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Conductive adhesive - メーカー・企業23社の製品一覧とランキング | イプロスものづくり

更新日： 集計期間:Jan 14, 2026～Feb 10, 2026
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Conductive adhesiveのメーカー・企業ランキング

更新日： 集計期間:Jan 14, 2026～Feb 10, 2026
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  1. ニホンハンダ Tokyo//Electronic Components and Semiconductors
  2. 新明和工業 Kanagawa//Automobiles and Transportation Equipment
  3. MUROMACHI CHEMICALS INC. Chemicals Division Fukuoka//Chemical
  4. 4 オーデック Tokyo//Chemical
  5. 5 理経 Tokyo//IT/Telecommunications
企業ランキングへ

Conductive adhesiveの製品ランキング

更新日： 集計期間:Jan 14, 2026～Feb 10, 2026
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  1. Conductive Adhesive "ECA Series" ニホンハンダ
  2. Low-temperature curing conductive adhesive "Muromac Bond H-220" MUROMACHI CHEMICALS INC. Chemicals Division
  3. Conductive Heat-Resistant Adhesive | Piroduct 597-A オーデック
  4. 4 Flexible conductive adhesive "EPO-TEK" 理経
  5. 5 For those struggling with solder connections! A one-component conductive adhesive that can cure at low temperatures.

Conductive adhesiveの製品一覧

1～30 件を表示 ／ 全 38 件

表示件数
Conductive Adhesive "ECA Series"

Conductive Adhesive "ECA Series"

Epoxy-based silver paste and nickel paste that cure with low-temperature heating.

The ECA series is a one-component paste-type conductive adhesive. It offers three types, mixed with metal particles "silver," "nickel," and "sintered silver" in epoxy resin. It is suitable for a wide range of fields, including high-reliability devices such as automotive and industrial equipment, consumer electronics, mobile electronic devices, and semiconductor and optical packages. For product inquiries, please visit our website. http://www.nihonhanda.com For more details about the products, please refer to the information below.

  • glue
  • Conductive adhesive

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Conductive Heat-Resistant Adhesive | Piroduct 597-A

Conductive Heat-Resistant Adhesive | Piroduct 597-A

Heat-resistant up to 927°C! Ideal for bonding electronic components and high vacuum parts! A heat-resistant adhesive with excellent conductivity.

"Pyroduct 597-A" is a heat-resistant adhesive enhanced with silver particles for improved conductivity. It is ideal for bonding electronic components and high vacuum parts where stability and adhesion are required! With silver as a filler, it has a resistivity of 0.0002 Ω·cm. Using an inorganic binder, it excels in weather resistance and heat resistance compared to organic adhesives. Additionally, it does not emit outgassing after firing, making it usable in a vacuum. It is a water-based, one-component silver paste. If you need to reduce viscosity, please use the dedicated thinner 597-A-T. [Capacity: 25g, 50g] *For detailed specifications, please refer to the catalog or feel free to contact us.

  • glue
  • Chemicals
  • Conductive adhesive

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Conductive adhesive (silver paste) TK PASTE series

Conductive adhesive (silver paste) TK PASTE series

Our company is developing unique silver pastes (conductive adhesives) by continuously creating various special shapes of "TK silver powder" using our proprietary technology.

TK PASTE is a silver paste/conductive adhesive with the following features: 1. Uses TK silver powder with controllable silver shape and particle size. 2. Achieves various functions such as low resistance, low silver content, and high reliability. 3. Exhibits good continuous dispensing performance with dispensers.

  • glue
  • Other metal materials
  • Other laboratory equipment and containers
  • Conductive adhesive

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Comprehensive Catalog: Soldering-related Products

Comprehensive Catalog: Soldering-related Products

A wide range of soldering-related products handled by our company.

This catalog is a comprehensive catalog introducing soldering-related products handled by Taiyo Electric Industry Co., Ltd., a comprehensive manufacturer of soldering irons. It includes various products, such as soldering systems that reflect the needs of the field, lead-free compatible soldering irons with temperature control functions, and automatic solder feeding devices with V-groove processing functions. [Contents] ■ Soldering systems ■ Station-type soldering iron with lead-free compatibility and temperature control function ■ Station-type soldering iron with temperature control function ■ Replacement tips and custom tips for RX/PX series ■ High-performance ceramic heater soldering iron with fixed/adjustable temperature function, etc. *For more details, please download the PDF or feel free to contact us.

