Last Updated： Aggregation Period:Sep 23, 2026～Oct 20, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 23, 2026～Oct 20, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Sep 23, 2026～Oct 20, 2026
This ranking is based on the number of page views on our site.
61～90 item / All 104 items
Yokogawa Electric's new CPU module enhances PLC motion and reduces costs.
This is Yokogawa Electric's new CPU module. It offers a reasonable price and allows for the use of general-purpose PLCs and precise motion control.
6th generation Core i7-6600U/i5-6300U/i3-6100U/3955U Skylake-U equipped CPU module
Features ■ Type 6 COM Express module ■ Equipped with 6th generation Core i7-6600U/i5-6300U/i3-6100U/3955U Skylake-U ■ DDR4-1866 Non-ECC SODIMM x 1 (up to 16GB) ■ Supports VGA, LVDS/eDP, 2x DDI (DP/HDMI/DVI) displays (carrier board) ■ PCI Express Gen3 compatible (carrier board)
6th Generation Intel Xeon D (Broadwell-DE) processor equipped CPU module
Features ■ Type 6 COM Express module ■ Equipped with 6th generation Xeon D-1548/Xeon D-1539/Xeon D-1527 ■ DDR4-2133 ECC/Non-ECC SODIMM (up to 48GB) x3 ■ Supports VGA, HDMI, 10GbE LAN ■ PCI Express Gen3 compatible (1x PCIEx16, 8x PCIEx8)
Trizeps SODIMM-200 CPU module (size 67.6x36.7mm), NXP i.MX 8M Plus
Features ■ Equipped with NXPi.MX8MPlus application processor ■ Supports 2x Gigabit Ethernet, 2x USB 3.0, 2x CAN-FD, PCIe, LVDS, 2x MIPI-CSI, WiFi/Bluetooth ■ Integrated GPU with multi-display support GC520L2D accelerator + GC7000UL3D accelerator ■ Onboard LPDDR4-4000 memory up to 8GB ■ Operating temperature 0 to 70°C (optional: -40°C to 85°C) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android
SM-C12, NXP i.MX 8M Family, ARM Cortex-A53, Size 50x82mm
Features ■ Equipped with NXP i.MX 8M Plus application processor ■ Supports WiFi + BT LE; CSI camera; QuadSPI interface; 14x GPI/Os ■ Integrated GPU that supports two independent displays ■ Onboard LPDDR4-4000 with a maximum of 6GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Yocto/Android
NXP i.MX 8X Family, ARM Cortex-A35, size 50x82mm
Features ■ Equipped with NXP i.MX 8X Plus application processor ■ 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; supports QuadSPI interface ■ Integrated GPU supporting two independent displays ■ Onboard LPDDR4-2400 with up to 4GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Android
11th Core i series (Tiger Lake-UP3), equipped with 2xDDR4-3200 ECC memory, maximum 64GB.
Features ■ Supports 11th generation Intel Core processors and Intel Celeron processors ■ 4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3; 1x PCI-e x4 Gen4; supports up to 2x 2.5GbE ■ Intel Iris Xe Graphics Core Gen12 GPU with up to 96 EU, supports up to 4 independent displays ■ Equipped with 2x DDR5-4800 memory, maximum 64GB ■ Operating temperature 0 to 60℃ (optional: -40 to 85℃) ■ Dimensions: 120x95mm ■ OS: Win10 IoT/Linux/Yocto/VxWorks7.0/Android
ADLINK, dimensions 160X120 mm, 13th generation Core i9/i7/i5/i3, 2xDDR5-3200 up to 128GB
【ADLINK COM-HPC-cRLS Features】 ■ Supports 13th generation Intel Core i9/i7/i5/i3 processors ■ Up to 24 cores, 32 threads (8 P-cores, 16 E-cores) ■ Up to 128GB DDR5 (up to 4800 MT/s) ■ Intel AVX-512 VNNI, Intel DL Boost ■ Intel UHD 770 Xe graphics ■ 16x PCIe Gen5, 8x PCIe Gen4 lanes, 14x PCIe Gen3 lanes ■ 2x 2.5GbE, Intel TCC, TSN capable ■ 4x USB 3.0/2.0/1.1, 8x USB 2.0 ■ 2x SATA, 2x UART, 12x GPIO
ADLINK, NXP i.MX 93 with 2-core Arm Cortex-A55 & M33, LPDDR4L up to 2GB
