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substrate(fpc) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
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substrate Product List

121～135 item / All 199 items

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Ultra-fine circuit high-frequency flexible substrate

Ultra-fine circuit high-frequency flexible substrate

Combining PTFE base and low dielectric coverlay to produce various low-loss FPCs!

The "Ultra-Fine Circuit High-Frequency Flexible Substrate" is a flexible substrate designed for high-frequency applications in the GHz range, compatible with bare chip mounting. By using LCP (Liquid Crystal Polymer) with low dielectric properties as the core material and forming circuits using the SAP (Semi-Additive Process), it is possible to create transmission lines with a differential impedance of 100Ω at wiring pitches below 50μm. To accommodate wire bonding with bare chips, the mounting pads are treated with ENEPIG (Electroless Ni Pd Au plating) for surface treatment. One of the features of SAP is its high precision in circuit formation, with an accuracy of ±5μm, making it suitable for impedance control. *For more details, please download the PDF or contact us.*

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  • Wiring materials

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Flexible circuit board / Rigid-flexible circuit board

Flexible circuit board / Rigid-flexible circuit board

Turnkey connector implemented! A thin polymer resin film is used as insulation.

"Flexible substrates / Rigid-flexible substrates" are alternatives to conventional wiring connections using wires or ribbon cables. Flexible printed circuits can reduce space and weight while improving reliability. They are made by etching copper-clad materials and using a thin polymer resin film as insulation between the conductor circuit patterns. In electronic device enclosures, turnkey subassemblies may be utilized, incorporating aerospace-grade connectors at the ends for space-saving and lightweight assembly. 【Features】 ■ Single-sided and double-sided flexible substrates ■ Multi-layer and rigid-flexible substrates ■ Electrical and optical flexible substrates ■ Specialized for IPC 6012/6013 Class 3, Types 1 to 4 *For more details, please refer to the PDF materials or feel free to contact us.

  • Board to Board Connectors
  • Printed Circuit Board

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Surprisingly Unknown! What Are Printed Circuit Boards? <Basic Knowledge>

Surprisingly Unknown! What Are Printed Circuit Boards? <Basic Knowledge>

Used in very familiar items in everyday life! Its main role is to connect electronic components with a path for electricity to flow!

A "printed circuit board" is an electronic component used in everyday items around us. Its main role is to attach electronic components such as resistors, ICs, and capacitors onto a non-conductive material through methods like soldering, connecting the components with conductive paths. By transmitting electricity through the electronic circuits of this product, it enables the convenient use of electrical devices in our surroundings. 【Types of Printed Circuit Boards】 ■ Rigid Board (PWB) = Hard, flat board ■ Flexible Board (FPC) = Bendable ■ Rigid-Flex Board = Rigid board + Flexible board ■ Metal Base Board = Board that enhances heat dissipation *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Foresight Inc. Company Profile

Foresight Inc. Company Profile

We aim to be a trading company focused on realizing customer solutions as our top priority, through development and proposals.

Foresight Co., Ltd. is not just a traditional trading company that sells mere "products" in the flat panel display industry, but aims to be a development and proposal-oriented trading company that prioritizes realizing customer solutions. In the industrial sector, we are forced to undergo structural reforms, and waves of technological innovation are continuously emerging, demanding rapid changes and developments. In this environment, we will leverage the information network we have cultivated over many years to pursue speedy and dynamic business development. 【Sales Items】 ■ Touch panel related components ■ LCD related components ■ OLED related components ■ Equipment related ■ Lamination process related ■ New development *For more details, please refer to the PDF materials or feel free to contact us.

  • Touch Panel
  • LCD display
  • Processing Contract

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High Current Compatible Flexible Circuit Board BigElec

High Current Compatible Flexible Circuit Board BigElec

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

Big Elec is a flexible printed circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-sectional area. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high current-compatible electronic components. The low inductance of Big Elec reduces voltage spikes, contributing to the reliability of high current-compatible electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible printed circuit boards. 【Feature 3】 High Design Freedom It ensures design freedom and usability similar to printed circuit boards. Pattern wiring and external shapes can be customized according to requirements. It also supports the mounting of electronic components and connectors using paste solder.

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  • Harness

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Long-sized printed circuit board ☆ up to 1500mm ☆

Long-sized printed circuit board ☆ up to 1500mm ☆

Leave everything related to printed circuit boards to us! We can handle everything from single-sided to build-up, aluminum core, and rigid-flex, even in small quantities.

Our company provides electronic devices, including printed circuit boards, based on our unique value chain and network with "high quality," "low price," and "short delivery time." ---------------------------- ◆ Quality <Q> We ensure reliable quality by having a QA organization centered around Japanese personnel that works closely with the factory. We can accommodate from AW design, enabling designs that consider manufacturing. ◆ Price <C> Depending on the type and quantity of the circuit boards, we can procure them at prices 30% to over 50% lower than domestic products. ◆ Delivery <D> We have a dedicated organization for delivery management, minimizing delivery issues through detailed management. ---------------------------- Our feature is that we can provide "Chinese-produced products at low prices with Japanese quality." We can flexibly utilize short delivery domestic manufacturing and low-cost overseas manufacturing, accommodating a wide range from single-sided boards to build-up mass production. We have our own factory in China, and we are also equipped to produce special-shaped boards, such as long boards over 1 meter and thin boards of 0.2 mm. *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board

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Micro Module Technology Corporation - Business Overview

Micro Module Technology Corporation - Business Overview

Support for miniaturization and modularization of circuit implementation boards using bare chip implementation, from concept to prototype to mass production!

