Chip component fixing adhesive Seal-glo
Seal-glo NE7200H・NE7300Ｈ・NE3000S・NE3300H・NE7250H・NE8800K/T
Numerous application results with 1005CR! 'Seal-glo Chip Adhesive'. Compatible with high-speed dispensers and fine coating regardless of printing!
The Seal-glo NE series adhesive for temporarily fixing chip components can cure in a short time of 90 seconds at 90°C, minimizing the burden on the components. We offer various grades that excel in high-speed dispensing and fine printing to meet your needs. ■ Features - No issues with applying 1005CR bond (dispensing/printing) - Proven application of 0603CR bond (dispensing) - Confirmed ability to dispense with a nozzle inner diameter of Φ0.075mm - Achieves low-temperature curing at 90°C/90 seconds - Stable application shape with moderate peak height due to thixotropy - High adhesive strength, excellent storage stability, and moisture resistance - Extensive export experience both domestically and internationally - Resin mask contracting is also possible ■ Curing Conditions ○ Recommended curing conditions vary by series. Since curing temperatures differ depending on dispensing or printing, please contact us for details. ○ Depending on the size and arrangement of the components mounted on the substrate, the actual temperature applied to the adhesive may vary, so please seek the optimal curing conditions. For more details, please download the PDF or contact us.
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basic information
The Seal-glo NE series is an adhesive developed for temporary fixing of chip components used in surface mounting (SMT) and is a one-component, heat-curing epoxy adhesive with excellent storage stability. (It also complies with the RoHS directive.) Packaging forms: Cartridge type (200g) Syringe type (various) Please inquire about the syringe type. If you provide the name of the dispenser manufacturer, we will supply the optimal syringe. Additionally, if you inquire about overseas supply, we can introduce you to a local distributor.
Price information
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Delivery Time
P3
Applications/Examples of results
Achievements: Various electrical manufacturers and EMS companies (domestic and overseas)
Line up（3）
| Model number | overview |
|---|---|
| NE7200H・NE7300H | High-speed dispenser compatible grade Metal screen and plastic plate printing are also possible Base grade: NE7200H Low-temperature curing type: NE7300H |
| NE3000S・NE3300H | Grade dedicated for printing machine application (can be applied with solder printing machines) Metal screen and plastic printing plate |
| NE8800K/ 8800T | Dedicated item number for dispensers Basic type: 8800K Item number compatible with high temperature and high humidity regions: 8800T |
catalog（3）
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Company information
Fujikagaku Industry aims to contribute to society through engineering services in the field of substrate mounting, utilizing fine chemical technologies related to adhesives, coatings, potting, and printing, as well as resin processing technologies centered on precision extrusion molding of engineering plastics as key technologies. Our company is characterized by comprehensive knowledge of peripheral chemicals such as adhesives and surface treatments, knowledge and sales performance of materials necessary for substrate mounting, and a sales structure specialized in the electrical, mechanical, and automotive electrical industries, enabling us to provide well-informed responses and proposals. We also have catalogs and product introductions available on our website, so please take a look. Additionally, we are flexible in responding to requests for products not listed on our website, so feel free to contact us with your needs.