【ADLINK OSM-IMX93 Features】 ■Dimensions: 45mm x 45mm ■NXP i.MX93 series (2-core Arm Cortex-A55 + M33) ■Equipped with TrustZone technology supporting Armv8 cryptographic functions ■Supports Arm Ethos U-65 micro NPU ■Supports independent display via 1x MIPI DSI ■LPDDR4L up to 2GB ■3x USB 2.0, 1x USB 2.0, 4x UART, 2x CAN2.0, 2x SPI, 1x I²S interface, 2x I2C interfaces, 16x GPIO ■Dual GbE (one port supports TSN) ■Certified to IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
NXP i.MX 95 with 6x Arm Cortex-A55, LPDDR4L up to 8GB, eMMC up to 128GB
**ADLINK OSM-IMX95 Features** - Dimensions: 45mm x 45mm - i.MX95 series (equipped with 4-core or 6-core Cortex-A55, Cortex-M7, and M33 MCU) - DSI and LVDS graphic output interfaces - LPDDR4L up to 8GB - eMMC up to 128GB - 1x USB 3.0, 1x USB 2.0, 4x UART, 3x SPI, 2x I²S interfaces, 4x I2C interfaces, 12x GPIO, 1x GEN3 single lane - Dual GbE (TSN compatible) - Certified to IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
Alder Lake-N N97 / Amston Lake Atom x7433RE,LPDDR5-5500 16GB/8GB
【IEI iSMC-ASL Features】 ■SMARC CPU module (size 82x50mm) ■Intel Alder Lake-N/Amston Lake on-board SoC, Alder Lake-N N97 SoC, Atom x7433RE SoC processor ■LPDDR5-5500 16GB/8GB ■Storage: 1 x eMMC: onboard eMMC option (up to 256G), 1 x SATA: signal to baseboard, 6Gb/s ■Display port: 1 x DisplayPort (1.1a), 1 x HDMI, 1 x LVDS ■2x 2.5 GbE RJ45 LAN, 6 x USB 2.0, 2 x USB 3.2, SATA 6Gb/s, 1x USB 2.0, 4 x RS-232 ■Expansion slots: 4 x PCIe x1: signal to baseboard supported ■Supports 5V DC power supply ■Operating temperature range: 0°C to 60°C
Alder Lake Core i3-N305/N97/N50, LPDDR5-4800 up to 16GB, eMMC up to 256GB
【ADLINK LEC-TWL Features】 ■ SMARC CPU module (size 82x50mm) ■ Intel i3-N305 / Intel N97 / Intel N50 processors (Alder Lake) ■ Up to 16GB LPDDR5 memory ■ Storage: 1 x eMMC: onboard eMMC option (up to 256G), 1 x SATA Gen3 ■ 4K resolution compatible display port: 1 x DisplayPort (1.1a), 1 x HDMI ■ Dual-channel LVDS (18-bit/24-bit, optional) support ■ 2x 2.5 GbE RJ45 LAN, 2x USB 3.2, 4x USB 2.0, 4x UART, 2x CAN2.0A, 4x PCIe x1 Gen3 ■ Supports 5V DC power supply ■ Operating temperature range: 0℃ to 60℃
7th Generation Intel Atom x7000RE & x7000C Processor Equipped SMARC Short Size Module
The ADLINK LEC-ASL is a SMARC module compatible with 2/4/8 core Intel Atom x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) processors (formerly Amston Lake), integrating Intel UHD graphics and high-speed interfaces. The LEC-ASL module supports up to 16GB LPDDR5 memory and up to 256GB eMMC storage (build option), making it ideal for mission-critical fanless edge computing applications that operate 24/7, thanks to its robust operating temperature range and low power envelope.
The heart of the CPU board is realized on a small board! Designed and developed to specifications that suit the customer's needs.
N.M.R. Corporation handles "CPU Modules." This product realizes the heart of the CPU board on a small board. Various peripheral interfaces can be designed and developed according to the customer's specifications. Notably, it significantly differs from the ETX standard by adding PCI Express interfaces and many I/Os. 【Product Lineup】 ■ICE-BT-T10 ■ICE-BT-T10W2 ■ICE-ULT3 ■ICE-BT-T6 ■iQ7-BT-E38001 ■iQ7-BT-E38001W2 *For more details, please refer to the PDF materials or feel free to contact us.
![Q-Seven CPU Module [EQM-APL]](https://image.mono.ipros.com/public/product/image/f9b/2001068349/IPROS26794018305600557490.png?w=280&h=280)
Q-Seven module equipped with Intel processor
Avalue's rugged environmental system is specially designed for long-term operation in harsh environments. Additionally, it is designed to maintain reliability in computer processing even under severe usage conditions. For more details, please contact us or download the catalog.
