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Atmospheric Pressure Plasma Device Product List and Ranking from 60 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Jun 03, 2026~Jun 30, 2026
This ranking is based on the number of page views on our site.

Atmospheric Pressure Plasma Device Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Jun 03, 2026~Jun 30, 2026
This ranking is based on the number of page views on our site.

  1. null/null
  2. JFEプラントエンジ Tokyo//others
  3. ジャパンクリエイト Saitama//Testing, Analysis and Measurement
  4. 4 魁半導体 Kyoto//Educational and Research Institutions
  5. 5 栗田製作所 本社・京都事業部 Kyoto//Industrial Electrical Equipment

Atmospheric Pressure Plasma Device Product ranking

Last Updated: Aggregation Period:Jun 03, 2026~Jun 30, 2026
This ranking is based on the number of page views on our site.

  1. Handheld Atmospheric Pressure Plasma Treatment Device "Piezo Brush PZ3"
  2. Digital Oil Checker "Wendy" JFEプラントエンジ
  3. Single Leaf Spin Spray Cleaning Device SRC-15001 ジャパンクリエイト
  4. 4 Liquid Pulse Plasma Generation Power Supply MPP-HV04 栗田製作所 本社・京都事業部
  5. 5 Dry etching device RIE-10NR (parallel plate type RIE device) サムコ

Atmospheric Pressure Plasma Device Product List

91~120 item / All 171 items

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Dry etching equipment

Switching between RIE mode and DP mode is possible! Reduction of metal contamination through special surface treatment.

The "Dry Etching Equipment" is a mass production device capable of fully automatic continuous processing of substrates up to φ12 inches. It features a dual-frequency independent application method that reduces metal contamination through special surface treatment. We also offer multi-chamber specifications and various custom-made options. This versatile device enables etching, ashing, and ion cleaning by switching gas types and plasma modes. 【Features】 ■ Switchable between RIE mode and DP mode ■ Reduction of metal contamination through special surface treatment ■ Compact footprint ■ Dual-frequency independent application method ■ Ultra-low temperature cooling stage *For more details, please refer to the PDF materials or feel free to contact us.

  • Etching Equipment
  • Atmospheric Pressure Plasma Device

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Organic EL evaporation device

You can freely choose from the plasma cleaning chamber, organic deposition chamber, electrode deposition chamber, sealing chamber, and more!

The "Organic EL Deposition Device" is a multi-chamber system suitable for device and material development. It is capable of processing from pre-treatment to film formation and sealing without exposure to the atmosphere. Depending on the purpose, you can freely choose from a plasma cleaning chamber, organic deposition chamber, electrode deposition chamber, sealing chamber, etc. 【Features】 ■ Supports substrate sizes up to 300mm ■ Deposition cells can be selected from various materials and sizes ■ Can be combined with CVD chambers, sputtering chambers, etc. ■ Custom orders can also be manufactured ■ Sample processing is conducted using a demo machine *For more details, please refer to the PDF document or feel free to contact us.

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  • Evaporation Equipment
  • Atmospheric Pressure Plasma Device

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Pressurized RTA device

Maximum substrate heating temperature of 1000℃! Reduces element loss specific to the substrate surface heating process!

The "Pressure RTA Device" is a product that can handle processes from vacuum to pressurization (0.9 MPaG). The heating source is a halogen lamp, and the heating rate can reach up to 150°C/sec, achieving excellent substrate temperature distribution and gas flow methods. This device can be used for applications such as semiconductors, MEMS, and electronic components, enabling high-speed thermal oxidation, crystallization, and annealing treatments on the substrate surface. 【Features】 ■ Reduces element loss specific to the heating process ■ Capable of handling processes from vacuum to pressurization (0.9 MPaG) ■ Enables high-speed thermal oxidation, crystallization, and annealing treatments on the substrate surface ■ Achieves excellent substrate temperature distribution and gas flow methods ■ Compatible with tray transport ■ Multi-chamber specifications can also be manufactured *For more details, please refer to the PDF document or feel free to contact us.

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  • Heating device
  • Annealing furnace
  • Atmospheric Pressure Plasma Device

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Damage-free adhesion and wettability enhancement! Atmospheric pressure wide-width low-temperature plasma treatment machine.

