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CPU Module Product List and Ranking from 14 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. 富士ソフト Kanagawa//software インダストリービジネス事業部
  2. ADLINKジャパン Tokyo//Industrial Electrical Equipment 東京本社
  3. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  4. 4 エヌ・エム・アール Tokyo//IT/Telecommunications
  5. 4 SECO S.p.A Italy//Industrial Electrical Equipment
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CPU Module Product ranking

Last Updated： Aggregation Period:Aug 06, 2025～Sep 02, 2025
This ranking is based on the number of page views on our site.

  1. SoM/CPUboard『Arbor Technology EmQ-i2301』 富士ソフト インダストリービジネス事業部
  2. SOM/CPU board『manufactured by SECO μQ7-A76-J』 富士ソフト インダストリービジネス事業部
  3. SoM/CPU module『i.MX 91 SMARC』 富士ソフト インダストリービジネス事業部
  4. 4 SECO SMARC CPU Module LEVY (SM-D18) Suntex Co., Ltd.
  5. 4 CPU module "SMARC" ADLINKジャパン 東京本社

CPU Module Product List

46～60 item / All 94 items

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CPU module "LEVY"

CPU module "LEVY"

Low power design for embedded applications of machine learning at a higher level!

"LEVY" is a module compliant with SMARC Rel. 2.1, equipped with the NXP i.MX 8X application processor. It features a low-power design for embedded applications in machine learning at a higher level. It is applicable in various fields such as automation, edge computing, HMI, portable devices, and robotics. 【Specifications (excerpt)】 ■ CPU: NXP i.MX 8M Plus application processor ■ Graphics: Integrated GPU, supports three simultaneous video outputs ■ Memory: Up to 4GB of implemented LPDDR4-4000 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "WILK"

CPU module "WILK"

Equipped with MediaTek Genio 700 application processor! For information kiosks and more.

"WILK" is a SMARC Rel.2.1.1 module equipped with Xilinx Zynq Ultrascale+, Intel Atom x7000E series processors, Intel Core i3 processors, and Intel N series processors. It can be used in an industrial temperature range. The memory consists of implemented LPDDR4X-3733 memory, with a total maximum of 8GB. It is applicable in various fields, including digital signage, infotainment, biomedical/medical devices, and information kiosks. 【Specifications (excerpt)】 ■ CPU: MediaTek Genio 700 ■ Graphics: Mali G57 MC3 GPU ■ Memory: Implemented LPDDR4X-3733 memory, total maximum of 8GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU Module FA-M3V Series

CPU Module FA-M3V Series

Yokogawa Electric's new CPU module enhances PLC motion and reduces costs.

This is Yokogawa Electric's new CPU module. It offers a reasonable price and allows for the use of general-purpose PLCs and precise motion control.

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Portwell CPU Module PCOM-B638VG

Portwell CPU Module PCOM-B638VG

6th generation Core i7-6600U/i5-6300U/i3-6100U/3955U Skylake-U equipped CPU module

Features ■ Type 6 COM Express module ■ Equipped with 6th generation Core i7-6600U/i5-6300U/i3-6100U/3955U Skylake-U ■ DDR4-1866 Non-ECC SODIMM x 1 (up to 16GB) ■ Supports VGA, LVDS/eDP, 2x DDI (DP/HDMI/DVI) displays (carrier board) ■ PCI Express Gen3 compatible (carrier board)

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Portwell CPU Module PCOM-B634VG

Portwell CPU Module PCOM-B634VG

6th Generation Intel Xeon D (Broadwell-DE) processor equipped CPU module

Features ■ Type 6 COM Express module ■ Equipped with 6th generation Xeon D-1548/Xeon D-1539/Xeon D-1527 ■ DDR4-2133 ECC/Non-ECC SODIMM (up to 48GB) x3 ■ Supports VGA, HDMI, 10GbE LAN ■ PCI Express Gen3 compatible (1x PCIEx16, 8x PCIEx8)

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COM Express Type6 Express-KL/KLE