  • Soldering Equipment
  • Solder
  • Other work tools
  • Conductive adhesive

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Automatic Wire Processing Machine New Model Dual-End Terminal Crimping Machine TR500

Automatic Wire Processing Machine New Model Dual-End Terminal Crimping Machine TR500

Maximum processing capacity of 6,000 units per hour. Utilizing high technical skills, equipped with various functions.

The TR500 has achieved a maximum processing capacity of 6,000 pieces per hour in a single processing method that allows for the installation of genuine applicators from various manufacturers. With a newly developed platform, the transport unit features a "swivel + Y-axis" mechanism. The latest control devices and servo motors enable both high speed and high precision, significantly improving processing capabilities. The "length measurement unit" incorporates a newly designed belt feed mechanism, allowing for high-speed feeding of delicate wires. Additionally, feedback correction control using encoders enhances the accuracy and stability of cutting lengths. By reducing the number of points where wires pass through by half, we have shortened wire replacement and setup times, thereby increasing productivity, achieving speed and high durability, and making maintenance easy with excellent operability. For more details, please contact us or refer to the catalog.

  • Other processing machines
  • Conductive adhesive

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Automatic Wire Processing Machine Dual-End Terminal Crimping Machine TRD701 Series

Automatic Wire Processing Machine Dual-End Terminal Crimping Machine TRD701 Series

We have added a new sealing machine to our lineup to respond to small lot production and the fine wiring of electric wires.

The automotive industry continues to evolve and expand daily, with the increasing electronicization of vehicles leading to a greater role for harnesses. A significant challenge is the downsizing of wires through the use of finer wires. Additionally, small-lot production of harnesses in response to recent automotive manufacturers' production plans has become a global trend. The solution to this challenge is the TRD701 series of terminal crimping machines from ShinMaywa. We have also added a sealing machine equipped with a three-unit automatic exchange seal unit to our lineup, garnering support from users worldwide. For more details, please contact us or refer to our catalog.

  • Other processing machines
  • Conductive adhesive

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Interconnection Conductive Adhesive Silver Epoxy

Interconnection Conductive Adhesive Silver Epoxy

Adhesives for interconnection of various sizes and types of die attach and modules.

We provide conductive adhesives for die bonding of small to large IC chips and for module interconnection. We have prepared a lineup for improved workability and different application methods. Our NIC BOND is used for all sizes of IC bonding and module interconnection. For LED chips, for X-ray image ICs, for RFID, for IC card modules. Use methods: metal mask printing, dispensing, stamping. Direct contact information for Nichimori HP: If you need to contact directly, please copy and paste to your Google: https://www.daizo.co.jp/nichimoly/contact_form.html

  • 導電性シリンジ.jpg
  • Chip type LED
  • Dedicated IC
  • IC tag
  • Conductive adhesive

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Conductive adhesive [Part number: 81327/81328]

Conductive adhesive [Part number: 81327/81328]

It can be used not only for rubber tiles and floor sheets but also for the installation of carpet tiles and vinyl tiles.

"Conductive Adhesive" is a high-quality acrylic emulsion mixed with patented Thunderon Matrix technology conductive adhesive to create a flexible electrical grounding surface under static electricity management floor tiles. It can be used not only for rubber tiles and floor sheets but also for the installation of carpet tiles and vinyl tiles. 【Features】 ■ High-quality acrylic emulsion mixed with conductive adhesive ■ Usable for the installation of carpet tiles and vinyl tiles ■ Non-toxic, non-flammable, and water-resistant ■ Covers 4.5m² to 6m² per liter *For more details, please refer to the related link page or feel free to contact us.

  • others
  • Conductive adhesive

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Laser soldering compatible products [Local rapid heating and scattering suppression]

Laser soldering compatible products [Local rapid heating and scattering suppression]

No flux burn! Products compatible with non-contact laser soldering for rapid heating and splash prevention.

