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It is a non-volatile type of epoxy-based conductive adhesive that can cure at room temperature.
○ Can be used for conductive bonding to heat-sensitive components and film substrates. ○ It is an epoxy type with good adhesion. ○ It is a non-hazardous material, making it easy to manage. *For more details, please download the PDF or feel free to contact us.*
Pro-quality conductive repair, completed with one hand.
■ Easy electrical bonding without soldering Enables secure electrical connections without the need for soldering, making it suitable for users who are not skilled with soldering tools or for environments where heat cannot be applied. ■ Safe for heat-sensitive components and flexible substrates Cures at room temperature, preventing thermal damage to LEDs, plastic parts, FPCs, and other heat-sensitive devices. ■ Strong adhesion with stable, low-resistance conductivity Optimized silver filler formulation provides both excellent conductivity and high adhesive strength, ensuring long-term reliability even under vibration or mechanical stress. ■ Flexible after curing—ideal for bent or vibrating areas Maintains flexibility after curing, enabling use on curved surfaces, moving parts, or areas subject to repeated bending. ■ Suitable for creating or repairing circuit patterns Can be applied to form or repair conductive traces, making it useful for prototyping, R&D, and precision repair work. ■ Automatic mixing with a dedicated nozzle—simple one-handed operation A single push dispenses and mixes both components automatically, eliminating manual ratio control and improving work efficiency. ■ No special storage requirements Can be stored at room temperature—no refrigeration or freezing required—making it convenient for on-site use.
High conductivity room temperature instant adhesive for discharge machining
It is the first room temperature curing adhesive that functions as a conductive adhesive.
New type of double-end terminal crimping machine
— Thoughts for Our Valued Customers — To ensure the satisfaction of each and every one of our valued customers. Please feel free to contact us. Shinmaywa Industries, Ltd. Industrial Machinery Systems Division, Sales Headquarters, Mechatronics Sales Department 3-2-43 Shirate, Tsurumi-ku, Yokohama 230-0003 TEL 045-575-5441 FAX 575-2286 http://www.shinmaywa.co.jp/awp/index.htm
Thorough refinement of high-speed control technology and design of a rigid drive mechanism.
The TRD301/302 series has been completed as an excellent machine with high processing capability and stable machining accuracy, thanks to a complete overhaul of ShinMaywa's unique direct drive system, thorough enhancement of high-speed control technology, and a highly rigid drive mechanism design. In terms of operation, we have developed an operating system with PC control, significantly improving usability with a very user-friendly graphical PC interface. Additionally, all models come standard with a digital crimping feature, and our unique link mechanism is mounted on a highly rigid body, enhancing the reproducibility of crimp height and enabling quick setup changes. The TRD301/302 series, equipped with various unique ShinMaywa technologies, promises a significant improvement in productivity. For more details, please contact us or refer to the catalog.
独自技術で極細線から中太線加工を可能にする端子打機！省エネなど環境にも配慮
『TR201C/TR202Cシリーズ』は、極細線から中太線加工を可能にする 端子打機です。 位置決めXYテーブルユニット、カッタユニットに高精度なリニアガイドと ボールねじを搭載。独自の制御技術により、ストリップ加工や圧着加工を ハイクオリティで実現します。 少ないエア消費量やエコ電線にも対応するなど 環境にも配慮した製品です。 【特長】 ■高精度な駆動系 ■垂直沈み込み圧着方式 ■デジタル調整式引き上げタイミング制御 ■非接触式光電センサ ■ストリップセンサ ※詳しくはカタログをご覧下さい。お問い合わせもお気軽にどうぞ。
High electrical conductivity and excellent thermal conductivity.
Bear Chip is a one-component thermosetting silver-filled epoxy resin developed for implementation and surface mounting. Compatible substrates include LTCC, ceramic substrates, lead frames, polyester films, polyamide films, and PC boards.
