Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
31～60 item / All 96 items
COM-HPC compliant CPU module with Intel Alder Lake H (Client)
■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
SMARC Rev. 2.1.1 compliant, Intel Elkhart Lake【HALLEY】
■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible to design carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
SMARC Rev. 2.1.1 compliant CPU module with NXP i.MX8M Plus
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
SMARC Rev. 2.1.1 compliant CPU module with NXP i.MX8M
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
SMARC Rev. 2.1.1 compliant CPU module with NXP i.MX8X
■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
Intel Atom E3800 and Celeron processor equipped! Qseven Rel. 2.0 module
"ASTERION" is a mobile CPU module equipped with eMMC and a camera interface. It features Intel Atom E3800 and Celeron processors (Bay Trail). It is applicable in fields such as HMI, industrial automation and control, in-vehicle infotainment systems, and portable devices. 【Features】 ■ CPU: Intel Atom E3800 and Celeron family ■ Connectivity: USB 2.0 × 6, USB 3.0 × 1, PCI-e x1 × 3 ■ Graphics: Integrated Intel HD Graphics 4000 series controller ■ Memory: Up to 8GB of dual-channel DDR3L 1333MHz ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.
For surveillance equipment and transportation systems! The smallest class x86 standard module developed at a unique cost!
"KUMA" is a μQseven Rel. 2.0 module equipped with Intel Atom E3800 and Celeron processors (Bay Trail). The dimensions are 40×70mm (1.57 inches × 2.76 inches). It is applicable in various fields such as biomedical/medical devices, industrial automation and control, handheld terminals, robotics, and surveillance equipment. It is a minimum-class x86 standard module developed at a unique cost. 【Features】 ■ CPU: Intel Atom E3800 and Celeron family ■ Connectivity: USB 2.0 x 4, USB 3.0 x 1, PCI-e x1 x 3, LPC bus ■ Graphics: Integrated Intel HD Graphics 4000 series controller ■ Memory: Up to 4GB of single-channel DDR3L memory *For more details, please refer to the PDF document or feel free to contact us.
An optimal balance of performance and power! Applicable to automobiles, avionics, robotics, and more.
"ALKES" is a Qseven standard module equipped with the NXP i.MX 6 processor. It features an optimal balance of performance and power. It is suitable for various fields, including automotive and avionics, energy, industrial automation and control, robotics, and surveillance equipment. Please feel free to contact us when you need assistance. 【Features】 ■ CPU: Single-core, dual-core, quad-core (Arm Cortex-A9 core) ■ Connectivity: 2 serial ports, CAN port ■ Graphics: Dedicated 2D/3D graphics processor ■ Memory: Capable of supporting up to 4GB of DDR3L ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.
A compact Qseven module equipped with a high-efficiency architecture that has obtained safety certification!
"ARCALIS" is a Qseven Rel. 2.1 compliant module equipped with the NXP i.MX 8X application processor. It features a compact and safety-certified Qseven module with a high-efficiency architecture. It is used in various fields such as automation, edge computing, energy, HMI, and industrial automation and control. 【Features】 ■ CPU: NXP i.MX 8X application processor ■ Graphics: Integrated GPU, supports two simultaneous video outputs ■ Memory: Up to 4GB of implemented LPDDR4-2400 memory ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.
An optimal balance of performance and size! Suitable for applications such as automation and wireless technology.
"LIBERTAS" is a μQseven standard module equipped with the NXP i.MX 6 processor. It features an optimal balance of performance and size, and can be used in industrial temperature ranges. It is suitable for fields such as automation, biomedical/medical devices, HMI, handheld terminals, and wireless technology. Please feel free to contact us if you have any inquiries. 【Features】 ■ CPU: Single-core, dual-core, quad-core (Arm Cortex-A9 core) ■ Connectivity: USB 2.0 × 4, Serial ports × 2, CAN bus ■ Graphics: Dedicated 2D/3D graphics processor ■ Memory: Up to 2GB of DDR3L ■ Usable in industrial temperature ranges *For more details, please refer to the PDF document or feel free to contact us.
Applicable to multimedia devices! Introducing Qseven solutions for embedded systems.
