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CPU Module Product List and Ranking from 15 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  2. ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
  3. SECO S.p.A Italy//Industrial Electrical Equipment
  4. 4 Toradex Japan株式会社 Tokyo//Industrial Electrical Equipment
  5. 5 三井電子 産業機器分野のサービスパートーナー Tokyo//Electronic Components and Semiconductors
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CPU Module Product ranking

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. NXP i.MX95 OSM CPU module OSM-IMX95 Suntex Co., Ltd.
  2. MX93/91SOM module 三井電子 産業機器分野のサービスパートーナー
  3. CPU module "SMARC" ADLINKジャパン 東京本社
  4. "CPU Module" Verdin iMX8M Mini Toradex Japan株式会社
  5. 4 CPU module "SMARC"【LEC-ASL】 ADLINKジャパン 東京本社

CPU Module Product List

61～90 item / All 96 items

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SECO CPU Module Trizeps VIII Plus

SECO CPU Module Trizeps VIII Plus

Trizeps SODIMM-200 CPU module (size 67.6x36.7mm), NXP i.MX 8M Plus

Features ■ Equipped with NXPi.MX8MPlus application processor ■ Supports 2x Gigabit Ethernet, 2x USB 3.0, 2x CAN-FD, PCIe, LVDS, 2x MIPI-CSI, WiFi/Bluetooth ■ Integrated GPU with multi-display support GC520L2D accelerator + GC7000UL3D accelerator ■ Onboard LPDDR4-4000 memory up to 8GB ■ Operating temperature 0 to 70°C (optional: -40°C to 85°C) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO SMARC CPU Module LEXELL

SECO SMARC CPU Module LEXELL

SM-C12, NXP i.MX 8M Family, ARM Cortex-A53, Size 50x82mm

Features ■ Equipped with NXP i.MX 8M Plus application processor ■ Supports WiFi + BT LE; CSI camera; QuadSPI interface; 14x GPI/Os ■ Integrated GPU that supports two independent displays ■ Onboard LPDDR4-4000 with a maximum of 6GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Yocto/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO SMARC CPU Module SWAN (SM-D16)

SECO SMARC CPU Module SWAN (SM-D16)

NXP i.MX 8X Family, ARM Cortex-A35, size 50x82mm

Features ■ Equipped with NXP i.MX 8X Plus application processor ■ 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; supports QuadSPI interface ■ Integrated GPU supporting two independent displays ■ Onboard LPDDR4-2400 with up to 4GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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SECO COM-HPC CPU Module CARINA

SECO COM-HPC CPU Module CARINA

11th Core i series (Tiger Lake-UP3), equipped with 2xDDR4-3200 ECC memory, maximum 64GB.

Features ■ Supports 11th generation Intel Core processors and Intel Celeron processors ■ 4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3; 1x PCI-e x4 Gen4; supports up to 2x 2.5GbE ■ Intel Iris Xe Graphics Core Gen12 GPU with up to 96 EU, supports up to 4 independent displays ■ Equipped with 2x DDR5-4800 memory, maximum 64GB ■ Operating temperature 0 to 60℃ (optional: -40 to 85℃) ■ Dimensions: 120x95mm ■ OS: Win10 IoT/Linux/Yocto/VxWorks7.0/Android

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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COM-HPC CPU Module COM-HPC-cRLS

COM-HPC CPU Module COM-HPC-cRLS

ADLINK, dimensions 160X120 mm, 13th generation Core i9/i7/i5/i3, 2xDDR5-3200 up to 128GB

【ADLINK COM-HPC-cRLS Features】 ■ Supports 13th generation Intel Core i9/i7/i5/i3 processors ■ Up to 24 cores, 32 threads (8 P-cores, 16 E-cores) ■ Up to 128GB DDR5 (up to 4800 MT/s) ■ Intel AVX-512 VNNI, Intel DL Boost ■ Intel UHD 770 Xe graphics ■ 16x PCIe Gen5, 8x PCIe Gen4 lanes, 14x PCIe Gen3 lanes ■ 2x 2.5GbE, Intel TCC, TSN capable ■ 4x USB 3.0/2.0/1.1, 8x USB 2.0 ■ 2x SATA, 2x UART, 12x GPIO

  • Embedded Board Computers
  • Evaluation Board
  • Image Processing Board
  • CPU Module

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NXP i.MX93 OSM CPU Module OSM-IMX93

