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Analysis Software(3d) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
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Analysis Software Product List

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[Case Study] Plasma Analysis of "Particle-PLUS" Dual Frequency CCP

[Case Study] Plasma Analysis of "Particle-PLUS" Dual Frequency CCP

Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of Dual Frequency CCP" Simulation Case

This is a case study on plasma analysis of CCP (Capacitively Coupled Plasma) devices. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform high-speed simulations even when there are multiple electrodes or when applying overlapping frequencies. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, efficiently handling complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

  • Other analyses

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[Case Study] Cleaning Process Using Particle-PLUS: CCP

[Case Study] Cleaning Process Using Particle-PLUS: CCP

Introduction of Particle-PLUS Analysis Case: "Cleaning Process by CCP" Simulation Case

This is an analysis case regarding CCP (Capacitively Coupled Plasma) etching, which is one of the representative dry etching methods. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform simulations of etching rates and other parameters at high speed. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, results can be obtained quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports both 2D and 3D, allowing for efficient analysis even with complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

  • Other analyses

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Magnetron Sputtering Analysis Software 'Particle-PLUS'

Magnetron Sputtering Analysis Software 'Particle-PLUS'

"Particle-PLUS" is a plasma and rarefied fluid analysis software that specializes in magnetron sputtering devices using the particle method.

"Particle-PLUS" is a simulation software suitable for the research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - It can perform advanced physical model analysis such as CCP and external circuit models. - It excels in plasma simulation for low-pressure gases, where calculations using fluid models are challenging. - It supports both 2D and 3D, allowing for efficient analysis even with complex models. - As a strength of our in-house developed software, it can perform CCP and magnetron sputtering calculations with standard features, and customization to fit customer devices is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Other analyses

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Particle Method 3D Rarefied Fluid Analysis Software 'DSMC-Neutrals'

Particle Method 3D Rarefied Fluid Analysis Software 'DSMC-Neutrals'

Analysis of gas flow under low pressure conditions can be performed with analysis software that also supports rarefied gases (rarefied fluids).

**Features** - Adopts unstructured mesh, allowing for calculations that directly reflect the complex shapes of actual devices. - High parallel efficiency enables quick computation results even for large-scale geometries. - Utilizes a particle method, ensuring convergence to a solution even with poor-quality computational grids, unlike fluid models. - Comprehensive technical support ensures that even those new to simulation or busy with experiments can reliably achieve results. **Supports Various Cases** - Simulation of rarefied gas flow in a vacuum chamber. - Simulation of thin film generation in semiconductor manufacturing. - Chemical vapor deposition (CVD), organic light-emitting diode (OLED), molecular beam epitaxy (MBE). - Film deposition simulations involving chemical reactions like CVD. **Outputs Various Calculation Results** - Calculation of chemical reactions. - Calculation of chemical reactions from Arrhenius-type reaction data. - Calculation of dissociation, recombination, and molecular (atomic) exchange reactions. - Ability to set multiple reaction equations on the GUI. *For more details, please refer to the catalog or feel free to contact us.*

  • Other analyses
  • Contract Analysis

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[Example] Particle-PLUS Opposing Target Sputtering

[Example] Particle-PLUS Opposing Target Sputtering

Introduction of analysis examples using "Particle-PLUS": "Opposing Target Sputtering"

"Particle-PLUS" is a simulation software suitable for the research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations with fluid models are challenging. - It supports both 2D and 3D, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Other analyses

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[Example] "Particle-PLUS" Counter Target Type Sputtering

[Example] "Particle-PLUS" Counter Target Type Sputtering

Introduction of Particle-PLUS Analysis Case: "Simulation Case of Al Thin Film Fabrication Using Face-to-Face Target"

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for simulations of the entire device. - It excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - It supports both 2D and 3D, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Electron and ion density distribution/temperature distribution/generation distribution - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Neutral gas density distribution/temperature distribution/velocity distribution, etc. *For more details, please feel free to contact us.