Demo units available! We will create samples free of charge for the first time. Inline atmospheric pressure plasma treatment with low-temperature, damage-free using inexpensive gas!

If you are having trouble with surface treatment machines, please feel free to contact us. We have a variety of treatment devices including plasma treatment machines, corona treatment machines, and frame treatment machines. Axis Corporation's atmospheric pressure plasma is effective for improving adhesion, bonding, hydrophilicity, printability, coating, painting, and pre-treatment for adhesion on materials such as resins, glass, and metals, as well as for cleaning applications like the removal of organic substances. If you are interested in surface activation of metals, glass, or resins, please give it a try. We can quickly conduct wettability confirmation tests at our company. We always have various gases such as N2, O2, and H2 on hand, and if you bring samples, we can process them immediately. Small electrodes are easy to install on existing lines. Since it is potential-free, it can treat objects without causing damage, making it effective for processing delicate surfaces like optical films and metal foils. You can achieve uniform surface treatment without worrying about breakthrough. We also have various demo machines besides plasma. For more details, please visit our company website!

  • Plasma Generator
  • Plasma surface treatment equipment
  • Other surface treatment equipment
  • Atmospheric Pressure Plasma Device

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Improved adhesion and wettability! Atmospheric pressure plasma treatment device ULS

The small nozzle allows for flexible installation locations. It can handle narrow spaces! Demo units are available! Sample creation is possible!

It is easy to install and handle with a market minimum class plasma nozzle. It weighs only 280g! Despite its small size, it can achieve high-speed plasma processing with a maximum output of 1000W. It operates using only compressed air, without the need for special gases. The touch panel allows for easy operation, and the output can be freely adjusted. A maximum of three nozzles can be mounted on a single transmitter. It is also possible to create samples with a demo unit or conduct on-site tests with a rental.

  • Other processing machines
  • Resin processing machine
  • Atmospheric Pressure Plasma Device

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Surface modification with a plasma treatment machine! Achieving improved adhesion and wettability.

Nozzle widths from 10mm to 70mm can be easily replaced with simple work. One machine can accommodate a wide range of applications.

Plasma treatment is a surface modification technology that achieves adhesion effects by changing the chemical bonds through functional groups generated on the surface. By discharging in the air, the electrons, ions, and radicals generated by the plasma come into contact with the substrate surface. The molecules on the substrate surface react with the ions and electrons in the plasma, producing hydrophilic functional groups, activating the surface, and improving adhesion and wettability (i.e., the effects of intermolecular forces and van der Waals forces). By removing residual organic materials and oxides on the surface, surface activation and cleaning effects can also be obtained. RAantec's plasma treatment machines have two types of nozzles: Plasmajet (5 - 10mm) and Plasphere (20 - 70mm). The spot-type Plasmajet is suitable for processing narrow gaps and thin areas, as well as for pre-treatment before printing on cables and wires. The Plasphere is a nozzle for larger areas, allowing for easy replacement of the tip nozzle from 20mm to 70mm. It is suitable for surface modification and pre-treatment of larger resin and metal surfaces. For more detailed information, please visit our blog. https://www.kbrasch.co.jp/blog/2021/03/31/302

  • Other processing machines
  • Plasma surface treatment equipment
  • Atmospheric Pressure Plasma Device

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Atmospheric Pressure Plasma Device MyPL-Auto Series

High-density plasma is generated over a large area by a unique reactor head!

Facilitating the construction of mass production inline systems for large workpieces such as semiconductor IC pad cleaning, FPC substrates, and LCD glass substrates, achieving reductions in capital investment and running costs!

  • Plasma surface treatment equipment
  • Molding Equipment
  • Circuit board processing machine
  • Atmospheric Pressure Plasma Device

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Atmospheric Pressure Plasma Device ILP-Inline Series

High-density plasma is generated over a large area by the unique reactor head!

Facilitates the construction of mass production inline systems for large workpieces such as semiconductor IC pad cleaning, FPC substrates, and LCD glass substrates, achieving a reduction in capital investment and running costs!

  • Molding Equipment
  • Circuit board processing machine
  • Plasma surface treatment equipment
  • Atmospheric Pressure Plasma Device

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[Data] Atmospheric Pressure Plasma Generation Device

Publication of topics such as 'Mechanism of Atmospheric Pressure Plasma Generation' and 'Features of Atmospheric Pressure Plasma Devices'!