Ultra-small, low power consumption
It features mainstream value tablets and small-screen 2-in-1 devices designed for Intel Atom processors. End users benefit from powerful graphics performance, built-in security, and OS flexibility. This system-on-chip (SoC) is based on Intel's Silvermont microarchitecture using 22 nm process technology. The 64-bit quad-core SoC with Intel HD Graphics provides a low-power solution that excels in computing and graphics performance compared to the previous generation platform, and it includes Intel Burst Technology and Intel Wireless Display. For more details, please refer to the PDF document or feel free to contact Fuji Soft. https://www.fsi-embedded.jp/product_detail/10422/
Small, low power consumption Bay Trail
It features mainstream value tablets and small-screen 2-in-1 devices designed for Intel Atom processors. End users benefit from powerful graphics performance, embedded security, and OS flexibility. This system-on-chip (SoC) is based on Intel's Silvermont microarchitecture using 22 nm process technology. The 64-bit quad-core SoC with Intel HD graphics provides a low-power solution that excels in computing and graphics performance compared to the previous generation platform, and it includes Intel Burst Technology and Intel Wireless Display. For more details, please refer to the PDF document or feel free to contact Fuji Soft. https://www.fsi-embedded.jp/product_detail/8944/
Equipped with Bluetooth 5.0! Over 10 years of product lifespan program.
We would like to introduce the "iW-RainboW-G40M-OSM" that we handle. This product is an i.MX 8M Plus OSM LGA module, equipped with a 64-bit ARMv8 architecture, featuring the i.MX 8M Plus Q/QL/D CPU. Additionally, it includes an NPU with a neural network performance of 2.3 TOPS and 8GB of LPDDR4 memory. 【Features】 ■ i.MX 8M Plus Q/QL/D CPU ■ NPU with 2.3 TOPS neural network performance ■ 8GB LPDDR4 memory ■ IEEE 802.11a/b/g/n/ac/ax Wi-Fi ■ Bluetooth 5.0 *For more details, please refer to the PDF document or feel free to contact us.
Long-term supply with embedded specified components! Function expansion/customization is possible with option boards.
The "SVA701" is a 6U VME CPU Module equipped with the necessary I/F and functional expandability for control VME boards. By adopting the 11th generation TigerLake UP3 and our own PCIe-VME bridge (FPGA), long-term product supply is possible. It features endian-specific byte swap functionality, making VME access easy. Please feel free to contact us if you have any requests. 【Features】 ■ 11th generation Intel Processor series ■ Implementation of embedded system requirements ■ In-house development/domestic production *For more details, please refer to the PDF document or feel free to contact us.
NXP i.MX8M Plus equipped with Toradex's Verdin family CPU module.
The NXP i.MX 8M Plus SoC features up to four powerful 64-bit Armv8 Cortex-A53 cores, providing sufficient power for typical industrial and medical applications while being a cost-effective choice for running the latest graphical user interface on Linux. The integrated Neural Processing Unit (NPU) is designed from the ground up to perform deep learning inference, capable of delivering several times the performance of CPU and GPU-based solutions in the same power range. Toradex offers integration with popular machine learning frameworks such as TensorFlow.
COM-EXPRESS TYPE6 compliant, Intel Whisky Lake equipped CPU module (compact)
■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
2023 SECO's latest products packed! Over 80 products featured.
Board products such as CPU modules and compact embedded boards, as of May 2023, include the entire lineup from SECO.
Performance of x86 in low power consumption modules! Introducing Qseven Rel. 2.0 compliant modules!
"AVIOR" is a CPU module equipped with Intel Atom E3800 and Celeron family (Bay Trail) processors. It offers x86 performance in a low-power module and can be used in industrial temperature ranges. It is suitable for fields such as biomedical/medical devices, HMI, industrial automation and control, and measurement instruments. 【Features】 ■ CPU: Intel Atom E3800, Celeron family (System-on-Chip) ■ Connectivity: USB 2.0 × 6, USB 3.0 × 1, PCI-e x1 × 3 ■ Graphics: Integrated Intel HD Graphics controller ■ Memory: Up to 8GB of dual-channel DDR3L 1333MHz ■ Usable in industrial temperature ranges *For more details, please refer to the PDF document or feel free to contact us.
Achieved high computing performance and graphics performance with the Qseven form factor!
"ATLAS" is a Time Coordinated Computing Qseven Rel. 2.1 compliant module equipped with Intel Atom X6000E series, Intel Pentium, Celeron N, and J series SoCs (Elkhart Lake). It achieves high computing and graphics performance in a Qseven form factor. It is applicable in various fields such as gaming, multimedia devices, and visual computing. 【Features】 ■CPU - Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors ■Connectivity - GbE x 1, high-precision time protocol IEEE 1588, USB 2.0 x 6, SuperSpeed USB 10Gbps x 2, up to PCI-e x 4 *For more details, please refer to the PDF document or feel free to contact us.
