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CPU Module Product List and Ranking from 14 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. 富士ソフト Kanagawa//software インダストリービジネス事業部
  2. ADLINKジャパン Tokyo//Industrial Electrical Equipment 東京本社
  3. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  4. 4 エヌ・エム・アール Tokyo//IT/Telecommunications
  5. 4 SECO S.p.A Italy//Industrial Electrical Equipment
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CPU Module Product ranking

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. SoM/CPUboard『Arbor Technology EmQ-i2301』 富士ソフト インダストリービジネス事業部
  2. SOM/CPU board『manufactured by SECO μQ7-A76-J』 富士ソフト インダストリービジネス事業部
  3. SoM/CPU module『i.MX 91 SMARC』 富士ソフト インダストリービジネス事業部
  4. 4 SECO SMARC CPU Module LEVY (SM-D18) Suntex Co., Ltd.
  5. 4 CPU module "SMARC" ADLINKジャパン 東京本社

CPU Module Product List

31～45 item / All 94 items

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CPU Module "ARCALIS"

CPU Module "ARCALIS"

A compact Qseven module equipped with a high-efficiency architecture that has obtained safety certification!

"ARCALIS" is a Qseven Rel. 2.1 compliant module equipped with the NXP i.MX 8X application processor. It features a compact and safety-certified Qseven module with a high-efficiency architecture. It is used in various fields such as automation, edge computing, energy, HMI, and industrial automation and control. 【Features】 ■ CPU: NXP i.MX 8X application processor ■ Graphics: Integrated GPU, supports two simultaneous video outputs ■ Memory: Up to 4GB of implemented LPDDR4-2400 memory ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.

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CPU Module "LIBERTAS"

CPU Module "LIBERTAS"

An optimal balance of performance and size! Suitable for applications such as automation and wireless technology.

"LIBERTAS" is a μQseven standard module equipped with the NXP i.MX 6 processor. It features an optimal balance of performance and size, and can be used in industrial temperature ranges. It is suitable for fields such as automation, biomedical/medical devices, HMI, handheld terminals, and wireless technology. Please feel free to contact us if you have any inquiries. 【Features】 ■ CPU: Single-core, dual-core, quad-core (Arm Cortex-A9 core) ■ Connectivity: USB 2.0 × 4, Serial ports × 2, CAN bus ■ Graphics: Dedicated 2D/3D graphics processor ■ Memory: Up to 2GB of DDR3L ■ Usable in industrial temperature ranges *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "MIRA"

CPU module "MIRA"

Applicable to multimedia devices! Introducing Qseven solutions for embedded systems.

"MIRA" is a Qseven Rel. 2.1 compliant module equipped with the NXP i.MX 8M application processor. It can be used in industrial temperature ranges. The graphics feature an integrated GPU and support for two simultaneous video outputs. This is an embedded system Qseven solution suitable for various fields such as home automation, multimedia devices, and transportation. 【Features】 ■ CPU: NXP i.MX 8M application processor ■ Connectivity: USB 3.0 x 1, USB 2.0 x 4, PCI-e x1 Gen2 x 2, etc. ■ Graphics: Integrated GPU, supports two simultaneous video outputs ■ Memory: Up to 4GB of DDR4-2400 memory installed ■ Usable in industrial temperature ranges *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "NAOS"

CPU module "NAOS"

CPU module with high graphic performance and low power consumption design due to extreme temperatures.

The "NAOS" is a Qseven Rel. 2.1 compliant module equipped with Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series (Apollo Lake) processors. It can be used in an industrial temperature range. It features high graphic performance and a low power consumption design due to extreme temperatures. It is used in various fields, including automotive, gaming, and mobile devices. 【Features】 ■ CPU - Intel Atom X series, Intel Celeron J/N series, Intel Pentium N series ■ Connectivity - USB 3.0 x 2, PCI-e x 4, USB 2.0 x 6 *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "AMOS"

CPU module "AMOS"

Scalable graphics performance makes a difference! Usable in industrial temperature ranges.