"MIRA" is a Qseven Rel. 2.1 compliant module equipped with the NXP i.MX 8M application processor. It can be used in industrial temperature ranges. The graphics feature an integrated GPU and support for two simultaneous video outputs. This is an embedded system Qseven solution suitable for various fields such as home automation, multimedia devices, and transportation. 【Features】 ■ CPU: NXP i.MX 8M application processor ■ Connectivity: USB 3.0 x 1, USB 2.0 x 4, PCI-e x1 Gen2 x 2, etc. ■ Graphics: Integrated GPU, supports two simultaneous video outputs ■ Memory: Up to 4GB of DDR4-2400 memory installed ■ Usable in industrial temperature ranges *For more details, please refer to the PDF document or feel free to contact us.
CPU module with high graphic performance and low power consumption design due to extreme temperatures.
The "NAOS" is a Qseven Rel. 2.1 compliant module equipped with Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series (Apollo Lake) processors. It can be used in an industrial temperature range. It features high graphic performance and a low power consumption design due to extreme temperatures. It is used in various fields, including automotive, gaming, and mobile devices. 【Features】 ■ CPU - Intel Atom X series, Intel Celeron J/N series, Intel Pentium N series ■ Connectivity - USB 3.0 x 2, PCI-e x 4, USB 2.0 x 6 *For more details, please refer to the PDF document or feel free to contact us.
Scalable graphics performance makes a difference! Usable in industrial temperature ranges.
"AMOS" is a CPU module equipped with AMD embedded 3rd generation R series SoC, G series SoC-I, or G series SoC-J. It can be used in industrial temperature ranges. The memory supports two SO-DIMM slots for DDR4 ECC modules and non-ECC modules. This product is applicable in a wide range of fields such as gaming, medical, and digital signage-infotainment. 【Features】 ■ CPU: AMD embedded 3rd generation R series SoC or G series SoC-I ■ Graphics: AMD Radeon 3rd generation Graphics Core Next (GCN) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3 ■ Memory: Supports two SO-DIMM slots for DDR4 ECC modules and non-ECC modules *For more details, please refer to the PDF document or feel free to contact us.
Usable in industrial temperature ranges! High-performance and highly responsive CPU and GPU computing.
"CALYPSO" is a CPU module equipped with an 11th generation Intel Core processor. It can be used in industrial temperature ranges and is applicable in various fields such as biomedical/medical devices, measurement instruments, and transportation. It offers high-performance and responsive CPU and GPU computing in a COM Express Compact form factor. Please feel free to contact us for inquiries. 【Features】 ■ CPU: Intel Core series (formerly Tiger Lake UP3) processor ■ Graphics: Integrated Intel Iris Xe graphics with up to 96 execution units ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 IBECC memory, up to 64GB *For more details, please refer to the PDF document or feel free to contact us.
Supports up to 64GB of memory! Introducing a CPU module that can be used in industrial temperature ranges.
"CARINA" is a COM-HPC client module equipped with 11th generation Intel Core and Celeron processors. It features Intel Iris Xe graphics with up to 96 execution units (EU) and supports up to four independent displays. It is applicable in various fields such as automation, edge computing, information kiosks, robotics, and thin clients. 【Features】 ■ CPU: 11th generation Intel Core processors and Intel Celeron processors ■ Connectivity: 4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3; 1x PCI-e x4 Gen4; up to 2x 2.5GbE ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory *For more details, please refer to the PDF document or feel free to contact us.
Equipped with real-time options! Cost-effective low-power computing.
"EUPHORIA" is a COM Express 3.1 Type 6 Compact module equipped with Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors. It can be used in an industrial temperature range. It supports up to three independent displays, with an operating temperature of 0°C to +60°C for commercial versions and -40°C to +85°C for industrial versions. It is applicable in a wide range of fields, including industrial automation and control, in-vehicle infotainment systems, robotics, and telecommunications. 【Features】 ■ CPU: Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors ■ Graphics: Integrated Intel Gen11 UHD Graphics controller ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 IBECC memory, up to 32GB *For more details, please refer to the PDF document or feel free to contact us.
Top-class connectivity! Applicable to a wide range of fields such as robotics and transportation.
"LAGOON" is a CPU module that can be used in industrial temperature ranges. It achieves processing power, high-performance graphics, and top-class connectivity with the COM-HPC modular solution. It supports up to three simultaneous video outputs and can connect M.2 NVMe drives on the carrier board using a PCI-e x4 port. 【Features】 ■ CPU: 11th generation Intel Xeon, Core, and Celeron processors ■ Graphics: Intel Iris Xe Graphics Core Gen12 GPU with up to 32 EU and up to four independent displays ■ Connectivity: 2x USB 4; 2x USB 3.2 Gen 2x2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; up to 2x 2.5GbE *For more details, please refer to the PDF document or feel free to contact us.
