The 37th NePCON Japan 2023: First Exhibition of the H2T Circuit Board Divider Machine
We made our first exhibition of the turntable-type circuit board cutting machine MR2535H2T.
We will demonstrate and introduce high productivity through parallel setup during substrate processing. Additionally, we proposed a reduction in man-hours and costs through in-house production of jigs using the implementation substrate division system 'Jig-Designer.' In the February seminar, we will present the exhibition content from Internepcon Japan, which was held at Tokyo Big Sight from January 25 to 27. If you are interested, please join us via the "Web Seminar Registration."
- Company:名菱テクニカ 三菱電機グループ
- Price:Other