The "FLF01-BM(D)" is a laser method that excels in local rapid heating, efficiently releasing outgas even during short-term temperature rises, and achieving excellent finishing for laser soldering applications. There is no occurrence of flux or solder ball scattering, which is a concern due to rapid heating and expansion. Under various conditions, the wetting force of the flux after laser irradiation is good, allowing the flux to spread in a perfect circular shape. 【Features】 ■ Suitable for non-contact soldering with lasers ■ No occurrence of flux or solder ball scattering ■ Flux spreads in a perfect circular shape ■ No residue burning *For more details, please refer to the PDF document or feel free to contact us.

  • Other consumables
  • Conductive adhesive

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【New Product!】Solder Behavior Analysis Device 'Rheology Analyzer'

【New Product!】Solder Behavior Analysis Device 'Rheology Analyzer'

【*Demo units available for loan!】Analyzing the behavior of solder on the wall surface of the mask opening! This is an analytical device that achieves a higher level of printing.

The "Rheology Analyzer" is a device that can measure the resistance of cream solder against a surface. 【Features】 ■ Simulates the solder flow at the actual mask opening ■ Confirms the separation phenomenon of solder and flux ■ Capable of measuring fine powder (Type VI) ■ Easy operation and measurement ■ Measurement time of about 5 minutes per test, usage amount 20cc *For more details, please download the PDF or feel free to contact us.

  • Assembly Machine
  • Printing Machinery
  • Other inspection equipment and devices
  • Conductive adhesive

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Conductive Adhesive "AG Series"

Conductive Adhesive "AG Series"

It excels in adhesion from various metal and plated surfaces to plastic surfaces!

The "AG Series" is a conductive adhesive with low electrical resistance and excellent thermal conductivity. By optimizing the shape of the silver filler, it achieves a low resistance of less than 10^-5 Ωcm and a high thermal conductivity of 60 W/Km. Additionally, it excels in adhesion from various metal surfaces (gold, silver, aluminum, copper) to plastic surfaces, and allows for selection suitable for applications such as low-temperature curing (80°C). 【Features】 ■ Low electrical resistance and excellent thermal conductivity ■ Selection of resins with high adhesion strength available within the series ■ Excellent adhesion from various metal surfaces (gold, silver, aluminum, copper) to plastic surfaces ■ Selection suitable for applications such as low-temperature curing (80°C) *For more details, please refer to the PDF document or feel free to contact us.

  • glue
  • Other consumables
  • Conductive adhesive

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Copper/Nickel filler conductive adhesive

Copper/Nickel filler conductive adhesive

Silver migration and galvanic corrosion prevention for bonding aluminum and copper electrodes.

Conductive adhesive that does not use conventional silver fillers For high-temperature and high-humidity applications concerned about silver migration For conductive adhesion to aluminum where galvanic corrosion is a concern For electrode adhesion of FPC (Flexible Printed Circuit)

  • ELECTRICALLY-CONDUCTIVE-H20E-500x500.jpg
  • glue
  • Other polymer materials
  • Conductive adhesive

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Half-edge soldering half-edge terminal punching machine 'THR202C'

Half-edge soldering half-edge terminal punching machine 'THR202C'

Maximum processing capacity of 3,000 pieces per hour! Soldering processing capability has been accelerated, increasing by 25% compared to our conventional machines!

Our company's end-fed soldering terminal machine 'THR202C' is equipped with a newly developed soldering unit, allowing for wire approaches to nearly vertical solder layers, which has improved the quality of soldering finishes. The soldering operation is servo-controlled, achieving stable insertion into the solder bath. Additionally, the rotary twisting mechanism has enhanced the quality of twisting processing, enabling the creation of various twisting conditions. 【Features】 ■ Improved soldering capability ■ Equipped with newly developed twisting and soldering unit ■ Enhanced soldering quality ■ Improved twisting quality *For more details, please download the PDF or feel free to contact us.