This document contains information about the "Atmospheric Pressure Plasma Generation Device." We have developed a new plasma head for the atmospheric pressure plasma device, which generates superior plasma compared to conventional methods. This surface treatment device is effective in dry processes such as improving adhesion for difficult-to-bond materials, enhancing wettability, and increasing cleaning effects. Please take a moment to read it. 【Contents (partial)】 ■ What is plasma? ■ Mechanism of atmospheric pressure plasma generation ■ Atmospheric pressure plasma treatment for improved printing ■ Features of atmospheric pressure plasma devices ■ Methods for confirming plasma treatment effects (contact angle measurement) *For more details, please refer to the PDF document or feel free to contact us.

  • Plasma Generator
  • Plasma surface treatment equipment
  • Atmospheric Pressure Plasma Device

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Atmospheric pressure plasma treatment device for lead frames

We process at low temperatures and high speeds using an independent plasma source. It is possible to handle samples that were difficult to process conventionally, such as lead frames and films.

- Low-temperature treatment: Processing is possible even with substrates that have low heat resistance. - High-speed processing: High-speed processing is possible with a linear head up to 75mm wide. - Multi-head: Multiple heads can be selected, from large area heads to a 1.6mm mini-beam head and handheld types. Compatible with uneven shapes. - Mixed gas: Hydrogen gas can be mixed. - Resin and metal substrates: Nylon, polyimide, aluminum, titanium, etc. - Stable processing: Traceability can be achieved.

  • Printed Circuit Board
  • Atmospheric Pressure Plasma Device

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Small equipment using plasma technology

We also support systems and equipment that include plasma technology.

Small equipment using plasma technology We also accommodate systems and equipment that include plasma technology. 【Example Specifications (Equipment Configuration)】 ◇ Touch panel control Film winding speed adjustment Tension control Plasma power adjustment Gas flow rate adjustment, etc. ◇ Continuous processing of film using R to R Primary processing with atmospheric pressure plasma Adjustable plasma irradiation position ◇ Secondary processing with a spray coater Adjustable coating amount Adjustable spray position ◇ Tertiary processing with heater heating Adjustable heating temperature Adjustable distance between heater and film Please feel free to consult us regarding specifications. Additionally, if you require experiments conducted by our technical staff, we can accommodate this for an optional fee. For any other questions, please do not hesitate to contact us.

  • Plasma Generator
  • Atmospheric Pressure Plasma Device

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Plasma Technology Data Presentation (Kai Semiconductor)

Technical documents on plasma, including surface changes of various materials (such as gold, resin, glass), surface composition from XPS measurements, and changes over time, are compiled.

Table of Contents 1. What is Plasma!? 2. Principles of Surface Modification 3. Effects of Plasma Treatment 4. Surface Composition 5. Time-dependent Changes 6. Introduction of Applications 7. Vacuum and Atmospheric Pressure Plasma 8. Tube Plasma 9. Powder Plasma Treatment 10. Technical Scope of Correspondence

  • Other cleaning machines
  • Atmospheric Pressure Plasma Device

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Tabletop Direct-Type Atmospheric Pressure Plasma Device TK-50

Low-cost small device!

●Low cost ●Compact - Space-saving, easy to place in laboratories - Easy to combine with other equipment - Good maneuverability with integrated processing and operation units ●Simple structure - Easy maintenance and inspection - Easy replacement of electrodes (consumables) ●Uniformity - More uniform than handheld corona treatment ●Processing efficiency - No vacuum exhaust required compared to vacuum plasma treatment ●Running costs - Usable without gas supply

  • Other cleaning machines
  • Atmospheric Pressure Plasma Device

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Low-temperature pen-type atmospheric pressure plasma device BARRIER-20

Low-temperature and low-flow atmospheric pressure plasma treatment is possible! Surface modification: Stable generation of plasma without charge damage in an atmospheric pressure environment!

- There is almost no damage from heat. - It can be used with various gases such as air, nitrogen, argon, and helium. - It operates on an AC100V outlet, making it usable in various situations. - It can also be used as a laboratory device. - Dimensions (excluding protrusions) (mm) 260(W) × 280(D) × 139(H) - Maintenance is also easy.