Operating temperature 0℃ to +60℃! Low-end AMD Ryzen on COM Express Type 6 Compact.
"METIS" is a COM Express Rel.3.0 Compact Type 6 module equipped with the AMD Ryzen Embedded R1000 family SoC. It supports up to three Digital Display Interfaces (DDI), including DP1.3, DVI, and HDMI 1.4/2.0, allowing for three independent displays. It is applicable in a wide range of fields such as digital signage, infotainment, and biomedical applications. Please feel free to contact us for inquiries. 【Features】 ■ CPU: AMD Ryzen Embedded R1000 Processor ■ Graphics: AMD Radeon Vega GPU (with 3 compute units) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; up to 5 PCI-e x1; PEG x4 Gen3 ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-2400 ECC memory *For more details, please refer to the PDF document or feel free to contact us.
Robust solutions for industrial environments! Introducing products that can be used in industrial temperature ranges.
The "MIRANDA" is a CPU module equipped with Intel Atom X, Intel Celeron J/N, and Intel Pentium N series processors. It features a microSD card slot and can implement an optional eMMC 5.0 drive onboard. The main application fields are avionics, biomedical/medical devices, gaming, and transportation. Please feel free to contact us if you have any inquiries. 【Features】 ■ Graphics: Intel HD Graphics 500 series controller (with up to 18 execution units) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 5x PCI-e x1 Gen2 ■ Memory: Two DDR3L SO-DIMM slots supporting DDR3L-1866 non-ECC memory *For more details, please refer to the PDF document or feel free to contact us.
Introducing a scalable product with excellent performance and enhanced connectivity!
"THEBE" is a COM Express Rel.3.0 Basic Type 7 module equipped with an AMD EPYC Embedded 3000 series SoC. It can be used in an industrial temperature range and supports up to four DDR4 SO-DIMM slots with DDR4-2666 memory, compatible with both ECC and non-ECC. This is a scalable product with excellent performance and increased connectivity. Please feel free to contact us for inquiries. 【Features】 ■ CPU: AMD EPYC Embedded 3000 Family SoC ■ Networking: 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Connectivity: 4x USB 3.1; 24 lanes of PCI-e Gen3 lanes ■ Memory: 4 DDR4 SO-DIMM slots supporting ECC DDR4-2666 memory, up to 128 GB *For more details, please refer to the PDF document or feel free to contact us.
Deep learning inference and UHD media processing! Applicable in fields such as automation and HMI.
The "FINLAY" is a SMARC Rel.2.1 compliant module equipped with Xilinx Zynq Ultrascale+ Intel Atom processor x7000E series, Intel Core i3 processor, and Intel processor N series. It enables power-efficient deep learning inference and UHD media processing in a small footprint for video and imaging-intensive applications. The memory is implemented with quad-channel LPDDR5 with IBECC. 【Specifications (excerpt)】 ■ CPU: Intel Atom processor x7000E series, Intel Core i3 processor, Intel processor N series (codename: Alder Lake N) aimed at IoT and multimedia applications. ■ Graphics: Integrated Intel UHD graphics powered by Intel Xe architecture, supporting up to three video outputs simultaneously at 4K resolution. *For more details, please refer to the PDF document or feel free to contact us.
SMARC Rel 2.1.1 for FuSa applications! Graphics support simultaneous three video outputs.
"HALLEY" is a SMARC module specifically designed for functional safety (FuSa) in safety-related systems. It is equipped with Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors. The FuSa-certified Intel Atom x6000E CPU complies with the requirements of IEC 61508 and ISO 13849 regarding functional safety and safety integrity levels. 【Specifications (excerpt)】 ■CPU: Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors ■Graphics: Gen11 UHD integrated graphics controller, supporting three simultaneous video outputs ■Memory: Quad-channel LPDDR4x implementation with IBECC *For more details, please refer to the PDF document or feel free to contact us.
High performance, low power consumption, and rich features! SMARC Rel. 2.1.1 module processor.
"JAGER" is a CPU module equipped with Xilinx Zynq Ultrascale+, Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series. It features high performance, low power consumption, and a rich set of functions. The memory is a dual-channel implementation of LPDDR4-2400 memory. It is applicable in various fields, including automotive, biomedical/medical devices, and multimedia devices. 【Specifications (excerpt)】 ■ CPU: Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series (formerly Apollo Lake) processors ■ Graphics: Intel HD Graphics 500 series controller, equipped with up to 18 execution units ■ Memory: Dual-channel implementation of LPDDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.