COM Express Type6 Express-KL/KLE

7th generation Core i7/i5/i3/Xeon CPU equipped, type 6 CPU module

Features ■ Equipped with 7th generation Intel Core i7/i5/i3/Xeon CPU. ■ Intel QM175 / HM175 / CM238 chipset (old codename: Kaby Lake) included. ■ Memory 2133/2400MHz DDR4 SO-DIMM x2 (up to 32GB) ■ Supports 3x DDI channels, 1x LVDS (eDP), and 3 independent display outputs. ■ 8x PCIe [x1] (Gen3), 1x PCIe [x16] (Gen3) ■ GbE, 4x SATA3 (6Gb/s), 4x USB3.0, 4x USB2.0 ■ Supports Smart Embedded Management Agent (SEMA) functionality. ■ Extended operating temperature: -40℃ to +85℃ (optional)

  • Embedded Board Computers
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SECO COM Express CPU Module JULIET

SECO COM Express CPU Module JULIET

type7 Xeon D-1700 (Ice Lake-D), 4xDDR4-2400/2666/2933 ECC maximum 128GB

Features ■ Intel Xeon D-1700 processors ■ 4x Superspeed USB 5Gbps; 16x PCI-e Gen4 lanes + 16x PCI-e Gen3 lanes ■ 4x 10GBASE-KR interfaces + 1x 1GbE port with NC-SI ■ Up to four DDR4 SO-DIMM Slots supporting DDR4-2933 memory with ECC, up to 128GB

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SECO CPU Module Trizeps VIII Plus

SECO CPU Module Trizeps VIII Plus

Trizeps SODIMM-200 CPU module (size 67.6x36.7mm), NXP i.MX 8M Plus

Features ■ Equipped with NXPi.MX8MPlus application processor ■ Supports 2x Gigabit Ethernet, 2x USB 3.0, 2x CAN-FD, PCIe, LVDS, 2x MIPI-CSI, WiFi/Bluetooth ■ Integrated GPU with multi-display support GC520L2D accelerator + GC7000UL3D accelerator ■ Onboard LPDDR4-4000 memory up to 8GB ■ Operating temperature 0 to 70°C (optional: -40°C to 85°C) ■ Dimensions: 67.6 x 36.7 x 6.4 mm ■ OS Win10 IoT/Debian/Yocto/Android

  • Embedded Board Computers
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  • Image Processing Board

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SECO SMARC CPU Module LEXELL

SECO SMARC CPU Module LEXELL

SM-C12, NXP i.MX 8M Family, ARM Cortex-A53, Size 50x82mm

Features ■ Equipped with NXP i.MX 8M Plus application processor ■ Supports WiFi + BT LE; CSI camera; QuadSPI interface; 14x GPI/Os ■ Integrated GPU that supports two independent displays ■ Onboard LPDDR4-4000 with a maximum of 6GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Yocto/Android

  • Embedded Board Computers
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SECO SMARC CPU Module SWAN (SM-D16)

SECO SMARC CPU Module SWAN (SM-D16)

NXP i.MX 8X Family, ARM Cortex-A35, size 50x82mm

Features ■ Equipped with NXP i.MX 8X Plus application processor ■ 2x Gigabit Ethernet; optional Wi-Fi + BT 5.0; CSI camera; 2x USB 3.0; 3x USB 2.0; 1x PCI-e x1; 2x CAN Bus; 4x UART; 14x GPIOs; supports QuadSPI interface ■ Integrated GPU supporting two independent displays ■ Onboard LPDDR4-2400 with up to 4GB memory ■ Operating temperature 0 to 60℃ (optional: -40℃ to 85℃) ■ Size: 50 x 82 mm (1.97” x 3.23”) ■ Compatible with OS Linux/Android

  • Embedded Board Computers
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SECO COM-HPC CPU Module CARINA

SECO COM-HPC CPU Module CARINA

11th Core i series (Tiger Lake-UP3), equipped with 2xDDR4-3200 ECC memory, maximum 64GB.