  • Plasma Generator
  • Atmospheric Pressure Plasma Device

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Vacuum device for substrate parallel plate plasma processing equipment PC-RIE series

Processable substrate size 550×650 mm. Achieves zero waste liquid and low running costs.

The "PC-RIE series" can perform processing such as ashing, desmearing, surface modification, and F-type gas etching for medium-sized LCD substrates, printed circuit boards, and more. Customers can choose a version that suits their needs, ranging from a manually operated research and development type chamber to a fully automated system with an atmospheric gate, transport mechanism, and cassette station. 【Features】 ○ Vacuum plasma technology provides a better environment compared to conventional processing → Cleaning, no waste liquid ○ Low running costs ○ Usable substrate size: 550×650 mm For more details, please download the catalog or contact us.

  • Plasma surface treatment equipment
  • Vacuum Equipment
  • Atmospheric Pressure Plasma Device

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Vacuum device for plasma treatment for parallel plate evaluation

Widely used in fine anisotropic processing such as semiconductor, liquid crystal fine patterning, and DNA chip manufacturing.

You can choose a version that suits your needs, ranging from a manually operated research and development type chamber with atmospheric gates, transport mechanisms, and cassette stations to a fully automated system. We emphasize process reproducibility and standardly equip our systems with chillers for electrode temperature control and APC, and we can add turbo pumps compatible with high vacuum processes. 【Features】 ○ RIE plasma etching equipment ○ Capable of anisotropic etching of silicon wafers up to 6 inches and small square substrates ○ Equipment for 8 and 12 inches can also be designed For more details, please download the catalog or contact us.

  • Plasma surface treatment equipment
  • Vacuum Equipment
  • Atmospheric Pressure Plasma Device

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CVD equipment

CVD equipment

●Features This device is a thin film fabrication apparatus using the CVD method, which supplies raw material gases (gases, liquids, solids) to the CVD reaction chamber, causing chemical reactions to occur in the gas phase or on the surface of the substrate material, and utilizing gas-phase reactions and surface reactions to deposit the desired thin film material onto the substrate. Methods for chemically activating the raw material gases (exciting them) include thermal, plasma, and optical (laser, ultraviolet, etc.), with corresponding devices such as thermal CVD, plasma CVD, and optical CVD.

  • Analytical Equipment and Devices
  • Other laboratory equipment and containers
  • Atmospheric Pressure Plasma Device

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High Current Generation Power Supply 'PS-HB0097'

The cooling method adopts natural air cooling! It is a high-current power supply equipped with a power indicator lamp and an ammeter.

The PS-HB0097 is a high-current power supply that incorporates a manual slider and a current-generating transformer into a case. It uses natural air cooling (rated for 20 minutes of continuous use). A breaker is provided for the ON/OFF control of the input power and for overcurrent protection, along with a power lamp and an ammeter. 【Features】 ■ Incorporates a manual slider and a current-generating transformer into the case ■ Includes a breaker for ON/OFF control of the input power and for overcurrent protection ■ Equipped with a power lamp and an ammeter *For more details, please refer to the related link page or feel free to contact us.

  • Power Supplies
  • Atmospheric Pressure Plasma Device

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Atmospheric Pressure Plasma Device "Precise Series"

50% performance increase compared to conventional systems! Atmospheric pressure plasma device with low N2 consumption (approximately 45% reduction).

The atmospheric pressure plasma device "Precise Series" is based on nitrogen gas and utilizes dielectric barrier discharge to isolate the workpiece from the electromagnetic field area, using only the radicals excited within the reactor. This allows for continuous processing without damaging the workpiece. Additionally, even when the workpiece is charged, it is discharged, and there is no particle adhesion in the air after processing. 【Features】 ○ Low-temperature processing ○ Damage-free ○ No need for an ionizer device before ESD-free processing ○ Maintenance-free for 2 years ○ Compact and lightweight (compared to other companies: approximately 1/2 or less in volume ratio, approximately 1/3 or less in weight ratio) ○ Semi-permanent long lifespan dielectric electrodes ○ Particle-free ○ Uniform processing for a wide range of workpieces For more details, please contact us or download the catalog.