NXP i.MX93 OSM CPU Module OSM-IMX93

ADLINK, NXP i.MX 93 with 2-core Arm Cortex-A55 & M33, LPDDR4L up to 2GB

【ADLINK OSM-IMX93 Features】 ■Dimensions: 45mm x 45mm ■NXP i.MX93 series (2-core Arm Cortex-A55 + M33) ■Equipped with TrustZone technology supporting Armv8 cryptographic functions ■Supports Arm Ethos U-65 micro NPU ■Supports independent display via 1x MIPI DSI ■LPDDR4L up to 2GB ■3x USB 2.0, 1x USB 2.0, 4x UART, 2x CAN2.0, 2x SPI, 1x I²S interface, 2x I2C interfaces, 16x GPIO ■Dual GbE (one port supports TSN) ■Certified to IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

  • スクリーンショット 2025-10-24 142126.png
  • Embedded Board Computers
  • CPU Module

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NXP i.MX95 OSM CPU module OSM-IMX95

NXP i.MX95 OSM CPU module OSM-IMX95

NXP i.MX 95 with 6x Arm Cortex-A55, LPDDR4L up to 8GB, eMMC up to 128GB

**ADLINK OSM-IMX95 Features** - Dimensions: 45mm x 45mm - i.MX95 series (equipped with 4-core or 6-core Cortex-A55, Cortex-M7, and M33 MCU) - DSI and LVDS graphic output interfaces - LPDDR4L up to 8GB - eMMC up to 128GB - 1x USB 3.0, 1x USB 2.0, 4x UART, 3x SPI, 2x I²S interfaces, 4x I2C interfaces, 12x GPIO, 1x GEN3 single lane - Dual GbE (TSN compatible) - Certified to IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

  • スクリーンショット 2025-10-24 142126.png
  • Embedded Board Computers
  • CPU Module

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CPU module "SMARC"【LEC-ASL】

CPU module "SMARC"【LEC-ASL】

7th Generation Intel Atom x7000RE & x7000C Processor Equipped SMARC Short Size Module

The ADLINK LEC-ASL is a SMARC module compatible with 2/4/8 core Intel Atom x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) processors (formerly Amston Lake), integrating Intel UHD graphics and high-speed interfaces. The LEC-ASL module supports up to 16GB LPDDR5 memory and up to 256GB eMMC storage (build option), making it ideal for mission-critical fanless edge computing applications that operate 24/7, thanks to its robust operating temperature range and low power envelope.

  • Embedded Board Computers
  • CPU Module

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CPU module

CPU module

The heart of the CPU board is realized on a small board! Designed and developed to specifications that suit the customer's needs.

N.M.R. Corporation handles "CPU Modules." This product realizes the heart of the CPU board on a small board. Various peripheral interfaces can be designed and developed according to the customer's specifications. Notably, it significantly differs from the ETX standard by adding PCI Express interfaces and many I/Os. 【Product Lineup】 ■ICE-BT-T10 ■ICE-BT-T10W2 ■ICE-ULT3 ■ICE-BT-T6 ■iQ7-BT-E38001 ■iQ7-BT-E38001W2 *For more details, please refer to the PDF materials or feel free to contact us.

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Q-Seven CPU Module [EQM-APL]

Q-Seven CPU Module [EQM-APL]

Q-Seven module equipped with Intel processor

Avalue's rugged environmental system is specially designed for long-term operation in harsh environments. Additionally, it is designed to maintain reliability in computer processing even under severe usage conditions. For more details, please contact us or download the catalog.

  • Embedded Board Computers
  • CPU Module

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SoM/CPUboard『iW-RainboW-G40M-OSM』

SoM/CPUboard『iW-RainboW-G40M-OSM』

Equipped with Bluetooth 5.0! Over 10 years of product lifespan program.

We would like to introduce the "iW-RainboW-G40M-OSM" that we handle. This product is an i.MX 8M Plus OSM LGA module, equipped with a 64-bit ARMv8 architecture, featuring the i.MX 8M Plus Q/QL/D CPU. Additionally, it includes an NPU with a neural network performance of 2.3 TOPS and 8GB of LPDDR4 memory. 【Features】 ■ i.MX 8M Plus Q/QL/D CPU ■ NPU with 2.3 TOPS neural network performance ■ 8GB LPDDR4 memory ■ IEEE 802.11a/b/g/n/ac/ax Wi-Fi ■ Bluetooth 5.0 *For more details, please refer to the PDF document or feel free to contact us.

  • Industrial PCs
  • Embedded Board Computers
  • Embedded OS
  • CPU Module

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6U VME CPU Module『SVA701』

6U VME CPU Module『SVA701』

Long-term supply with embedded specified components! Function expansion/customization is possible with option boards.

