts

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Residue-free low-temperature drying masking ink 'Peeelink MF'

Residue-free low-temperature drying masking ink 'Peeelink MF'

Newly developed masking ink! It leaves no residue and is less likely to leave peeling marks. It is halogen-free!

Peeelink MF" is a low-temperature drying masking ink that leaves no residue on the protected object after peeling. It can be applied through various methods such as screen printing, spray application, dispenser application, and brush application, making it suitable for processing shapes regardless of curvature. It is ideal for protecting electronic device displays and for paint masking. It complies with RoHS and REACH regulations, and does not produce contaminants even under environmental testing, ensuring safe use from an environmental perspective. 【Features】 ■ Film formation possible at low temperature in a short time (70℃/10min) ■ Easy to peel off with tape ■ Ideal for preventing scratches during shipping and processing ■ Halogen-free *For detailed information, please request through "Contact Us.

  • sub１.jpg
  • sub2.JPG
  • paint

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Dimatix Inkjet Head SG/PQ/QS/QE Board

Dimatix Inkjet Head SG/PQ/QS/QE Board

Fujifilm Dimatix inkjet head drive controller board SG/PQ/QS/QE control.

This is a Fujifilm Dimatix inkjet head drive controller board. It can control SG/PQ/QS/QE. The pulse width is variable, and there is an optional head drive waveform generation software. The maximum ejection cycle is 20kHz and it can be synchronized with a transport system encoder. It can be connected to a printing PC via a dedicated PCIe board, supporting up to 10 heads. Bitmap data can be used for printing, and there is also printing control software available. Ink circulation pumps are available for separate purchase. Dimatix SG/PQ/QS head development kit ⇒ Total price: ¥4,900,000 1 head control AMP board: ¥3,500,000 * USB interface / encoder synchronization * Please order in lots of 4: ¥1,400,000 (4 boards for 4 heads) Computer printing control software, CMYK compatible (our specifications, controls 8 heads) * License-free for the first time: ¥3,500,000 * Dimatix head supply is also possible. * Please consult us about RIP software, PDF data, 6 colors/8 colors, etc. * Ink circulation module for SG: ¥600,000

  • Other process controls
  • Other semiconductor manufacturing equipment

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SAMBA head printing control board USB 3.0 communication specification version

SAMBA head printing control board USB 3.0 communication specification version

Printing control board for FujiFilm Dimatix's SAMBA head G3L. Ultra-fast USB 3.0 communication specification version.

Printing control board for FujiFilm-Dimatix SAMBA Head G3L. Ultra-fast USB 3.0 communication specification version. High-speed label printing with the ability to update print data for each print (approximately 8 sheets/second). Print speed of 1m/second with the ability to update different print data for each print. - Equipped with the industry's fastest USB 3.0 communication function. * Maximum 200MB/second print data transfer when connecting one board to USB. * Print memory: 1GB equipped. Next print data can be transferred during printing. - Maximum ejection cycle: 120kHz. Can be synchronized with the transport system encoder. * Head temperature control (external) is possible. - 1200 dpi / water-based, UV, solvent, latex. - VersaDrop capability (multi-drop function). - Head drive waveform generation software is available. - Configurable as a CMYK color printer using multiple heads. - Bitmap data can be used for printing. - Printing control software that makes system construction easy is also provided. * User application DLLs can be supplied. - Ink circulation pump available for SAMBA head.

  • Other process controls

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