  • Plasma surface treatment equipment
  • Atmospheric Pressure Plasma Device

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Atmospheric Pressure Plasma Device "AP Plasma Precise II"

Damage-free, particle-free atmospheric pressure plasma device

The atmospheric pressure plasma device "AP Plasma Precise II" is based on nitrogen gas and utilizes dielectric barrier discharge to isolate the workpiece from the electromagnetic field area, using only the radicals excited within the reactor. This allows for continuous processing without damaging the workpiece. Additionally, even when the workpiece is charged, it can be neutralized, and there is no particle adhesion in the air after processing. 【Features】 ○ No need for electrode replacement (dielectric part) ○ Wide processing range (100 mm to 3000 mm) ○ No damage to the processing surface due to the downstream electrode configuration. ○ Maintenance only every two years For more details, please contact us or download the catalog.

  • Plasma surface treatment equipment
  • Atmospheric Pressure Plasma Device

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How to Choose an Atmospheric Pressure Plasma Device That You Can't Ask About Now *Explanatory Materials Provided

Introducing the basics of plasma devices, including "treatment forms" of atmospheric pressure plasma devices and "unique features of our equipment"! Technical materials available.

Here, we focus on explaining an atmospheric pressure plasma device that generates pure bulk plasma, rather than devices using corona treatment or arcs. By using a special electrode structure and applying high-frequency power to the electrodes based on nitrogen gas and noble gases, high-density plasma is generated. The high-density reactive species produced impart functional groups, hydroxyl groups, and amine groups to the work surface, enabling treatments such as wettability enhancement, coating performance improvement, and organic material removal. By changing the added gas, selectively generated molecules can be produced, allowing for treatments such as hydrophobization, reduction, thin film volume adjustments, and dry etching. Additionally, performing plasma treatment before cleaning processes or plating treatments activates the treated surface, enhancing reactivity with chemical solutions, improving cleaning performance, and aiding in the removal of bubbles. Considering the nature of the work and the conditions for the next process, I hope this summary serves as a reference for optimizing the selection of atmospheric pressure plasma devices. Furthermore, regarding adhesive-free bonding without the use of adhesives, I believe that bonding technology based on molecular bonding with copper foil can reduce transmission loss and contribute to the manufacturing of FCCL for 5G and 6G applications.

  • Plasma surface treatment equipment
  • Atmospheric Pressure Plasma Device

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How to Choose an Atmospheric Pressure Plasma Device That You Can't Ask About Now!

Introducing the "treatable plasma processing width" of our atmospheric pressure plasma device, along with "unique features of our equipment"!

On this page, we focus on atmospheric pressure plasma devices that generate pure bulk plasma, rather than devices that use corona treatment or arcs. We hope this will serve as a reference for optimizing the selection of atmospheric pressure plasma devices, taking into account the nature of the workpieces (items to be treated) and the conditions for the next process. Regarding adhesive-free bonding using oxygen radicals, OH radicals for dry cleaning, and hydrophilic treatment of functional groups, we primarily focus on molecular bonding between copper foil and substrates, enabling bonding that eliminates edge effects. We believe this can contribute to printed circuit boards and assembly processes for future 5G and 6G applications, such as FCCL. Additionally, it can be applied to shorten the impregnation process of electrolytes in lithium-ion batteries and to achieve damage-free direct bonding of dissimilar materials during electrode formation. For more details, please refer to the related links below. [Contents] ■ Purpose of use (treatments possible with atmospheric pressure plasma devices) ■ The treatment forms of atmospheric pressure plasma devices can be broadly classified into three types ■ Workpieces and plasma forms ■ Unique features of our devices (downstream type) ■ Internal schematic diagram of dielectric barrier discharge (DBD) *For more details, please feel free to contact us.

  • Plasma Generator
  • Atmospheric Pressure Plasma Device

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[Atmospheric Pressure Plasma Device - Example of Problem Solving] Superhydrophilicity Treatment on Teflon Surface

Successful superhydrophilization of Teflon (PTFE/PFA) using an atmospheric pressure plasma device, achieving a contact angle near 5 degrees (in pure water).

We would like to introduce a case study of problem-solving using an atmospheric pressure plasma device. Recently, we successfully achieved surface modification of fluoropolymer (PTFE, PFA) to a contact angle close to 5 degrees (in pure water). Previously, the maximum value was around 50 degrees, but this was realized through optimization of recipes and other factors. By cutting the C-F bonds on the Teflon surface with plasma and terminating them with hydrophilic groups or functional groups, we achieved superhydrophilicity. We are confident that this will contribute to direct adhesion to FCCL copper foil for 6G applications in the future.