  • Soldering Equipment
  • Solder
  • Conductive adhesive

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Sn99.997 "PGT Tin (Pure Genuine Tin)"

Sn99.997 "PGT Tin (Pure Genuine Tin)"

Tin purity 99.997% UP! The highest purity tin available on the market.

"Sasaki Tin" is the highest quality tin with harmful lead (Pb) reduced to the absolute minimum. The purity is over 99.997%, and it is available for sale starting from 1kg. It is suitable for use in tableware (such as sake cups and spoons). 【Features】 ■ Lead (element symbol Pb) is 10ppm (0.001% or less) ■ Available for sale starting from 1kg *For more details, please download the PDF or feel free to contact us.

  • Other metal materials
  • Conductive adhesive

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Non-volatile, room temperature curing two-component epoxy-based conductive adhesive 'XJS-3066'

Non-volatile, room temperature curing two-component epoxy-based conductive adhesive 'XJS-3066'

It is a non-volatile type of epoxy-based conductive adhesive that can cure at room temperature.

○ Can be used for conductive bonding to heat-sensitive components and film substrates. ○ It is an epoxy type with good adhesion. ○ It is a non-hazardous material, making it easy to manage. *For more details, please download the PDF or feel free to contact us.*

  • glue
  • Conductive adhesive

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Conductive Adhesive - One-Hand MixingⓇ

Conductive Adhesive - One-Hand MixingⓇ

Pro-quality conductive repair, completed with one hand.

■ Easy electrical bonding without soldering Enables secure electrical connections without the need for soldering, making it suitable for users who are not skilled with soldering tools or for environments where heat cannot be applied. ■ Safe for heat-sensitive components and flexible substrates Cures at room temperature, preventing thermal damage to LEDs, plastic parts, FPCs, and other heat-sensitive devices. ■ Strong adhesion with stable, low-resistance conductivity Optimized silver filler formulation provides both excellent conductivity and high adhesive strength, ensuring long-term reliability even under vibration or mechanical stress. ■ Flexible after curing—ideal for bent or vibrating areas Maintains flexibility after curing, enabling use on curved surfaces, moving parts, or areas subject to repeated bending. ■ Suitable for creating or repairing circuit patterns Can be applied to form or repair conductive traces, making it useful for prototyping, R&D, and precision repair work. ■ Automatic mixing with a dedicated nozzle—simple one-handed operation A single push dispenses and mixes both components automatically, eliminating manual ratio control and improving work efficiency. ■ No special storage requirements Can be stored at room temperature—no refrigeration or freezing required—making it convenient for on-site use.

  • Repair Agent
  • Solder
  • glue
  • Conductive adhesive

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Psycholon B (Conductron)

Psycholon B (Conductron)

High conductivity room temperature instant adhesive for discharge machining

It is the first room temperature curing adhesive that functions as a conductive adhesive.

  • glue
  • Conductive adhesive

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New type of double-end terminal crimping machine

New type of double-end terminal crimping machine

New type of double-end terminal crimping machine

— Thoughts for Our Valued Customers — To ensure the satisfaction of each and every one of our valued customers. Please feel free to contact us. Shinmaywa Industries, Ltd. Industrial Machinery Systems Division, Sales Headquarters, Mechatronics Sales Department 3-2-43 Shirate, Tsurumi-ku, Yokohama 230-0003 TEL 045-575-5441 FAX 575-2286 http://www.shinmaywa.co.jp/awp/index.htm

  • Other processing machines
  • Conductive adhesive

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Automatic Wire Processing Machine Terminal Crimping Machine TRD301/302 Series

Automatic Wire Processing Machine Terminal Crimping Machine TRD301/302 Series

Thorough refinement of high-speed control technology and design of a rigid drive mechanism.

The TRD301/302 series has been completed as an excellent machine with high processing capability and stable machining accuracy, thanks to a complete overhaul of ShinMaywa's unique direct drive system, thorough enhancement of high-speed control technology, and a highly rigid drive mechanism design. In terms of operation, we have developed an operating system with PC control, significantly improving usability with a very user-friendly graphical PC interface. Additionally, all models come standard with a digital crimping feature, and our unique link mechanism is mounted on a highly rigid body, enhancing the reproducibility of crimp height and enabling quick setup changes. The TRD301/302 series, equipped with various unique ShinMaywa technologies, promises a significant improvement in productivity. For more details, please contact us or refer to the catalog.

