Last Updated： Aggregation Period:Nov 12, 2025～Dec 09, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Nov 12, 2025～Dec 09, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Nov 12, 2025～Dec 09, 2025
This ranking is based on the number of page views on our site.
31～45 item / All 102 items
COM-EXPRESS TYPE6 compliant CPU module with Intel Coffee Lake (Basic)
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
COM-EXPRESS TYPE6 compliant, CPU module equipped with AMD Ryzen V2000 (compact)
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
COM-HPC compliant CPU module with Intel Alder Lake H (Client)
■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
SMARC Rev. 2.1.1 compliant, Intel Elkhart Lake【HALLEY】
■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible to design carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
SMARC Rev. 2.1.1 compliant CPU module with NXP i.MX8M Plus
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
SMARC Rev. 2.1.1 compliant CPU module with NXP i.MX8M
■Reduces overall development costs ■Global common standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Possible to design carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
SMARC Rev. 2.1.1 compliant CPU module with NXP i.MX8X
■Reduces overall development costs ■Global standard specifications ■Compatible and no issues with successor products ■Long-term supply ■Feasible design of carrier boards compatible with both ARM and x86 ■Flexibility in functionality changes due to BOM component modifications ■Short development period, quick market launch
Intel Atom E3800 and Celeron processor equipped! Qseven Rel. 2.0 module
"ASTERION" is a mobile CPU module equipped with eMMC and a camera interface. It features Intel Atom E3800 and Celeron processors (Bay Trail). It is applicable in fields such as HMI, industrial automation and control, in-vehicle infotainment systems, and portable devices. 【Features】 ■ CPU: Intel Atom E3800 and Celeron family ■ Connectivity: USB 2.0 × 6, USB 3.0 × 1, PCI-e x1 × 3 ■ Graphics: Integrated Intel HD Graphics 4000 series controller ■ Memory: Up to 8GB of dual-channel DDR3L 1333MHz ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.
For surveillance equipment and transportation systems! The smallest class x86 standard module developed at a unique cost!
"KUMA" is a μQseven Rel. 2.0 module equipped with Intel Atom E3800 and Celeron processors (Bay Trail). The dimensions are 40×70mm (1.57 inches × 2.76 inches). It is applicable in various fields such as biomedical/medical devices, industrial automation and control, handheld terminals, robotics, and surveillance equipment. It is a minimum-class x86 standard module developed at a unique cost. 【Features】 ■ CPU: Intel Atom E3800 and Celeron family ■ Connectivity: USB 2.0 x 4, USB 3.0 x 1, PCI-e x1 x 3, LPC bus ■ Graphics: Integrated Intel HD Graphics 4000 series controller ■ Memory: Up to 4GB of single-channel DDR3L memory *For more details, please refer to the PDF document or feel free to contact us.
An optimal balance of performance and power! Applicable to automobiles, avionics, robotics, and more.
"ALKES" is a Qseven standard module equipped with the NXP i.MX 6 processor. It features an optimal balance of performance and power. It is suitable for various fields, including automotive and avionics, energy, industrial automation and control, robotics, and surveillance equipment. Please feel free to contact us when you need assistance. 【Features】 ■ CPU: Single-core, dual-core, quad-core (Arm Cortex-A9 core) ■ Connectivity: 2 serial ports, CAN port ■ Graphics: Dedicated 2D/3D graphics processor ■ Memory: Capable of supporting up to 4GB of DDR3L ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.
A compact Qseven module equipped with a high-efficiency architecture that has obtained safety certification!
"ARCALIS" is a Qseven Rel. 2.1 compliant module equipped with the NXP i.MX 8X application processor. It features a compact and safety-certified Qseven module with a high-efficiency architecture. It is used in various fields such as automation, edge computing, energy, HMI, and industrial automation and control. 【Features】 ■ CPU: NXP i.MX 8X application processor ■ Graphics: Integrated GPU, supports two simultaneous video outputs ■ Memory: Up to 4GB of implemented LPDDR4-2400 memory ■ Usable in industrial temperature range *For more details, please refer to the PDF document or feel free to contact us.
An optimal balance of performance and size! Suitable for applications such as automation and wireless technology.
"LIBERTAS" is a μQseven standard module equipped with the NXP i.MX 6 processor. It features an optimal balance of performance and size, and can be used in industrial temperature ranges. It is suitable for fields such as automation, biomedical/medical devices, HMI, handheld terminals, and wireless technology. Please feel free to contact us if you have any inquiries. 【Features】 ■ CPU: Single-core, dual-core, quad-core (Arm Cortex-A9 core) ■ Connectivity: USB 2.0 × 4, Serial ports × 2, CAN bus ■ Graphics: Dedicated 2D/3D graphics processor ■ Memory: Up to 2GB of DDR3L ■ Usable in industrial temperature ranges *For more details, please refer to the PDF document or feel free to contact us.
Applicable to multimedia devices! Introducing Qseven solutions for embedded systems.
"MIRA" is a Qseven Rel. 2.1 compliant module equipped with the NXP i.MX 8M application processor. It can be used in industrial temperature ranges. The graphics feature an integrated GPU and support for two simultaneous video outputs. This is an embedded system Qseven solution suitable for various fields such as home automation, multimedia devices, and transportation. 【Features】 ■ CPU: NXP i.MX 8M application processor ■ Connectivity: USB 3.0 x 1, USB 2.0 x 4, PCI-e x1 Gen2 x 2, etc. ■ Graphics: Integrated GPU, supports two simultaneous video outputs ■ Memory: Up to 4GB of DDR4-2400 memory installed ■ Usable in industrial temperature ranges *For more details, please refer to the PDF document or feel free to contact us.
CPU module with high graphic performance and low power consumption design due to extreme temperatures.
The "NAOS" is a Qseven Rel. 2.1 compliant module equipped with Intel Atom X series, Intel Celeron J/N series, and Intel Pentium N series (Apollo Lake) processors. It can be used in an industrial temperature range. It features high graphic performance and a low power consumption design due to extreme temperatures. It is used in various fields, including automotive, gaming, and mobile devices. 【Features】 ■ CPU - Intel Atom X series, Intel Celeron J/N series, Intel Pentium N series ■ Connectivity - USB 3.0 x 2, PCI-e x 4, USB 2.0 x 6 *For more details, please refer to the PDF document or feel free to contact us.
Scalable graphics performance makes a difference! Usable in industrial temperature ranges.
"AMOS" is a CPU module equipped with AMD embedded 3rd generation R series SoC, G series SoC-I, or G series SoC-J. It can be used in industrial temperature ranges. The memory supports two SO-DIMM slots for DDR4 ECC modules and non-ECC modules. This product is applicable in a wide range of fields such as gaming, medical, and digital signage-infotainment. 【Features】 ■ CPU: AMD embedded 3rd generation R series SoC or G series SoC-I ■ Graphics: AMD Radeon 3rd generation Graphics Core Next (GCN) ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 3x PCI-e x1 Gen3 ■ Memory: Supports two SO-DIMM slots for DDR4 ECC modules and non-ECC modules *For more details, please refer to the PDF document or feel free to contact us.