  • Plasma surface treatment equipment
  • Atmospheric Pressure Plasma Device

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Plasma treatment device (multi-purpose plasma etcher)

Plasma processing device (multi-purpose plasma etcher)

This device is a multipurpose single-sheet plasma unit that is effective for etching polyimide-based resins, nitride films, ashing (ash removal) of photoresists, and surface modification, using parallel plate high-frequency plasma. It supports wafer sizes from 50 to 200 mm (2 to 8 inches) and is compatible with BGA, CSP, and other formats. The plasma mode can be switched between DP mode and RIE mode via the operation panel. Additionally, it allows for the retrofitting of a transport unit, making it ideal for experimental and research facilities.

  • Etching Equipment
  • Ashing device
  • Other processing machines
  • Atmospheric Pressure Plasma Device

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Digital Oil Checker Wendy Rental

Lightweight and compact design. Allows for easy lubrication oil diagnosis on-site.

The Digital Oil Checker Wendy is an extremely simple lubrication oil diagnostic tool that detects contaminants such as dirt and moisture that cloud the machine's lubricating oil, using a principle based on optical sensors. It allows for diagnosis without the need to extract oil from the on-site oil tank. It can instantly determine oil contamination on the spot, and with a lightweight and compact body weighing only 200g, it is effective for quick measurements in the field. For more details, please contact us.

  • Other measurement, recording and measuring instruments
  • Atmospheric Pressure Plasma Device

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Nikko Create High-Pressure Spray Cleaning Machine

Compact cleaning machines installed in large numbers on the vehicle parts assembly line.

The entry and exit points are in the same location, and the precision of car parts has been increasing year by year, with demands for reduced noise and improved durability. This cleaning machine performs the final cleaning before assembly, which affects the precision of the parts.

  • Other cleaning machines
  • Atmospheric Pressure Plasma Device

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Ultra High Density Atmospheric Pressure Plasma ToughPlasma FPF20-GM

Atmospheric pressure plasma device that balances high processing capability and safety.

The FPF20-GM is a world-class atmospheric pressure plasma device capable of generating ultra-high-density radicals more than ten times that of conventional atmospheric pressure plasma. Various parameters are optimized, and no additional adjustments are necessary. You can easily utilize world-class atmospheric pressure plasma with the push of a button. It has obtained CE and MET marks, making it usable in EU member countries and North America. If you are experiencing issues with poor adhesion, paint peeling, or surface contamination, please feel free to contact us.

  • Plasma surface treatment equipment
  • Atmospheric Pressure Plasma Device

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Atmospheric Pressure Plasma Treatment Device 'NJZ-2820'

An atmospheric pressure plasma treatment device that enables stable plasma treatment at atmospheric pressure! The miniaturization of the device makes it easy to integrate into production lines!

The atmospheric pressure plasma treatment device "NJZ-2820" is an optimal device for integration into production lines and production equipment, thanks to its high-efficiency plasma head. It enables stable plasma treatment at atmospheric pressure and reduces running costs by plasma-activating compressed air. The miniaturization of the device also makes it easy to integrate into production lines. 【Features】 ■ Generates high-density plasma using 2.45GHz microwaves ■ Allows plasma generation only when needed with quick ignition ■ Achieves miniaturization and cost reduction of the device *Please consult us regarding low-temperature plasma (below 70°C) and thermal treatment plasma using oxygen. *For more details, please request documentation or view the PDF data available for download.

  • Plasma Generator
  • Plasma surface treatment equipment
  • High frequency/microwave parts
  • Atmospheric Pressure Plasma Device

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Batch-type plasma processing device WPA-600S

A sequencer that is low-cost yet equipped with high performance, capable of managing various assembly conditions and offering excellent cost performance.

We have adopted a compact power matching method, achieving faster plasma matching. By reducing the matching time, we have minimized charge-up damage to the device during plasma ignition. Additionally, we have achieved space-saving design with only the PUMP outside of the main unit.

  • Other inspection equipment and devices
  • Atmospheric Pressure Plasma Device

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