"AMOS" is a CPU module equipped with AMD embedded 3rd generation R series SoC, G series SoC-I, or G series SoC-J. It can be used in industrial temperature ranges. The memory supports two SO-DIMM slots for DDR4 ECC modules and non-ECC modules. This product is applicable in a wide range of fields such as gaming, medical, and digital signage-infotainment. 【Features】 ■ CPU: AMD embedded 3rd generation R series SoC or G series SoC-I ■ Graphics: AMD Radeon 3rd generation Graphics Core Next (GCN) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3 ■ Memory: Supports two SO-DIMM slots for DDR4 ECC modules and non-ECC modules *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "CALYPSO"

CPU module "CALYPSO"

Usable in industrial temperature ranges! High-performance and highly responsive CPU and GPU computing.

"CALYPSO" is a CPU module equipped with an 11th generation Intel Core processor. It can be used in industrial temperature ranges and is applicable in various fields such as biomedical/medical devices, measurement instruments, and transportation. It offers high-performance and responsive CPU and GPU computing in a COM Express Compact form factor. Please feel free to contact us for inquiries. 【Features】 ■ CPU: Intel Core series (formerly Tiger Lake UP3) processor ■ Graphics: Integrated Intel Iris Xe graphics with up to 96 execution units ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 IBECC memory, up to 64GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "CARINA"

CPU module "CARINA"

Supports up to 64GB of memory! Introducing a CPU module that can be used in industrial temperature ranges.

"CARINA" is a COM-HPC client module equipped with 11th generation Intel Core and Celeron processors. It features Intel Iris Xe graphics with up to 96 execution units (EU) and supports up to four independent displays. It is applicable in various fields such as automation, edge computing, information kiosks, robotics, and thin clients. 【Features】 ■ CPU: 11th generation Intel Core processors and Intel Celeron processors ■ Connectivity: 4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3; 1x PCI-e x4 Gen4; up to 2x 2.5GbE ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU Module "EUPHORIA"

CPU Module "EUPHORIA"

Equipped with real-time options! Cost-effective low-power computing.

"EUPHORIA" is a COM Express 3.1 Type 6 Compact module equipped with Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors. It can be used in an industrial temperature range. It supports up to three independent displays, with an operating temperature of 0°C to +60°C for commercial versions and -40°C to +85°C for industrial versions. It is applicable in a wide range of fields, including industrial automation and control, in-vehicle infotainment systems, robotics, and telecommunications. 【Features】 ■ CPU: Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors ■ Graphics: Integrated Intel Gen11 UHD Graphics controller ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 IBECC memory, up to 32GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "LAGOON"

CPU module "LAGOON"

Top-class connectivity! Applicable to a wide range of fields such as robotics and transportation.

"LAGOON" is a CPU module that can be used in industrial temperature ranges. It achieves processing power, high-performance graphics, and top-class connectivity with the COM-HPC modular solution. It supports up to three simultaneous video outputs and can connect M.2 NVMe drives on the carrier board using a PCI-e x4 port. 【Features】 ■ CPU: 11th generation Intel Xeon, Core, and Celeron processors ■ Graphics: Intel Iris Xe Graphics Core Gen12 GPU with up to 32 EU and up to four independent displays ■ Connectivity: 2x USB 4; 2x USB 3.2 Gen 2x2; 8x USB 2.0; 20x PCI-e Gen3 lanes; 20x PCI-e Gen4 lanes; up to 2x 2.5GbE *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "METIS"

CPU module "METIS"

Operating temperature 0℃ to +60℃! Low-end AMD Ryzen on COM Express Type 6 Compact.

"METIS" is a COM Express Rel.3.0 Compact Type 6 module equipped with the AMD Ryzen Embedded R1000 family SoC. It supports up to three Digital Display Interfaces (DDI), including DP1.3, DVI, and HDMI 1.4/2.0, allowing for three independent displays. It is applicable in a wide range of fields such as digital signage, infotainment, and biomedical applications. Please feel free to contact us for inquiries. 【Features】 ■ CPU: AMD Ryzen Embedded R1000 Processor ■ Graphics: AMD Radeon Vega GPU (with 3 compute units) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; up to 5 PCI-e x1; PEG x4 Gen3 ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-2400 ECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "MIRANDA"

CPU module "MIRANDA"

Robust solutions for industrial environments! Introducing products that can be used in industrial temperature ranges.