The "SVA701" is a 6U VME CPU Module equipped with the necessary I/F and functional expandability for control VME boards. By adopting the 11th generation TigerLake UP3 and our own PCIe-VME bridge (FPGA), long-term product supply is possible. It features endian-specific byte swap functionality, making VME access easy. Please feel free to contact us if you have any requests. 【Features】 ■ 11th generation Intel Processor series ■ Implementation of embedded system requirements ■ In-house development/domestic production *For more details, please refer to the PDF document or feel free to contact us.

  • Expansion Boards
  • CPU Module

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"CPU Module" Verdin iMX8M Plus

"CPU Module" Verdin iMX8M Plus

NXP i.MX8M Plus equipped with Toradex's Verdin family CPU module.

The NXP i.MX 8M Plus SoC features up to four powerful 64-bit Armv8 Cortex-A53 cores, providing sufficient power for typical industrial and medical applications while being a cost-effective choice for running the latest graphical user interface on Linux. The integrated Neural Processing Unit (NPU) is designed from the ground up to perform deep learning inference, capable of delivering several times the performance of CPU and GPU-based solutions in the same power range. Toradex offers integration with popular machine learning frameworks such as TensorFlow.

  • Microcomputer
  • ASIC
  • CPU Module

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COM Express Intel 8th Generation CPU Module

COM Express Intel 8th Generation CPU Module

COM-EXPRESS TYPE6 compliant, Intel Whisky Lake equipped CPU module (compact)

■Reduces overall development costs ■Global common standard ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch

  • Embedded Board Computers
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2023 Comprehensive Catalog (CPU Modules and Compact Embedded Boards)

2023 Comprehensive Catalog (CPU Modules and Compact Embedded Boards)

2023 SECO's latest products packed! Over 80 products featured.

Board products such as CPU modules and compact embedded boards, as of May 2023, include the entire lineup from SECO.

  • Embedded Board Computers
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CPU module "AVIOR"

CPU module "AVIOR"

Performance of x86 in low power consumption modules! Introducing Qseven Rel. 2.0 compliant modules!

"AVIOR" is a CPU module equipped with Intel Atom E3800 and Celeron family (Bay Trail) processors. It offers x86 performance in a low-power module and can be used in industrial temperature ranges. It is suitable for fields such as biomedical/medical devices, HMI, industrial automation and control, and measurement instruments. 【Features】 ■ CPU: Intel Atom E3800, Celeron family (System-on-Chip) ■ Connectivity: USB 2.0 × 6, USB 3.0 × 1, PCI-e x1 × 3 ■ Graphics: Integrated Intel HD Graphics controller ■ Memory: Up to 8GB of dual-channel DDR3L 1333MHz ■ Usable in industrial temperature ranges *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ATLAS"

CPU module "ATLAS"

Achieved high computing performance and graphics performance with the Qseven form factor!

"ATLAS" is a Time Coordinated Computing Qseven Rel. 2.1 compliant module equipped with Intel Atom X6000E series, Intel Pentium, Celeron N, and J series SoCs (Elkhart Lake). It achieves high computing and graphics performance in a Qseven form factor. It is applicable in various fields such as gaming, multimedia devices, and visual computing. 【Features】 ■CPU - Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors ■Connectivity - GbE x 1, high-precision time protocol IEEE 1588, USB 2.0 x 6, SuperSpeed USB 10Gbps x 2, up to PCI-e x 4 *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ELECTRA"

CPU module "ELECTRA"

MPU built with advanced 14LPC FinFET process technology! Achieving increased speed and power efficiency.

"ELECTRA" is a μQseven standard module equipped with NXP i.MX 8M Mini & NXP i.MX 8M Nano processors. Built on advanced 14LPC FinFET process technology, this MPU achieves high speed and improved power efficiency. It is used in fields such as HMI, multimedia devices, thin clients, and vending machines. 【Features】 ■ CPU ・NXP i.MX 8M Mini family / i.MX 8M Nano family ■ Connectivity ・Gigabit Ethernet, optional Wi-Fi + BT 5.0, UART x 2, optional CAN, USB 2.0 x 5, PCI-e x1 x 1 *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "MAIA"

CPU module "MAIA"

NXP i.MX 8 application processor equipped! Qseven Rel. 2.1 compliant module

"MAIA" is a CPU module that leverages the wide scalability offered by the Qseven form factor and the i.MX 8 family. It is equipped with the NXP i.MX 8 application processor. The graphics feature an integrated GPU that supports two simultaneous video outputs. It can be applied in various fields such as industrial automation and control, smart vision, and vending machines. 【Features】 ■CPU - NXP i.MX 8 application processor ■Connectivity - USB 3.0 x 1, PCI-e x1 Gen3, CSI camera connector, boot selection signal ■Graphics - Integrated GPU, supports two simultaneous video outputs *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "NEMBUS"

CPU module "NEMBUS"

Achieve compact and highly flexible OTS modules at unique costs! Usable in industrial temperature ranges.