  • Other processing machines
  • Conductive adhesive

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端子打機『TR201C/TR202Cシリーズ』

端子打機『TR201C/TR202Cシリーズ』

独自技術で極細線から中太線加工を可能にする端子打機！省エネなど環境にも配慮

『TR201C/TR202Cシリーズ』は、極細線から中太線加工を可能にする 端子打機です。 位置決めXYテーブルユニット、カッタユニットに高精度なリニアガイドと ボールねじを搭載。独自の制御技術により、ストリップ加工や圧着加工を ハイクオリティで実現します。 少ないエア消費量やエコ電線にも対応するなど 環境にも配慮した製品です。 【特長】 ■高精度な駆動系 ■垂直沈み込み圧着方式 ■デジタル調整式引き上げタイミング制御 ■非接触式光電センサ ■ストリップセンサ ※詳しくはカタログをご覧下さい。お問い合わせもお気軽にどうぞ。

  • Other processing machines
  • Conductive adhesive

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Conductive adhesive (thermosetting conductive adhesive)

Conductive adhesive (thermosetting conductive adhesive)

High electrical conductivity and excellent thermal conductivity.

Bear Chip is a one-component thermosetting silver-filled epoxy resin developed for implementation and surface mounting. Compatible substrates include LTCC, ceramic substrates, lead frames, polyester films, polyamide films, and PC boards.

  • glue
  • Conductive adhesive

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Conductive Adhesive TCB Series

Conductive Adhesive TCB Series

Solder alternative for aluminum components! High adhesion and low resistance! Conductive adhesive TCB series.

This is our unique conductive adhesive that uses silver-plated silica filler. [Features] 〇 Good conductivity… It adheres well to various materials and exhibits excellent conductivity. 〇 Excellent migration resistance… By reducing the amount of silver, the risk of migration is minimized. 〇 Lightweight and inexpensive… By using inorganic materials for the core, it is a lightweight material with about one-third the specific gravity compared to silver.

  • Non-ferrous metals
  • Conductive adhesive

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Anisotropic conductive adhesive "Smurf"

Anisotropic conductive adhesive "Smurf"

Curing is possible in as little as 1 to 2 seconds! We have achieved high reliability by using our metal coating powder.

"Smurf" is a one-component heat-curing epoxy adhesive for RFID inlays. By using our metal-coated powder, high reliability is achieved. Curing can be completed in as little as 1 to 2 seconds. Additionally, viscosity can be adjusted depending on the application method, such as jetting or dispensing. Furthermore, by employing special conductive particles, high reliability is maintained even in high-temperature and high-humidity tests and thermal cycling tests. 【Features】 - For RFID inlays - One-component heat-curing - Viscosity adjustment possible through application methods such as jetting and dispensing - One-component thermosetting epoxy adhesive with no volatile components, making it easy to handle - Excellent adhesion to various materials such as Al, Cu, Ag, PET, and PI *For more details, please refer to the PDF document or feel free to contact us.

  • glue
  • Conductive adhesive

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[Equipment Introduction] Lead Cut 'SAC-R708'

[Equipment Introduction] Lead Cut 'SAC-R708'

Achieve safe and low-burden lead cuts!

The "SAC-R708" is a device manufactured by Sanwa Electronics that allows for safe and minimal burr lead cutting with an automatic substrate feeding mechanism. The structure prevents lead cutting debris from bouncing up and landing on the substrate. 【Features】 ■ Cutter blade used: 200φ ■ Substrate width: 180mm or less *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines
  • Conductive adhesive

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Flexible conductive adhesive "EPO-TEK"

Flexible conductive adhesive "EPO-TEK"

Flexibility like rubber even after hardening. It does not stress the substrate and allows for bonding over large areas.