The "MIRANDA" is a CPU module equipped with Intel Atom X, Intel Celeron J/N, and Intel Pentium N series processors. It features a microSD card slot and can implement an optional eMMC 5.0 drive onboard. The main application fields are avionics, biomedical/medical devices, gaming, and transportation. Please feel free to contact us if you have any inquiries. 【Features】 ■ Graphics: Intel HD Graphics 500 series controller (with up to 18 execution units) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 5x PCI-e x1 Gen2 ■ Memory: Two DDR3L SO-DIMM slots supporting DDR3L-1866 non-ECC memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "THEBE"

CPU module "THEBE"

Introducing a scalable product with excellent performance and enhanced connectivity!

"THEBE" is a COM Express Rel.3.0 Basic Type 7 module equipped with an AMD EPYC Embedded 3000 series SoC. It can be used in an industrial temperature range and supports up to four DDR4 SO-DIMM slots with DDR4-2666 memory, compatible with both ECC and non-ECC. This is a scalable product with excellent performance and increased connectivity. Please feel free to contact us for inquiries. 【Features】 ■ CPU: AMD EPYC Embedded 3000 Family SoC ■ Networking: 4x 10GBASE-KR interfaces + 1x 1GbE port (with NC-SI) ■ Connectivity: 4x USB 3.1; 24 lanes of PCI-e Gen3 lanes ■ Memory: 4 DDR4 SO-DIMM slots supporting ECC DDR4-2666 memory, up to 128 GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "FINLAY"

CPU module "FINLAY"

Deep learning inference and UHD media processing! Applicable in fields such as automation and HMI.

The "FINLAY" is a SMARC Rel.2.1 compliant module equipped with Xilinx Zynq Ultrascale+ Intel Atom processor x7000E series, Intel Core i3 processor, and Intel processor N series. It enables power-efficient deep learning inference and UHD media processing in a small footprint for video and imaging-intensive applications. The memory is implemented with quad-channel LPDDR5 with IBECC. 【Specifications (excerpt)】 ■ CPU: Intel Atom processor x7000E series, Intel Core i3 processor, Intel processor N series (codename: Alder Lake N) aimed at IoT and multimedia applications. ■ Graphics: Integrated Intel UHD graphics powered by Intel Xe architecture, supporting up to three video outputs simultaneously at 4K resolution. *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "HALLEY"

CPU module "HALLEY"

SMARC Rel 2.1.1 for FuSa applications! Graphics support simultaneous three video outputs.

"HALLEY" is a SMARC module specifically designed for functional safety (FuSa) in safety-related systems. It is equipped with Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors. The FuSa-certified Intel Atom x6000E CPU complies with the requirements of IEC 61508 and ISO 13849 regarding functional safety and safety integrity levels. 【Specifications (excerpt)】 ■CPU: Intel Atom x6000E series, Intel Pentium, Celeron N, and J series processors ■Graphics: Gen11 UHD integrated graphics controller, supporting three simultaneous video outputs ■Memory: Quad-channel LPDDR4x implementation with IBECC *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "JAGER"

CPU module "JAGER"

High performance, low power consumption, and rich features! SMARC Rel. 2.1.1 module processor.

"JAGER" is a CPU module equipped with Xilinx Zynq Ultrascale+, Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series. It features high performance, low power consumption, and a rich set of functions. The memory is a dual-channel implementation of LPDDR4-2400 memory. It is applicable in various fields, including automotive, biomedical/medical devices, and multimedia devices. 【Specifications (excerpt)】 ■ CPU: Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series (formerly Apollo Lake) processors ■ Graphics: Intel HD Graphics 500 series controller, equipped with up to 18 execution units ■ Memory: Dual-channel implementation of LPDDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.

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