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CPU Module Product List and Ranking from 15 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Jun 24, 2026～Jul 21, 2026
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jun 24, 2026～Jul 21, 2026
This ranking is based on the number of page views on our site.

  1. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  2. SECO S.p.A Italy//Industrial Electrical Equipment
  3. ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
  4. 4 サンリツオートメイション Tokyo//IT/Telecommunications
  5. 4 Toradex Japan株式会社 Tokyo//Industrial Electrical Equipment
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CPU Module Product ranking

Last Updated： Aggregation Period:Jun 24, 2026～Jul 21, 2026
This ranking is based on the number of page views on our site.

  1. NXP i.MX95 OSM CPU module OSM-IMX95 Suntex Co., Ltd.
  2. OSM CPU Module ADLINK OSM-MTK520 Suntex Co., Ltd.
  3. 6U VME CPU Module『SVA701』 サンリツオートメイション
  4. 4 OSM CPU Module ADLINK OSM-MTK510 Suntex Co., Ltd.
  5. 4 CPU module "LAGOON" SECO S.p.A

CPU Module Product List

91～100 item / All 100 items

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CPU module "OPHELIA"

CPU module "OPHELIA"

For demanding edge applications with graphics and computing requirements!

"OPHELIA" is a COM Express 3.0 Type 6 Compact module equipped with the AMD Ryzen embedded V2000 SoC. The graphics feature an integrated AMD Radeon GPU with up to 7 computing units, supporting up to 4 independent displays. This product is applicable in various fields, including digital signage, infotainment, information kiosks, and monitoring equipment. 【Features】 ■ CPU: Embedded Ryzen V series V2000 FP6 platform with "Zen2" CPU and Radeon GPU core ■ Connectivity: 1x GbE; 1x SuperSpeed USB 10Gbps; 3x SuperSpeed USB 5Gbps; 8x USB 2.0; 8x PCI-e x1 Gen3; PEGx8 Gen3 ■ Memory: Two DDR4 SO-DIMM slots supporting DDR4-3200 ECC and non-ECC memory (up to 64 GB) *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "ORION"

CPU module "ORION"

Enhanced AI performance and efficiency! CPU module capable of operating in low power state SOC.

The "ORION" we handle is a COM-HPC client module equipped with a 12th generation Intel Core processor. Using a PCI-e x4 port, it allows for the connection of M.2 NVMe drives on the carrier board. It features immersive graphics and enhanced AI performance and efficiency in a standard form factor. The SOC can operate in a low power state and is applicable in various fields, including visual computing, transportation, surveillance equipment, and robotics. 【Features】 ■ CPU: 12th generation Intel Core processor ■ Graphics: Intel Iris Xe architecture, up to 96 EUs, up to 4 independent displays ■ Memory: Two DDR5 SO-DIMM slots supporting DDR5-4800 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "TARVOS"

CPU module "TARVOS"

When high graphics and hyper-threading are important! Applicable in fields such as telecommunications.

We would like to introduce our CPU module 'TARVOS'. It is equipped with Intel's 6th and 7th generation Core/Xeon processors and supports up to three independent displays. The maximum number of cores is 4, making it suitable for various fields including biomedical/medical devices, HMI, gaming, and digital signage-infotainment. Please feel free to contact us if you have any inquiries. 【Features】 ■ CPU: Intel 6th and 7th generation Core/Xeon CPU ■ Graphics: Intel HD Graphics 530/P530/630/P630 ■ Connectivity: 4x USB 3.0; 8x USB 2.0; 8x PCI-e x1 Gen3; PEG x16 Gen3 ■ Memory: 2 x DDR4 So-DIMM slots *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "LEXELL"

CPU module "LEXELL"

Standard solution for multimedia applications! Supports two video outputs simultaneously.

"LEXELL" is a 2.1.1 module equipped with the NXP i.MX 8X application processor. It features an integrated graphics processing unit and supports two simultaneous video outputs. It can be used in an industrial temperature range. It is applicable in fields such as digital signage, infotainment, home automation, and multimedia devices. 【Specifications (excerpt)】 ■ CPU: NXP i.MX 8M application processor ■ Graphics: Integrated graphics processing unit, supports two simultaneous video outputs ■ Memory: Implemented LPDDR4-3200 memory, 32-bit interface, up to 4GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "MAURY"

CPU module "MAURY"

Graphics for low power consumption applications! Maximum FHD video output.

