Magnesium carrier
Suitable for double-sided implementation and electrode printing! It allows for high-precision printing without any play in the components or circuit boards.
The "Magnesium Carrier" enables ultra-high precision machining through NC cutting and is suitable for high-density mounting. By pulling the substrate with a tension mechanism and fixing it to the carrier, it also has the effect of correcting warping. By installing a removal jig, the substrate pulling mechanism is pushed back, allowing for removal without applying stress to the substrate. (It can also be used during substrate installation.) 【Features】 ■ The bottom surface has no R or taper shape, preventing play in components and substrates. ■ Burrs and machining warping are minimized, allowing for high-precision printing. ■ With a heat absorption and dissipation characteristic 1.3 times that of aluminum, temperature management in the reflow oven is easy. ■ Compared to other metals, it minimizes warping and shape changes due to thermal cycling. ■ Excellent durability. *For more details, please refer to the PDF document or feel free to contact us.
- Company：トーヨーコーポレーション 東京営業部 東京営業3課
- Price：Other