"EPO-TEK" is a conductive epoxy adhesive that maintains rubber-like flexibility even after curing. It is suitable for use when you want to absorb the differences in thermal expansion between substrates or when you need adhesive strength after temperature cycling. Even in large-area bonding, where curing shrinkage tends to be significant, it does not put stress on the substrates. It can also be used as an adhesive (TIM) for heat sinks, offering high thermal conductivity and flexibility. Additionally, we offer flexible anisotropic conductive adhesives, as well as conductive inks based on stretchable urethane and silicone. **Features of Stretchable Conductive Ink:** - Screen printable - Can be spray applied using a diluent - Heat resistance from -70°C to +260°C - High adhesion to polyimide, PTFE, and rubber - Proven as wiring patterns for wearable/washable sensors *For more details, please refer to the PDF document or feel free to contact us.* *This PDF document is available in English.*

  • glue
  • Conductive adhesive

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Yunimec "Surface Mount Adhesive"

Yunimec "Surface Mount Adhesive"

Introduction of the registered trademark "Unimec" heat-curing conductive materials.

"Surface mount adhesive" is a thermosetting conductive adhesive that can undergo low-temperature processing compatible with lead-free mounting and has high-temperature solder reflow resistance. Our trademark "Unimec" is a conductive material that can be processed at low temperatures, consisting of a thermosetting resin primarily based on epoxy resin, with specially treated in-house processed conductive powder uniformly dispersed. The development and blending of conductive powders enable the production of products with various characteristics. [Features] ■ Low-temperature processing possible ■ Thermosetting conductive material ■ Compatible with lead-free mounting ■ High-temperature solder reflow resistance *For more details, please refer to the PDF document or feel free to contact us.

  • Other terminal blocks
  • Other polymer materials
  • Other electronic parts
  • Conductive adhesive

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Low-temperature curing low-elasticity conductive adhesive

Low-temperature curing low-elasticity conductive adhesive

70℃ curing possible - good conductivity!

Development is underway for flexible/stretchable substrates for wearable devices. It accommodates substrates that do not have heat resistance for that purpose. 【Product/Device Features】 - Compatible with dispense coating - Can cure at 70°C! - Good conductivity - Supports component mounting on stretchable/flexible substrates ~ Achieves an elastic modulus of 0.6 GPa (25°C/DMA) with a thermosetting type ~ - High reliability ~ Connectivity stability after 1000 temperature cycles ~

  • Composite Materials
  • glue
  • Other electronic parts
  • Conductive adhesive

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Development of conductive adhesives, selection of metal nanoparticles and fillers, testing methods, and standards.

Development of conductive adhesives, selection of metal nanoparticles and fillers, testing methods, and standards.

Thick film circuits printed with conductive ink! Methods for selecting metal particles used as fillers and surface treatment techniques!

Speaker Part 1: Dr. Takeshi Suga, Engineering PhD, Technical Department, Fujikura Kasei Co., Ltd. Electronic Materials Division Part 2: Masayoshi Yoshitake, Technical Engineer (Metal Division), Research and Development Department, Fukuda Metal Foil Powder Industry Co., Ltd. Part 3: Hiroshi Otsuka, Emeritus Professor, Meisei University Target Audience: Researchers and personnel interested in conductive adhesives, metal nanoparticle fillers, and trends in testing standards. Venue: Kawasaki City Industrial Promotion Hall, Conference Room 1 Date and Time: June 20, 2011 (Monday) 11:00 AM - 4:00 PM Capacity: 30 people. *Please apply early as there may be a rush of applications. Participation Fee: 57,750 yen (tax included, lunch included, including text costs) for up to 2 people from one company. *Tech-Zone members who apply by June 6 will receive an early bird discount price of 52,500 yen (for up to 2 people from one company). ◆ When applying for the early bird discount, please select "1 person (early discount)" or "2 people (early discount)" in the number registration. ◆ Point discounts are not applicable to the early bird discount price. Point discount services can only be applied when applying at the regular price. ◆ For additional applications from the same organization, an additional fee of 23,100 yen per person will be charged.

  • 企業：AndTech
  • 価格：10,000 yen-100,000 yen
  • Technical Seminar
  • Conductive adhesive

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