1～12 item / All 12 items
This is a flexible substrate, FPC, and flexible board that is effective for wiring related to large-scale devices. FPC.
Adopted as an alternative to cables, we propose a reduction in assembly costs (improved wiring efficiency). It is used in display devices and industrial robots. FPC.
It is a flexible circuit board that can be repeatedly stretched and contracted, and can follow deformation. FPC
While general flexible materials can be bent, they face challenges in folding and stretching. Due to their flexibility, stretchability, and ability to conform, they are expected to be used in a wide range of fields for flexible electronics devices, including wearables, sensors, displays, robotics, as well as pressure sensors and seat heaters. FPC.
We will support and propose ideas to enhance development capabilities, working closely with the development technology personnel! FPC
- Circuit investigation - Component investigation (creating parts list, investigating constants and sizes, collecting catalogs) - Design specification investigation (minimum hole diameter, minimum L/S investigation) - Substrate destruction investigation (layer composition, plating thickness, inner layer pattern arrangement) - Substrate non-destructive investigation (X-ray transmission, CT images) - Assembly analysis investigation (solder composition, wettability, bonding strength, etc.) - Quality investigation (thermal shock testing, temperature and humidity cycles, etc.) FPC
It is a flexible substrate, FPC, flexible circuit board with noise reduction structure.
This is a flexible substrate with a noise countermeasure structure against radiated noise from FPC, due to the high-speed transmission signal. Suppressing noise radiated by high-speed circuits is important.
![[PCB Design and Product Design] FPC and Flexible Circuit Boards](https://image.mono.ipros.com/public/product/image/51a/2000509961/IPROS88069959853256374559.jpeg?w=280&h=280)
We will provide design proposals that consider product requirements and mass production processes from the prototype stage! FPC
- Software design and embedded software development - Hardware development and electronic circuit design - Printed circuit board pattern design (digital/analog/high frequency) - 3D CG design, design creation, resin, metal cutting - Product graphic design - Mechanical design (enclosures/jigs/demo units) FPC
It is a flexible substrate that combines heat resistance and transparency. FPC
Compared to glass materials, it is possible to create unique design concepts not only for flat surfaces but also for curved surfaces, folding, and wrapping, thereby expanding the design possibilities for mounted devices. It is expected to be used as a substitute for glass substrates in applications such as: - Transparent conductive substrates for touch panels - Organic EL and LED lighting substrates - Displays for mobile phones. Additionally, bare chip LEDs will be implemented on transparent polyimide substrates using wire bonding, followed by resin encapsulation. Light will pass through the transparent polyimide and beautifully illuminate the opposite side.
Printed Circuit Board Thermal Fluid Analysis Service Thermal Management Support and Assistance FPC
We will conduct thermal fluid analysis (thermal simulation) during the pattern design stage of printed circuit boards. This includes not only predicting heat generation from heat-generating components and analyzing the heat of the patterns, but also considering thermal measures for the entire module, including the housing, from various perspectives. We will provide proposals for thermal measures. Additionally, we will support and assist in the establishment of thermal measures in the medium to long term, not only through our contracted services for pattern design and thermal fluid analysis (thermal simulation). Flexible substrates, flex PCBs, FPC. Achievements: Automotive junction boxes (J/B), relay boxes (R/B), room lamp FPC.
We manufacture, sell, and support medical devices for basic research. FPC
- Research and development in the field of biomedical engineering - Design and manufacturing of customized products for research - Design and manufacturing of wearable sensor components for clothing (monopolar electrodes/ECoG electrodes/EEG electrodes) - Formation of various metal thin film circuits - Parylene coating We design and manufacture sensors and electrodes necessary for physiological experiments on experimental animals, such as ECoG electrodes (for research use). We develop medical devices required in clinical research core hospitals and laboratories. FPC
We propose an extremely thin and highly flexible FPC.
It excels in various characteristics such as thinness, lightness, flexibility, resistance to bending, and resistance to breaking. Due to its excellent properties, it is used in movable parts such as sliding and twisting.
It is a flexible substrate that allows for a highly reliable connection.
By partially removing the base film, it is possible to form a conductor. By narrowing the pattern width, reliable connections to the opposing circuit or device can be achieved, similar to wire bonding. It is used in areas that require high density and high reliability, such as probes.
![[Component Assembly and Various Manufacturing] Flexible Circuit Boards, FPC, Flexible Boards](https://image.mono.ipros.com/public/product/image/308/2000509612/IPROS45740238299848604956.jpeg?w=280&h=280)
From precision component micro-assembly to assembly wiring and electrical testing, leave it all to us!
- SMD mounting, POP mounting - Bare chip mounting (wire bonding, flip chip mounting) - Device resin encapsulation - Cable and housing assembly - Component replacement, modification - Electrical inspection, operational verification
3D circuit board [MID wiring (Molded Interconnect Device)] / substrate with embedded electronic components
Our company provides contract design and development of electronic devices (ODM) as well as contract manufacturing services for electronic devices (EMS). We are involved not only in the design and manufacturing of flexible printed circuits but also in circuit design, structural design, software development, cable and harness production, and we collaborate with product development personnel from the planning stage to bring products to market. Various industries are advancing in miniaturization and weight reduction. To differentiate ourselves from competitors while considering mass production efficiency, we propose a wide range of solutions, not limited to flexible printed circuits, including 3D-MID wiring cases with conductor formation on resin housing surfaces and embedded substrates that incorporate electronic components into printed circuit boards. Etching, plating, vacuum deposition, EB deposition, sputtering, thin film formation, photolithography, ion plating, thermal CVD, plasma CVD, dry etching, film ITO, film metal patterning, fine patterns, WLP, silicon wafers, RDL, bump formation, TEG, dry etching, wet etching, MEMS, organic EL, metallization, glass etching, semi-additive etching, transparent resist, transparency, high heat-resistant resin.