  • Other analyses

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[Example] Mass analysis of the "Particle-PLUS" ion beam.

[Example] Mass analysis of the "Particle-PLUS" ion beam.

Introduction to Particle-PLUS Analysis Case: "Ion Beam Mass Analysis and Electrostatic Acceleration" Simulation Case

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It excels in low-pressure plasma analysis. - By combining axisymmetric models and mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It specializes in plasma simulations in low-pressure gases, where calculations with fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

  • Other analyses

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[Example] "Particle-PLUS" RF Magnetron Sputtering

[Example] "Particle-PLUS" RF Magnetron Sputtering

Introduction to Particle-PLUS Analysis Case: "RF Magnetron Sputtering Analysis" Simulation Example

This is an analysis case of RF magnetron sputtering, which is one of the film deposition methods using process plasma. Particle-PLUS specializes in plasma analysis within vacuum chambers and can quickly simulate deposition rates and other parameters. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, results can be obtained quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, efficiently handling complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

  • Other analyses

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[Example] Particle-PLUS: RF Magnetron for Dielectric Targets

[Example] Particle-PLUS: RF Magnetron for Dielectric Targets

Introduction of Particle-PLUS Analysis Case: "RF Magnetron Sputtering Analysis of Dielectric Target" Simulation Case

This is an analysis case of RF magnetron sputtering, which is one of the film deposition methods using process plasma. Particle-PLUS specializes in plasma analysis within vacuum chambers and can quickly simulate deposition rates and other parameters. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can obtain results quickly without the need for full device simulations. - Specializes in plasma simulations in low-pressure gases, where fluid modeling is challenging. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, efficiently handling complex models. - As a strength of our in-house developed software, customization to fit customer equipment is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.

  • Other analyses

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Semiconductor plasma analysis software 'Particle-PLUS'

Semiconductor plasma analysis software 'Particle-PLUS'

"Particle-PLUS" is a plasma and rarefied fluid analysis software that excels in ICP and CCP analysis using particle methods.

"Particle-PLUS" is software suitable for research and development of devices using plasma, compatible with ICP and CCP. - Excels in simulations of low-pressure gases where fluid modeling is difficult - Calculation functions for inductive heating for ICP simulations - Advanced physical model analysis such as CCP and external circuit models - Capable of simultaneously simulating ICP and CCP - Supports 2D and 3D, efficiently analyzing complex models - As a strength of our in-house developed software, customization to fit customer devices is possible ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD), etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us at sales@wavefront.co.jp.

  • Other analyses

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[Inventor Utilization Case] Sato Parts Co., Ltd. Kanto Factory

[Inventor Utilization Case] Sato Parts Co., Ltd. Kanto Factory

The initial stage of design is very easy! A case that dramatically improved design efficiency and design quality.

We would like to introduce a case where Sato Parts Co., Ltd., an electrical components manufacturer, implemented our product 'Autodesk Moldflow Adviser.' The company outsources mold manufacturing, and traditionally, they would proceed by making a mold first and then iteratively refining it through four or five trials. However, after introducing our product, they began verifying mold designs with resin flow analysis before placing orders, providing the results along with 3D models and drawings to the mold manufacturing factory. As a result, the number of retries significantly decreased, and the quality of the finished products greatly improved. [Case Overview] <Challenges> - Questions such as "Why does shrinkage occur here?" remained unresolved, and they could only find out by actually molding. <Result> - The number of retries significantly decreased, and the quality of the finished products greatly improved. *For more details, please refer to the PDF document or feel free to contact us.

