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CPU Module Product List and Ranking from 15 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

CPU Module Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. Suntex Co., Ltd. Shizuoka//Industrial Electrical Equipment
  2. ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
  3. SECO S.p.A Italy//Industrial Electrical Equipment
  4. 4 Toradex Japan株式会社 Tokyo//Industrial Electrical Equipment
  5. 5 三井電子 産業機器分野のサービスパートーナー Tokyo//Electronic Components and Semiconductors
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CPU Module Product ranking

Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.

  1. NXP i.MX95 OSM CPU module OSM-IMX95 Suntex Co., Ltd.
  2. MX93/91SOM module 三井電子 産業機器分野のサービスパートーナー
  3. CPU module "SMARC" ADLINKジャパン 東京本社
  4. "CPU Module" Verdin iMX8M Mini Toradex Japan株式会社
  5. 4 CPU module "SMARC"【LEC-ASL】 ADLINKジャパン 東京本社

CPU Module Product List

91～96 item / All 96 items

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CPU module "LEXELL"

CPU module "LEXELL"

Standard solution for multimedia applications! Supports two video outputs simultaneously.

"LEXELL" is a 2.1.1 module equipped with the NXP i.MX 8X application processor. It features an integrated graphics processing unit and supports two simultaneous video outputs. It can be used in an industrial temperature range. It is applicable in fields such as digital signage, infotainment, home automation, and multimedia devices. 【Specifications (excerpt)】 ■ CPU: NXP i.MX 8M application processor ■ Graphics: Integrated graphics processing unit, supports two simultaneous video outputs ■ Memory: Implemented LPDDR4-3200 memory, 32-bit interface, up to 4GB *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "MAURY"

CPU module "MAURY"

Graphics for low power consumption applications! Maximum FHD video output.

"MAURY" is a SMARC Rel.2.1.1 module equipped with Xilinx Zynq Ultrascale+ Intel Atom processor x7000E series, Intel Core i3 processor, and Intel processor N series. NXP i.MX 93 in SMARC module, designed for low power applications. It is applicable in various fields including automation, automotive, biomedical/medical devices, and industrial automation and control. 【Specifications (excerpt)】 ■CPU: NXP i.MX 933/935 processor ■Graphics: Up to FHD video output ■Memory: Implemented LPDDR4X / LPDDR4-3200 memory, total maximum of 2GB, 16-bit interface *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "RUSSELL"

CPU module "RUSSELL"

Flexible ARM + FPGA heterogeneous processing in a standard form factor! For avionics and more.

"RUSSELL" is a SMARC Rel.2.0 compliant module equipped with Xilinx Zynq Ultrascale+ MPSoC. It offers flexible ARM + FPGA heterogeneous processing in a standard form factor. The graphics are powered by an integrated ARM Mali-400 MP2 GPU. It is applicable in various fields, including automotive, avionics, biomedical/medical devices, and robotics. 【Specifications (excerpt)】 ■ CPU: Xilinx Zynq Ultrascale+ CG/EG/EV MPSoCs (C784 package) ■ Graphics: Integrated ARM Mali-400 MP2 GPU ■ Memory: Up to 8GB + 2GB DDR4 implemented *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "SWAN"

CPU module "SWAN"

Efficient performance capable of safety certification in SMARC standard modules! For automation and more.

"SWAN" is a SMARC Rel. 2.1.1 module equipped with the NXP i.MX 8X application processor. It offers efficient performance that is safety-certifiable according to the SMARC standard. The graphics feature an integrated GPU and support for two simultaneous video outputs. It is applicable in various fields, including automation, biomedical/medical devices, and edge computing. 【Specifications (excerpt)】 ■CPU: NXP i.MX 8X application processor ■Graphics: Integrated GPU, supports two simultaneous video outputs ■Memory: Up to 4GB of implemented LPDDR4-2400 memory *For more details, please refer to the PDF document or feel free to contact us.

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CPU module "SMARC" [LEC-ALN]

CPU module "SMARC" [LEC-ALN]

Intel Core i3 processor / Processor N series, equipped with 7th generation Atom x7000E processor SMARC.

The ADLINK LEC-ALN is a SMARC module compatible with Intel Core i3 processors (i3-N305, i3-N300) with up to 8 cores, Intel Processor N series (N97, N50), and Intel Atom x7000E processors (x7425E, x7213E, x7211E, formerly Alder Lake-N), integrating Intel UHD graphics and high-speed interfaces. The LEC-ALN module supports up to 16GB LPDDR5 memory and up to 256GB eMMC storage (build option), and it is also available with a robust operating temperature range and low power envelope, making it ideal for mission-critical fanless edge computing applications that require safety and reliability.

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SOM/CPUModule『i.MX 91 SODIMM』

SOM/CPUModule『i.MX 91 SODIMM』

This is a suitable module for vertical markets such as industry, healthcare, automotive, and avionics!

We would like to introduce the 'i.MX 91 SODIMM System on Module iW-RainboW-G50M' that we handle. This product is equipped with the i.MX 91 CPU, which adopts the 64-bit ARM v8.2-A architecture, and provides connectivity with Wi-Fi 6, Bluetooth 5.3, and IEEE802.15.4. Additionally, it features 2GB of LPDDR4 memory, 16GB of eMMC flash (expandable), a gigabit Ethernet PHY, and various interfaces (such as USB 2.0 OTG, SPI, I2C, UART, etc.), and supports an operating temperature range of -40°C to +85°C. 【Features (partial)】 ■ i.MX 91 CPU with 64-bit ARM v8.2-A Architecture ■ Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 connectivity ■ Supports 1 x Cortex-A55 cores *For more details, please download the PDF or feel free to contact us.

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