Organic solvent-based spray developing device WSD-150
Device dimensions: 560W × 850D × 1300H
Set the substrate in the chuck manually, then perform spray development, rinsing, and spin drying.
- 企業:カナメックス 厚木工場
- 価格:Other
更新日: 集計期間:Dec 24, 2025~Jan 20, 2026
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更新日: 集計期間:Dec 24, 2025~Jan 20, 2026
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更新日: 集計期間:Dec 24, 2025~Jan 20, 2026
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31~45 件を表示 / 全 169 件
Device dimensions: 560W × 850D × 1300H
Set the substrate in the chuck manually, then perform spray development, rinsing, and spin drying.
Utilizing isotropic plasma, ideal for cleaning and modifying fine patterns and the inner surfaces of tube shapes!
The barrel-type plasma treatment device "PB Series" utilizes isotropic vacuum plasma for the removal of organic materials (Ashing), removal of oils (Cleaning), etching of silicon compounds (SiO2, SiN), and improvement of wettability, all without the use of solutions (Wet). It achieves a good environmental performance (clean working environment, no waste liquid) and low running costs. Treatment progresses from all directions, demonstrating the effects of nano-level processing, cleaning, and modification regardless of the shape of the target object. 【Device Features】 ■ Free processing that does not select sample shapes (cylindrical treatment chamber / isotropic plasma) ■ Diverse processes: Ashing (cleaning), Etching, surface modification, etc. ■ All parts are compatible with clean room standards (can be used as semiconductor manufacturing equipment) ■ Cost-effective, small footprint design ■ Safety specifications suitable for use as a mass production device For more details, please contact us or download the catalog.
Compatible with the processing of roll-type film substrates. Through vacuum plasma treatment, in addition to ashing and etching, surface modification treatment (functional group addition) is possible.
The "PR Series" is a roll-to-roll processing device capable of plasma treatment under reduced pressure. It can firmly impart various functional groups (such as hydrophilic, lipophilic, adhesion improvement, etc.) to the surface of substrates, starting with resist ashing and insulating film etching, depending on the application. We have a demo unit at our headquarters and are accepting process evaluation treatments at any time. Please contact us for more details. 【Features】 ■ Roll-to-roll type ■ Plasma treatment under reduced pressure - Higher organic removal and surface modification effects compared to atmospheric pressure devices - Capable of processes that were not possible with atmospheric pressure devices (such as various functional group modifications) *For more details, please refer to the PDF materials or feel free to contact us.
Achieving contamination-free and clean plasma reforming.
<Features> ● Since plasma is generated inside a quartz glass tube, impurities such as particles do not fall onto the treated object, allowing for clean plasma treatment. ● The plasma generation unit has few consumable parts, and with regular maintenance, it can achieve a long lifespan of over 10,000 hours. ● Plasma treatment can be performed at atmospheric pressure, eliminating the need for a vacuum system and reducing capital investment. ● This device is divided into a plasma generation unit and a controller unit, allowing for easy integration of just the plasma generation unit into your existing or new equipment to build an inline system. ● It can perform pinpoint high-speed plasma treatment on targeted areas. ● It comes standard with input/output control functions for customer-side equipment, enabling control of plasma irradiation ON/OFF based on signals from the customer-side equipment.
The cooling method is natural air cooling (rated for 20 minutes)! Introducing our power supply.
The PS-HB0097 is a high current generation power supply that incorporates a manual slider and a current generating transformer into a case. It features a breaker for the ON/OFF of the input power and overcurrent protection, as well as a power lamp and an ammeter. Additionally, we also offer the AC constant current power supply "CCFT series." 【Specifications (excerpt)】 <General Specifications> ■Dimensions: 362(W) × 350(D) × 466(H) (excluding protrusions), floor-standing type case, secondary side terminals are connected via transformer output wires (crimp terminal 2-R150-16) ■Cooling method: Natural air cooling (for a time rating of 20 minutes) <Electrical Specifications> ■Output: Single-phase AC 5V-400A, manually adjustable via slider ■Overcurrent protection: Input breaker *For more details, please refer to the related links or feel free to contact us.
【Dissimilar Jointing / Adhesive-Free Direct Joining】 Improved adhesion and hydrophilicity! Surface modification of carbon fibers using high-efficiency plasma. Cost reduction as well.
"Precise" is an atmospheric pressure plasma treatment that enhances surface hydrophilicity and adhesion by processing particles such as carbon fiber surfaces, chopped fibers, and carbon black. By sufficiently electrically isolating the plasma source from the treatment area, surface modification can be achieved without damaging the workpiece and without generating static electricity after treatment. Additionally, in applications for sizing pre-treatment, the rinsing and subsequent drying processes become unnecessary, contributing to significant cost reductions, as well as other benefits beyond surface modification. 【Examples of Applications and Their Effects】 ■ Cost reduction through improved adhesion in sizing pre-treatment ■ Anchor effect after sizing ■ Enhanced solubility and dispersibility characteristics in solutions through surface treatment of powders ■ Realization of dissimilar bonding and adhesive-free direct bonding *For more details, please refer to the materials. Feel free to contact us with any inquiries.
Achieve efficient surface treatment with an atmospheric pressure plasma device! Easily change the captured particle size with a bag filter.