"NEMBUS" is a μQseven standard module equipped with the NXP i.MX 6 processor. It achieves a compact and highly flexible OTS module at a unique cost. It is used in various fields such as HMI, handheld terminals, and wireless technology. It can be used in an industrial temperature range, and the memory can be equipped with up to 1GB of onboard DDR3L. 【Features】 ■ CPU: Single-core/Dual-core Lite (Arm Cortex A9 core) ■ Connectivity: Fast Ethernet, GPI/O ■ Graphics: Dedicated 2D/3D graphics processor ■ Memory: Up to 1GB of onboard DDR3L ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "CALLISTO"

CPU module "CALLISTO"

For edge devices in challenging environments! Applicable to a wide range of fields such as games and HMIs.

The "CALLISTO" we handle is a COM Express 3.1 Type 6 Basic module equipped with a 13th generation Intel processor. It can be used in industrial temperature ranges. It enables intensive video processing and AI-based analysis for edge devices in challenging environments. It can be applied in various fields, including automation, biomedical/medical devices, surveillance equipment, and transportation. 【Features】 ■ CPU: 13th generation Intel processor aimed at IoT applications ■ Graphics: Embedded Intel Iris Xe graphics with up to 96 execution units ■ Connectivity: 1x NBase-T 2.5GbE; 2x USB4.0 Gen2; 4x USB3.2 Gen2; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x8 Gen4 and 2x PEG x4 Gen4 ■ Memory: Two DDR5 SO-DIMM slots supporting DDR5-4800 IBECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "CHANDRA"

CPU module "CHANDRA"

The operating temperature of the industrial version is -40°C to +85°C! Introducing products with versatility and robustness.

"CHANDRA" is a CPU module equipped with Intel Atom E3800 and Celeron families. It offers versatility and robustness, and can be used in industrial temperature ranges. It is applicable in a wide range of fields such as avionics, industrial automation and control, and transportation. Additionally, the video interface can be switched to manage additional DDI, embedded display port, or 18/24-bit single/dual-channel LVDS interfaces. 【Features】 ■ CPU: Intel Atom E3800 and Celeron family ■ Graphics: Integrated Intel HD Graphics 4000 series controller ■ Connectivity: 4x USB 3.0; 7x USB 2.0; 4x PCI-e x1 Gen2 ■ Memory: DDR3L SO-DIMM slots x2, up to 8GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "CHARON"

CPU module "CHARON"

Supports four independent displays! x86 "Zen" Core and elite GPU performance.

The product we handle, 'CHARON', is a COM Express Rel.3.0 Compact Type 6 module equipped with an AMD Ryzen embedded V1000 processor. The graphics feature an AMD Radeon Vega GPU with up to 11 computing units and supports DirectX 12. It can be used in industrial temperature ranges. This product is suitable for fields such as biomedical/medical devices and digital signage-infotainment. 【Features】 ■ CPU: AMD Ryzen embedded V1000 processor ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 4x PCI-e x1 Gen 3, PEG x8 Gen 3 ■ Memory: Supports up to two DDR4 SO-DIMM slots with DDR4-3200 ECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ECHO"

CPU module "ECHO"

The operating temperature of the commercial version is 0°C to +60°C! It supports various designs with a scalable form factor.

"ECHO" is a COM Express Basic Type 6 module equipped with an Intel Haswell processor. It supports three simultaneous video outputs and is compatible with DirectX 11 and OpenGL 4.0. It can be applied in fields such as biomedical/medical devices and gaming. This high-performance product features a scalable form factor that accommodates various designs. Please feel free to contact us for inquiries. 【Features】 ■ CPU: Intel Haswell family CPU ■ Graphics: Integrated Intel HD Graphics 4600 ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 7x PCI-e x1 ■ Memory: Up to 16GB DDR3L-1600 with two SO-DIMM slots *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "JULIET"

CPU module "JULIET"

COM Express form factor and high-performance Intel SoC for secure IoT applications!