Low power design for embedded applications of machine learning at a higher level!
"LEVY" is a module compliant with SMARC Rel. 2.1, equipped with the NXP i.MX 8X application processor. It features a low-power design for embedded applications in machine learning at a higher level. It is applicable in various fields such as automation, edge computing, HMI, portable devices, and robotics. 【Specifications (excerpt)】 ■ CPU: NXP i.MX 8M Plus application processor ■ Graphics: Integrated GPU, supports three simultaneous video outputs ■ Memory: Up to 4GB of implemented LPDDR4-4000 memory *For more details, please refer to the PDF document or feel free to contact us.
Equipped with MediaTek Genio 700 application processor! For information kiosks and more.
"WILK" is a SMARC Rel.2.1.1 module equipped with Xilinx Zynq Ultrascale+, Intel Atom x7000E series processors, Intel Core i3 processors, and Intel N series processors. It can be used in an industrial temperature range. The memory consists of implemented LPDDR4X-3733 memory, with a total maximum of 8GB. It is applicable in various fields, including digital signage, infotainment, biomedical/medical devices, and information kiosks. 【Specifications (excerpt)】 ■ CPU: MediaTek Genio 700 ■ Graphics: Mali G57 MC3 GPU ■ Memory: Implemented LPDDR4X-3733 memory, total maximum of 8GB *For more details, please refer to the PDF document or feel free to contact us.
High power-efficient deep learning inference and UHD media processing!
We would like to introduce the "SOM-SMARC-ADL-N" that we handle. This product performs power-efficient deep learning inference and UHD media processing in a small footprint, designed for video and imaging-intensive applications. The graphics are powered by integrated Intel UHD graphics based on the Intel Xe architecture, supporting up to three video outputs simultaneously at 4K resolution. 【Processor (excerpt)】 ■ Intel Atom x7213E, 2 cores @ 1.7 GHz (3.2 GHz Turbo), 10W TDP, TSN and TCC ■ Intel Atom x7425E, 4 cores @ 1.5 GHz (3.4 GHz Turbo), 12W TDP, TSN and TCC ■ Intel Atom x7211E, 2 cores @ 1.0 GHz (3.2 GHz Turbo), 6W TDP, TSN and TCC ■ Intel Core i3-N305, 8 cores @ 1.8 GHz (3.8 GHz Turbo), 15W TDP, TSN and TCC *For more details, please refer to the PDF document or feel free to contact us.
![COM Express Type 10 [EmNANO-iX701]](https://image.mono.ipros.com/public/product/image/2001584792/IPROS12352877998878064788.png?w=280&h=280)
Intel Amston Lake Atom CPU equipped Mini COM Express Type 10 CPU module
Main Features - Onboard Intel Amston Lake SoC processor - Onboard LPDDR5 SDRAM - Intel 2.5 Gigabit Ethernet controller - Single-channel 24-bit LVDS + DDI port x1 - Supports Intel TCC (Time Coordinated Computing)
Yokogawa Electric's new CPU module enhances PLC motion and reduces costs.
This is Yokogawa Electric's new CPU module. It offers a reasonable price and allows for the use of general-purpose PLCs and precise motion control.
6th generation Core i7-6600U/i5-6300U/i3-6100U/3955U Skylake-U equipped CPU module
Features ■ Type 6 COM Express module ■ Equipped with 6th generation Core i7-6600U/i5-6300U/i3-6100U/3955U Skylake-U ■ DDR4-1866 Non-ECC SODIMM x 1 (up to 16GB) ■ Supports VGA, LVDS/eDP, 2x DDI (DP/HDMI/DVI) displays (carrier board) ■ PCI Express Gen3 compatible (carrier board)
6th Generation Intel Xeon D (Broadwell-DE) processor equipped CPU module
Features ■ Type 6 COM Express module ■ Equipped with 6th generation Xeon D-1548/Xeon D-1539/Xeon D-1527 ■ DDR4-2133 ECC/Non-ECC SODIMM (up to 48GB) x3 ■ Supports VGA, HDMI, 10GbE LAN ■ PCI Express Gen3 compatible (1x PCIEx16, 8x PCIEx8)