We pursue micro-joining technology for bare chip mounting and inter-board connections, supporting the creation and realization of high-value-added products and the enhancement of global competitiveness. From concept to development design, prototyping, evaluation, analysis, and small to medium-scale mass production, we provide a one-stop service at our in-house factory (clean room class: 100 to 1000). We will realize bare chip mounting, which has been difficult to implement cost-effectively for small-scale production, through our module technology and manufacturing capabilities. **Benefits of Bare Chip Mounting** - **Increased Added Value** → Miniaturization and thinning expand product applications and create new markets. → Incorporating semiconductor backend processes enhances manufacturing added value. - **Improved Cost Competitiveness** → Miniaturization and standardization improve production efficiency and reduce material costs. → Compared to miniaturization through System on Chip (SoC), development costs can be reduced to about one-tenth. - **Enhanced Performance** → The elimination of secondary wiring in semiconductor packages significantly shortens wiring length, improving performance degradation due to wiring loss. - **Environmental Considerations** → Reducing the number of materials used can decrease waste.

  • Circuit board design and manufacturing

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We can accommodate custom-made and custom products starting from just one piece to meet your company's needs.

We can accommodate custom-made and custom products starting from just one piece to meet your company's needs.

If the standard product doesn't fit, if you would like a different shape, or if there are some processes that cannot be done, please feel free to consult with us! *Q&A materials will be provided.

If you have requests for custom or special products tailored to your company's challenges, please feel free to consult with us. Even in the conceptual stage, you can specify items that resemble hand-drawn sketches or sample products featured on our website. We will ask for necessary information, such as the intended use and the environment in which you want to use the product, and gradually determine the specifications while consulting with you. Even if you are unsure about technical aspects, we will support you in the product manufacturing process. 【Are you facing any of these issues?】 "I just can't make it work with standard products." "I want the shape to be more like this." "There are some processes that can't be done." "I want to reduce costs during the design phase with an eye on mass production," etc. 【Examples of production】 ■ Increased thickness of polyimide material ■ Delivery of 6mm PCB material ■ Large hole drilling processing of 750×500 ■ Thermal press processing of test materials Additionally, if you have requests for materials, we can source them, and we can also look for manufacturer-specified material specifications, inks, or materials that meet your needs, so please consult with us once. *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing

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ＦＰＣ

ＦＰＣ

With our extensive experience and production technology, we provide timely FPCs that satisfy everyone at any stage of development cooperation, prototyping, and mass production.

Single-sided FPC, double-sided FPC, multi-layer FPC, low-rebound FPC, used in various applications such as space and aerospace equipment, medical devices, industrial equipment and robots, car electronics, mobile devices and computer-related equipment, cameras and movie equipment, and electronic components.

  • Board to FPC connector

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Flexible Printed Circuit (FPC) Comprehensive Catalog

Flexible Printed Circuit (FPC) Comprehensive Catalog

A large number of flexible circuit boards that are thin and lightweight, making them excellent for space-saving solutions!

This catalog features a wide range of "Flexible Printed Circuits (FPC)" that our company handles. We offer products such as "High-Flex FPC," which demonstrates excellent bending performance even in narrow spaces, "Self-Supporting Sliding FPC," which can slide and bend while remaining upright in the air, and "Power FPC," which can handle high currents. 【Contents】 ■ FPC Product Concepts ■ Areas of Achievement ■ Process Overview ■ What is a Flexible Printed Circuit (FPC)? ■ Product Introduction *For more details, please refer to the PDF document or feel free to contact us.

  • cable

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[COMNEXT2024 Exhibition] FPC and Rigid FPC with ultra-short delivery times

[COMNEXT2024 Exhibition] FPC and Rigid FPC with ultra-short delivery times

[COMNEXT2024 Exhibition] "Want it now when you need it" Matsuwa Sangyo offers astonishingly short delivery times for FPC and rigid FPC!

A leading domestic manufacturer in short delivery times for printed circuit board production, Matsuwa Sangyo offers astonishingly short delivery times for FPC boards and rigid FPC boards as well. 1-layer and 2-layer boards ⇒ as fast as 2 days Multilayer and rigid FPC boards ⇒ as fast as 5 days *Delivery times may vary depending on quantity, reinforcement locations, and specifications. "When you want it, you want it right away" and "When you're in trouble, you want it right away." Please feel free to reach out to us. ★Confirmed participation in COMNEXT2024 (June 24-28 at Tokyo Big Sight, South Exhibition Hall) We look forward to seeing you at booth number '13-31' in the 5G/6G Material World!

  • Printed Circuit Board

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2005 Two-layer FPC/COF Market Demand Outlook and Two-layer CCL Production Trend Analysis

2005 Two-layer FPC/COF Market Demand Outlook and Two-layer CCL Production Trend Analysis

2005 Two-layer FPC/COF Market Demand Outlook and Analysis of Two-layer CCL Production Trends

Focusing on the rapidly growing two-layer FPC, we conducted demand forecasting by application and clarified trends in the market, applications, manufacturers, and types. Additionally, regarding the two-layer CCL, which is facing supply constraints due to a sharp increase in demand, we investigated and analyzed the production status and expansion plans of each two-layer CCL manufacturer to clarify the current supply and demand situation. This provides an outlook on the future of two-layer FPC/CCL.

  • Printed Circuit Board
  • Adhesive tape

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Flexible substrate short delivery service (FPC - flexible)

Flexible substrate short delivery service (FPC - flexible)

With Taiyo Techno Rex's FPC short delivery service, high quality and smooth transition to mass production can be achieved.

Unified management from prototype to mass production! ■ Reliable track record ■ One-stop service ■ Flexible responsiveness ■ Short delivery times, high quality, latest technology

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  • Printed Circuit Board

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FPC - "Technical Information" - Updated September 2025

FPC - "Technical Information" - Updated September 2025

I would like to introduce the "Technical Information" related to FPC.

● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.

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  • Printed Circuit Board

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