"MAURY" is a SMARC Rel.2.1.1 module equipped with Xilinx Zynq Ultrascale+ Intel Atom processor x7000E series, Intel Core i3 processor, and Intel processor N series. NXP i.MX 93 in SMARC module, designed for low power applications. It is applicable in various fields including automation, automotive, biomedical/medical devices, and industrial automation and control. 【Specifications (excerpt)】 ■CPU: NXP i.MX 933/935 processor ■Graphics: Up to FHD video output ■Memory: Implemented LPDDR4X / LPDDR4-3200 memory, total maximum of 2GB, 16-bit interface *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "RUSSELL"

CPU module "RUSSELL"

Flexible ARM + FPGA heterogeneous processing in a standard form factor! For avionics and more.

"RUSSELL" is a SMARC Rel.2.0 compliant module equipped with Xilinx Zynq Ultrascale+ MPSoC. It offers flexible ARM + FPGA heterogeneous processing in a standard form factor. The graphics are powered by an integrated ARM Mali-400 MP2 GPU. It is applicable in various fields, including automotive, avionics, biomedical/medical devices, and robotics. 【Specifications (excerpt)】 ■ CPU: Xilinx Zynq Ultrascale+ CG/EG/EV MPSoCs (C784 package) ■ Graphics: Integrated ARM Mali-400 MP2 GPU ■ Memory: Up to 8GB + 2GB DDR4 implemented *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "SWAN"

CPU module "SWAN"

Efficient performance capable of safety certification in SMARC standard modules! For automation and more.

"SWAN" is a SMARC Rel. 2.1.1 module equipped with the NXP i.MX 8X application processor. It offers efficient performance that is safety-certifiable according to the SMARC standard. The graphics feature an integrated GPU and support for two simultaneous video outputs. It is applicable in various fields, including automation, biomedical/medical devices, and edge computing. 【Specifications (excerpt)】 ■CPU: NXP i.MX 8X application processor ■Graphics: Integrated GPU, supports two simultaneous video outputs ■Memory: Up to 4GB of implemented LPDDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "SMARC" [LEC-ALN]

CPU module "SMARC" [LEC-ALN]

Intel Core i3 processor / Processor N series, equipped with 7th generation Atom x7000E processor SMARC.

The ADLINK LEC-ALN is a SMARC module compatible with Intel Core i3 processors (i3-N305, i3-N300) with up to 8 cores, Intel Processor N series (N97, N50), and Intel Atom x7000E processors (x7425E, x7213E, x7211E, formerly Alder Lake-N), integrating Intel UHD graphics and high-speed interfaces. The LEC-ALN module supports up to 16GB LPDDR5 memory and up to 256GB eMMC storage (build option), and it is also available with a robust operating temperature range and low power envelope, making it ideal for mission-critical fanless edge computing applications that require safety and reliability.

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Elkhart Lake Qseven【EmQ-i2801】

Elkhart Lake Qseven【EmQ-i2801】

Qseven CPU module with Intel Elkhart Lake SoC processor [EmQ-i2801]

- Qseven 2.1 CPU module, Intel Atom x6211E 1.30 GHz dual-core / Atom x6413E 1.50 GHz quad-core processor (Elkhart Lake) - LPDDR4 4GB/8GB onboard, optional eMMC, 2 x SATA 3.0 - Intel UHD graphics for 10th generation Intel processors - Dual-channel 24-bit LVDS, 1 x DDI port - Expansion: 4 x PCIex1 lanes, SDIO, I2C - IO: 1 x GbE, 6 x USB 2.0, 2 x USB 3.1, 1 UART port (RX/TX) - Supports Windows 10 and Linux Ubuntu - Wide operating temperature range -40 to 85°C

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SOM/CPUModule『i.MX 91 SODIMM』

SOM/CPUModule『i.MX 91 SODIMM』

This is a suitable module for vertical markets such as industry, healthcare, automotive, and avionics!

We would like to introduce the 'i.MX 91 SODIMM System on Module iW-RainboW-G50M' that we handle. This product is equipped with the i.MX 91 CPU, which adopts the 64-bit ARM v8.2-A architecture, and provides connectivity with Wi-Fi 6, Bluetooth 5.3, and IEEE802.15.4. Additionally, it features 2GB of LPDDR4 memory, 16GB of eMMC flash (expandable), a gigabit Ethernet PHY, and various interfaces (such as USB 2.0 OTG, SPI, I2C, UART, etc.), and supports an operating temperature range of -40°C to +85°C. 【Features (partial)】 ■ i.MX 91 CPU with 64-bit ARM v8.2-A Architecture ■ Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 connectivity ■ Supports 1 x Cortex-A55 cores *For more details, please download the PDF or feel free to contact us.

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