Plasma treatment device WLP600S
Compatible with 6-inch and 8-inch wafers! Plasma processing equipment using a parallel plate method.
The WLP600S is a plasma processing device using a parallel plate method. It supports 6-inch and 8-inch wafers, achieving low cost and space-saving design. The two types of plasma modes, DP (Direct Plasma) mode and RIE (Reactive Ion Etching) mode, can be switched using only the controls on the panel, making it suitable for various applications such as etching polyimide-based resins and surface modification of photoresists. 【Features】 ○ Easy plasma mode switching ○ High-speed responsiveness ○ Space-efficient footprint ○ Compatibility with a wide variety of processes ○ High customization options For more details, please contact us or download the catalog.