We have developed a method that can efficiently handle the dispersion of particles, hydrophilization of particles, and surface reduction of metal particles using an atmospheric pressure plasma device. By utilizing a structure that takes advantage of a downstream type processing method suitable for wide and long workpieces, we are able to trap radicals inside the cavity and stir them with the workpiece, enabling more efficient surface treatment. Since we completely eliminate electrical and electromagnetic wave damage, as well as UV damage to the workpiece, there is no damage to the surface of the workpiece, and surface modification of metal particles is also achieved. As a result, there is no charge buildup on the workpiece after processing. 【Features】 ■ Downstream type suitable for wide applications ■ Structure that leverages advantageous processing methods for long workpieces ■ Complete elimination of electrical, electromagnetic wave, and UV damage to the workpiece ■ Plasma irradiation width can be produced in the range of 100mm to 2000mm *For more details, please refer to the materials. Feel free to contact us with any inquiries.
Basic concept of molecular bonding adhesion and joining (direct adhesion) using a downstream atmospheric pressure plasma device.
Our company's downstream plasma device eliminates various damages that occur during processing, enabling clean treatment and smooth surface adhesion. It is suitable for applications such as FCCL manufacturing for 5G and 6G, as well as for carbon films in the secondary battery market, and for bonding dissimilar materials during electrode manufacturing and dry pre-treatment. Additionally, by changing the added gas and optimizing plasma parameters, we can selectively impart functional molecules (such as covalent bonding molecules) to the interface, matching the bonding molecules to the material of the joining interface. Even for challenging hydrophilization of PFA and PTFE surfaces, it is possible to reduce the contact angle to below 10 degrees. *Sample work is also conducted at our lab. [Contents] ■ Basic Concept ■ Advantages ■ Processing Image (R to R) *For more details, please refer to the PDF document or feel free to contact us.
It has been confirmed that stable crystal growth of bismuth selenide can be achieved.
At Kenix Corporation, we confirmed that stable crystal growth of bismuth selenide, which is expected to be a topological semiconductor, can be achieved using a deposition source that evaporates low-temperature materials stably. We verified the crystal growth of bismuth selenide through RHEED streaks, confirmation of oscillations, and peak verification via Raman spectroscopy measurements. This crystal growth experiment and data were conducted and obtained with the cooperation of a professor from Kyushu Institute of Technology. 【Evaluation Data】 ■ Low-temperature material high-speed molecular beam deposition source ■ Growth rate (Bi2Se3) ■ RHEED streak images (Bi2Se3) ■ RHEED oscillation data (Bi2Se3) ■ Raman spectroscopy measurement data (Bi2Se3) *For more details, please refer to the PDF document or feel free to contact us.
A high-performance device that can accommodate all applications. Just one button press after adjustment, and you're good to go!
The Plasma Ion Bomber PIB-20 model is a multifunctional version of our popular PIB-10 hydrophilic treatment device. It is a high-performance device capable of hydrophilic treatment of support membranes for TEM, cleaning of diamond knives, etching of organic materials, and bonding of PDMS, among various other applications. Equipped with a full-auto function, it can be operated with just the push of a button after adjustments! For those who find it difficult to introduce RF plasma devices or have been unable to afford expensive RF plasma devices, we offer a high-performance AC plasma device at a low price! For more details, please contact us or refer to the catalog.
The device is high-performance and cost-effective, with a low price and the ability to manage various etching conditions through the built-in sequencer.
WLP has realized the application of RF power to the lower electrode (RIE method) or to the upper electrode (DP method) to accommodate diversified applications. It can be used for a variety of processes such as etching of 6-8 inch Si, Poly-Si, etching of polyimide-based resins, and ashing of photoresists.
Leveraging our manufacturing achievements in plasma devices, we offer plasma treatment tailored to your company's needs! We accommodate small lots and short delivery times!
We perform plasma treatment on various materials according to their intended use. We can accommodate small lots and short delivery times. 【Examples of Applications】 We will process according to your company's needs, such as "cleaning," "surface modification," and "increased adhesion effects." If your company is considering processing for prototypes or small lots, please feel free to contact us. ★For more details, please contact us or download the catalog.
Has numerous achievements in leading Asian companies.
Stable plasma is generated under the counter electrode. Furthermore, by placing a dielectric between the electrodes, stable plasma can be generated and maintained. ■Processing Targets Modification/roughening of the target work surface (improvement of bonding strength, enhancement of adhesion) Removal of organic substances from the target work surface 【Features】 ■Wide compatibility: up to 2,250mm ■Excellent surface modification performance ■Physical and chemical processing is possible ■Maintenance-free ■Various reaction gases can be used: CDA (Clean Dry Air), N2, Ar, O2, etc. For more details, please download the catalog or contact us.
Has numerous achievements in leading Asian companies.
We perform pinpoint processing on extremely small areas. ■ Processing Targets Surface modification/roughening of the target workpiece (improvement of bonding strength, enhancement of adhesion) Removal of organic substances from the target workpiece surface 【Features】 ■ Ideal for narrow processing areas: 10/20/35mm ■ Enables processing of three-dimensional objects in combination with robotic mechanisms ■ Compatible with various reaction gases: CDA (Clean Dry Air), N2, Ar, O2, etc. For more details, please download the catalog or contact us.
【Approximately 50% reduction in tact comparison※】For pre-treatment of adhesion of LCP, PTFE, etc., and removal of desmear and dry film. (※Compared to our conventional products)
The "Roll-to-Roll Plasma Treatment Device" has been upgraded to the 2019 model. Please refer to the main product features below. <Product Features> 1. New Electrode Adoption - Increased plasma density enhances processing efficiency per electrode. - Provides fast and highly uniform treatment (in-plane uniformity within ±15%). - Supports a maximum width of 550mm. 2. Reduced Processing Time - Plasma irradiation length reduced by approximately 50% (number of electrodes: old type 12 sheets ⇒ 2019 model 7 sheets). - Supports both sides treatment (options for both sides or one side treatment). 3. Improved Cooling Performance - Enhanced cooling to minimize substrate damage due to heat. *For more details, please download the PDF or contact us.