Features ■ Supports 11th generation Intel Core processors and Intel Celeron processors ■ 4x USB 4.0 / USB 3.2; 4x USB 2.0; 8x PCI-e x1 Gen3; 1x PCI-e x4 Gen4; supports up to 2x 2.5GbE ■ Intel Iris Xe Graphics Core Gen12 GPU with up to 96 EU, supports up to 4 independent displays ■ Equipped with 2x DDR5-4800 memory, maximum 64GB ■ Operating temperature 0 to 60℃ (optional: -40 to 85℃) ■ Dimensions: 120x95mm ■ OS: Win10 IoT/Linux/Yocto/VxWorks7.0/Android

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COM-HPC CPU Module COM-HPC-cRLS

COM-HPC CPU Module COM-HPC-cRLS

ADLINK, dimensions 160X120 mm, 13th generation Core i9/i7/i5/i3, 2xDDR5-3200 up to 128GB

【ADLINK COM-HPC-cRLS Features】 ■ Supports 13th generation Intel Core i9/i7/i5/i3 processors ■ Up to 24 cores, 32 threads (8 P-cores, 16 E-cores) ■ Up to 128GB DDR5 (up to 4800 MT/s) ■ Intel AVX-512 VNNI, Intel DL Boost ■ Intel UHD 770 Xe graphics ■ 16x PCIe Gen5, 8x PCIe Gen4 lanes, 14x PCIe Gen3 lanes ■ 2x 2.5GbE, Intel TCC, TSN capable ■ 4x USB 3.0/2.0/1.1, 8x USB 2.0 ■ 2x SATA, 2x UART, 12x GPIO

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CPU module "SMARC" [LEC-iMX6]

CPU module "SMARC" [LEC-iMX6]

NXP/i.MX6 equipped SMARC short-size module

The SMARC ("Smart Mobility ARChitecture") is a definition for a versatile small form factor computer-on-module targeting applications that require low power, cost-effectiveness, and high performance. It also caters to systems that need more compact solutions than PC-oriented form factors. ARM SoCs eliminate the need for chips designed for PC platforms and consume less power, significantly reducing the amount of board space required for power conversion devices and power lines. This enables the use of smaller form factors and promotes the adoption of SMARC-compliant modules in low-power mobile devices. The actual power consumption of SMARC CPU modules typically ranges from 2W to 6W, allowing for passive cooling and reducing the effort and overall costs for subsequent development. By using this standard, up to 9W of continuous power can be utilized for more demanding applications.

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CPU module "SMARC" [LEC-iMX6R2]

CPU module "SMARC" [LEC-iMX6R2]

NXP i.MX 6 Multicore Arm Cortex-A9 equipped SMARC short-size module

SMARC (Smart Mobility ARChitecture) is a multi-purpose small form factor computer module definition aimed at applications requiring low power, low cost, and high performance. The module typically uses the same or similar ARM SoCs found in many well-known devices such as tablet computers and smartphones. Alternative low-power SoCs and CPUs, such as tablet-oriented x86 devices and other RISC CPUs, can also be used. The power envelope of the module is usually less than 6W. The module serves as a building block for portable and stationary embedded systems. Core CPU and support circuitry, including DRAM, boot flash, power sequencing, CPU power, GBE, and single-channel LVDS display transmitters, are concentrated within the module. The module is used with application-specific carrier boards that implement other functionalities such as audio CODECs, touch controllers, and wireless devices.

  • Embedded Board Computers

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CPU module "SMARC" [LEC-IMX8MP]

CPU module "SMARC" [LEC-IMX8MP]

NXP i.MX 8MPlus equipped SMARC short-size module

The ADLINK LEC-IMX8MP is the first module compliant with SMARC revision 2.1, based on the powerful NXP i.MX8M Plus (quad-core Arm Cortex-A53) processor equipped with an optional neural processing unit (NPU) that operates at up to 2.3 TOPS, focusing on industrial IoT with machine learning and vision, advanced multimedia, and high reliability. Additionally, it supports dual image signal processors and two camera inputs, enabling an effective vision system. The LEC-IMX8MP is suitable for applications such as smart homes, buildings, cities, and Industry 4.0.

  • Embedded Board Computers

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