  • Other CAD related software
  • 3D CAD

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Heat Transfer Fluid Analysis Software WindPerfectDX

Heat Transfer Fluid Analysis Software WindPerfectDX

Have you ever seen the wind? 【For the architecture and civil engineering industry】 Heat transfer fluid analysis software WindPerfectDX

● WindPerfectDX 2012 Edition 2 Released! It has been reborn as software that can solve problems in the fields of architecture and civil engineering, from simple to complex and large-scale, with easy operations for airflow and temperature. ―――――― ◆ Features 1. Wind environment and external airflow simulation 2. Heat island simulation 3. Natural ventilation simulation 4. Wind load simulation (planned for release) 5. Other simulations (rainwater drainage and snow retention issues, performance verification of cool bits, and other thermal fluid-related problems) ―――――― <Simple interface, 3D CAD data import function, and diverse result visualization features> - With an easy-to-use interface, built-in various data, and excellent 3D graphics visualization capabilities, it is widely usable from beginners in analysis to heavy users of CFD. - By incorporating CAD data import and CFD parts functionality, it strongly supports simulation operations in BIM. - Equipped with numerous convenient features for various analyses, including wind damage rank evaluation, radiation calculation, PMV evaluation, condensation determination, heat island assessment, parameter evaluation, and airflow thermal balance checks.

  • Thermo-fluid analysis
  • simulator
  • Contract Analysis

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Example: Warpage countermeasures for connectors in injection molding.

Example: Warpage countermeasures for connectors in injection molding.

By collaborating with 3D TIMON, we automatically adjust the thickness of solid element models, thereby suppressing warping deformation.

We will introduce a case where warping was minimized by changing the thickness of solid elements. The analysis was conducted using the "basis vector method," which modifies the shape by moving the nodes of the finite element model without using CAD. Several patterns (basis vectors) of the desired shape were prepared from the initial model and combined. As a result of the optimization, the sum of squares of warping improved by 33% to 4.9480e-004 compared to the initial shape, and the maximum warping amount (mm) improved by 12% to 3.8607e-002. [Case Overview] ■ Optimization Conditions - Design Variables: Thickness A, B - Sampling: Initially LHS 20 points, Approximate optimal solution + 10 recommended points - Approximate Model: CRBF (Convolutional RBF) ■ Analysis: Basis Vector Method *For more details, please refer to the PDF document or feel free to contact us.

  • Other analyses

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Fiber Orientation Image Analysis Software ExFactAnalysisFiber

Fiber Orientation Image Analysis Software ExFactAnalysisFiber

Fiber Orientation Distribution 3D Image Analysis Software ExFact Analysis Fiber

"ExFact Analysis for Fiber" is a three-dimensional image analysis software that evaluates the three-dimensional structure and morphology of materials with continuous structures of elongated fibers, such as textiles, fuel cells, and wires, when imaged using techniques like X-ray CT. By using imaging technologies such as X-ray CT, confocal laser microscopy, and TEM tomography to capture industrial products and materials, it can continuously output cross-sectional images and construct three-dimensional representations. By vectorizing such three-dimensional images and describing their complex structures, it is possible to statistically evaluate and analyze the morphology and distribution of particles and voids, as well as the orientation of fibers from various perspectives. [Features] ■ Continuously outputs cross-sectional images and constructs three-dimensional representations ■ Statistically evaluates and analyzes the morphology and distribution of particles and voids, as well as the orientation of fibers from various perspectives *For more details, please refer to the catalog or feel free to contact us.

  • Contract Analysis
  • Image analysis software
  • Image Processing Software

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Explanation document "Causes of Designer CAE Failures and Points for Success" *Currently distributed*

Explanation document "Causes of Designer CAE Failures and Points for Success" *Currently distributed*

Introducing the selection points for CAE with illustrations. Information on low-cost platforms equipped with abundant features is also included.

We are currently distributing materials that outline key points to consider for efficiently advancing product development using "CAE." The materials introduce common post-implementation concerns in a conversational format, while clearly explaining points to consider for solving these issues, making it easy for beginners to understand. [Contents] ■ Story during implementation (during/after implementation) ■ Common post-implementation concerns ■ Examples of points for success ■ Introduction to ANSYS Discovery *For more details, please refer to the materials. Feel free to contact us with any inquiries.

  • Company：IDAJ
  • Price：Other
  • Other analyses

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