MPU built with advanced 14LPC FinFET process technology! Achieving increased speed and power efficiency.
"ELECTRA" is a μQseven standard module equipped with NXP i.MX 8M Mini & NXP i.MX 8M Nano processors. Built on advanced 14LPC FinFET process technology, this MPU achieves high speed and improved power efficiency. It is used in fields such as HMI, multimedia devices, thin clients, and vending machines. 【Features】 ■ CPU ・NXP i.MX 8M Mini family / i.MX 8M Nano family ■ Connectivity ・Gigabit Ethernet, optional Wi-Fi + BT 5.0, UART x 2, optional CAN, USB 2.0 x 5, PCI-e x1 x 1 *For more details, please refer to the PDF document or feel free to contact us.
NXP i.MX 8 application processor equipped! Qseven Rel. 2.1 compliant module
"MAIA" is a CPU module that leverages the wide scalability offered by the Qseven form factor and the i.MX 8 family. It is equipped with the NXP i.MX 8 application processor. The graphics feature an integrated GPU that supports two simultaneous video outputs. It can be applied in various fields such as industrial automation and control, smart vision, and vending machines. 【Features】 ■CPU - NXP i.MX 8 application processor ■Connectivity - USB 3.0 x 1, PCI-e x1 Gen3, CSI camera connector, boot selection signal ■Graphics - Integrated GPU, supports two simultaneous video outputs *For more details, please refer to the PDF document or feel free to contact us.
Achieve compact and highly flexible OTS modules at unique costs! Usable in industrial temperature ranges.
"NEMBUS" is a μQseven standard module equipped with the NXP i.MX 6 processor. It achieves a compact and highly flexible OTS module at a unique cost. It is used in various fields such as HMI, handheld terminals, and wireless technology. It can be used in an industrial temperature range, and the memory can be equipped with up to 1GB of onboard DDR3L. 【Features】 ■ CPU: Single-core/Dual-core Lite (Arm Cortex A9 core) ■ Connectivity: Fast Ethernet, GPI/O ■ Graphics: Dedicated 2D/3D graphics processor ■ Memory: Up to 1GB of onboard DDR3L ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.
For edge devices in challenging environments! Applicable to a wide range of fields such as games and HMIs.
The "CALLISTO" we handle is a COM Express 3.1 Type 6 Basic module equipped with a 13th generation Intel processor. It can be used in industrial temperature ranges. It enables intensive video processing and AI-based analysis for edge devices in challenging environments. It can be applied in various fields, including automation, biomedical/medical devices, surveillance equipment, and transportation. 【Features】 ■ CPU: 13th generation Intel processor aimed at IoT applications ■ Graphics: Embedded Intel Iris Xe graphics with up to 96 execution units ■ Connectivity: 1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4 ■ Memory: Two DDR5 SO-DIMM slots supporting DDR5-4800 IBECC memory *For more details, please refer to the PDF document or feel free to contact us.
The operating temperature of the industrial version is -40°C to +85°C! Introducing products with versatility and robustness.
"CHANDRA" is a CPU module equipped with Intel Atom E3800 and Celeron families. It offers versatility and robustness, and can be used in industrial temperature ranges. It is applicable in a wide range of fields such as avionics, industrial automation and control, and transportation. Additionally, the video interface can be switched to manage additional DDI, embedded display port, or 18/24-bit single/dual-channel LVDS interfaces. 【Features】 ■ CPU: Intel Atom E3800 and Celeron family ■ Graphics: Integrated Intel HD Graphics 4000 series controller ■ Connectivity: 4x USB 3.0; 7x USB 2.0; 4x PCI-e x1 Gen2 ■ Memory: DDR3L SO-DIMM slots x2, up to 8GB *For more details, please refer to the PDF document or feel free to contact us.
Supports four independent displays! x86 "Zen" Core and elite GPU performance.
The product we handle, 'CHARON', is a COM Express Rel.3.0 Compact Type 6 module equipped with an AMD Ryzen embedded V1000 processor. The graphics feature an AMD Radeon Vega GPU with up to 11 computing units and supports DirectX 12. It can be used in industrial temperature ranges. This product is suitable for fields such as biomedical/medical devices and digital signage-infotainment. 【Features】 ■ CPU: AMD Ryzen embedded V1000 processor ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen 3 ■ Memory: Supports up to two DDR4 SO-DIMM slots with DDR4-3200 ECC memory *For more details, please refer to the PDF document or feel free to contact us.