"JULIET" is a COM Express Rel. 3.0 Basic Type 7 module equipped with an Intel Xeon D-1700 processor. It can be used in industrial temperature ranges and is applicable in fields such as industrial automation and control, telecommunications, and server high-performance computing. Additionally, it supports up to four DDR4 SO-DIMM slots with ECC-enabled DDR4-2933 memory. 【Features】 ■ CPU: Intel Xeon D-1700 processor ■ Networking: 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Connectivity: 4x Superspeed USB 5Gbps; 16x PCI-e Gen4 lanes + 16x PCI-e Gen3 lanes *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "LARISSA"

CPU module "LARISSA"

For mobile applications! Low power consumption multi-core Intel architecture

"LARISSA" is a COM Express 3.0 Compact Type 6 module equipped with 8th generation Intel Core and Celeron U series processors. The operating temperature for the commercial version is 0°C to +60°C, and the dimensions are 95x95mm. It features two DDR4 SODIMM slots that support DDR4-2400 memory. It can be applied in various fields, including biomedical/medical devices, edge computing, HMI, information kiosks, and measurement instruments. 【Features】 ■ CPU: 8th generation Intel Core and 15W TDP Celeron 4000 series processors (formerly Whiskey Lake) ■ Graphics: Intel UHD Graphics 620 / 610 ■ Connectivity: 4 x USB 3.1; 8 x USB 2.0, up to 8 x PCI-e x 1 ■ Memory: Two DDR4 SODIMM slots supporting DDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "OBERON"

CPU module "OBERON"

Improved processing power due to outstanding platform performance! Applicable in fields such as HMI and gaming.

"OBERON" is a COM Express 3.0 Basic Type 6 module equipped with Intel Core/Xeon, Core/Xeon/Celeron processors. With outstanding platform performance, it enhances processing capabilities. The maximum number of cores is 6, and the maximum number of threads is 12. It also supports up to three digital display interfaces (DDI), DP 1.2, DVI, and HDMI 1.4. Please feel free to contact us for inquiries. 【Features】 ■Graphics: Intel UHD Graphics 630/P630 architecture, with up to 48 execution units ■Connectivity: 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■Memory: Two DDR4 SO-DIMM slots supporting DDR4-2666 ECC memory, up to 64 GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "OPHELIA"

CPU module "OPHELIA"

For demanding edge applications with graphics and computing requirements!

"OPHELIA" is a COM Express 3.0 Type 6 Compact module equipped with the AMD Ryzen embedded V2000 SoC. The graphics feature an integrated AMD Radeon GPU with up to 7 computing units, supporting up to 4 independent displays. This product is applicable in various fields, including digital signage, infotainment, information kiosks, and monitoring equipment. 【Features】 ■ CPU: Embedded Ryzen V series V2000 FP6 platform with "Zen2" CPU and Radeon GPU core ■ Connectivity: 1x GbE; 1x SuperSpeed USB 10Gbps; 3x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEGx8 Gen3 ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC and non-ECC memory (up to 64 GB) *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ORION"

CPU module "ORION"

Enhanced AI performance and efficiency! CPU module capable of operating in low power state SOC.

The "ORION" we handle is a COM-HPC client module equipped with a 12th generation Intel Core processor. Using a PCI-e x4 port, it allows for the connection of M.2 NVMe drives on the carrier board. It features immersive graphics and enhanced AI performance and efficiency in a standard form factor. The SOC can operate in a low power state and is applicable in various fields, including visual computing, transportation, surveillance equipment, and robotics. 【Features】 ■ CPU: 12th generation Intel Core processor ■ Graphics: Intel Iris Xe architecture, up to 96 EUs, up to 4 independent displays ■ Memory: Two DDR5 SO-DIMM slots supporting DDR5-4800 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "TARVOS"

CPU module "TARVOS"

When high graphics and hyper-threading are important! Applicable in fields such as telecommunications.

We would like to introduce our CPU module 'TARVOS'. It is equipped with Intel's 6th and 7th generation Core/Xeon processors and supports up to three independent displays. The maximum number of cores is 4, making it suitable for various fields including biomedical/medical devices, HMI, gaming, and digital signage-infotainment. Please feel free to contact us if you have any inquiries. 【Features】 ■ CPU: Intel 6th and 7th generation Core/Xeon CPU ■ Graphics: Intel HD Graphics 530/P530/630/P630 ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■ Memory: 2 x DDR4 So-DIMM slots *For more details, please refer to the PDF document or feel free to contact us.

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