Solder alternative for aluminum components! High adhesion and low resistance! Conductive adhesive TCB series.
This is our unique conductive adhesive that uses silver-plated silica filler. [Features] 〇 Good conductivity… It adheres well to various materials and exhibits excellent conductivity. 〇 Excellent migration resistance… By reducing the amount of silver, the risk of migration is minimized. 〇 Lightweight and inexpensive… By using inorganic materials for the core, it is a lightweight material with about one-third the specific gravity compared to silver.
Curing is possible in as little as 1 to 2 seconds! We have achieved high reliability by using our metal coating powder.
"Smurf" is a one-component heat-curing epoxy adhesive for RFID inlays. By using our metal-coated powder, high reliability is achieved. Curing can be completed in as little as 1 to 2 seconds. Additionally, viscosity can be adjusted depending on the application method, such as jetting or dispensing. Furthermore, by employing special conductive particles, high reliability is maintained even in high-temperature and high-humidity tests and thermal cycling tests. 【Features】 - For RFID inlays - One-component heat-curing - Viscosity adjustment possible through application methods such as jetting and dispensing - One-component thermosetting epoxy adhesive with no volatile components, making it easy to handle - Excellent adhesion to various materials such as Al, Cu, Ag, PET, and PI *For more details, please refer to the PDF document or feel free to contact us.
![[Equipment Introduction] Lead Cut 'SAC-R708'](https://image.mono.ipros.com/public/product/image/e70/2000322375/IPROS9152230919802557452.jpg?w=280&h=280)
Achieve safe and low-burden lead cuts!
The "SAC-R708" is a device manufactured by Sanwa Electronics that allows for safe and minimal burr lead cutting with an automatic substrate feeding mechanism. The structure prevents lead cutting debris from bouncing up and landing on the substrate. 【Features】 ■ Cutter blade used: 200φ ■ Substrate width: 180mm or less *For more details, please refer to the PDF document or feel free to contact us.
Flexibility like rubber even after hardening. It does not stress the substrate and allows for bonding over large areas.
"EPO-TEK" is a conductive epoxy adhesive that maintains rubber-like flexibility even after curing. It is suitable for use when you want to absorb the differences in thermal expansion between substrates or when you need adhesive strength after temperature cycling. Even in large-area bonding, where curing shrinkage tends to be significant, it does not put stress on the substrates. It can also be used as an adhesive (TIM) for heat sinks, offering high thermal conductivity and flexibility. Additionally, we offer flexible anisotropic conductive adhesives, as well as conductive inks based on stretchable urethane and silicone. **Features of Stretchable Conductive Ink:** - Screen printable - Can be spray applied using a diluent - Heat resistance from -70°C to +260°C - High adhesion to polyimide, PTFE, and rubber - Proven as wiring patterns for wearable/washable sensors *For more details, please refer to the PDF document or feel free to contact us.* *This PDF document is available in English.*
Introduction of the registered trademark "Unimec" heat-curing conductive materials.
"Surface mount adhesive" is a thermosetting conductive adhesive that can undergo low-temperature processing compatible with lead-free mounting and has high-temperature solder reflow resistance. Our trademark "Unimec" is a conductive material that can be processed at low temperatures, consisting of a thermosetting resin primarily based on epoxy resin, with specially treated in-house processed conductive powder uniformly dispersed. The development and blending of conductive powders enable the production of products with various characteristics. [Features] ■ Low-temperature processing possible ■ Thermosetting conductive material ■ Compatible with lead-free mounting ■ High-temperature solder reflow resistance *For more details, please refer to the PDF document or feel free to contact us.
70℃ curing possible - good conductivity!
Development is underway for flexible/stretchable substrates for wearable devices. It accommodates substrates that do not have heat resistance for that purpose. 【Product/Device Features】 - Compatible with dispense coating - Can cure at 70°C! - Good conductivity - Supports component mounting on stretchable/flexible substrates ~ Achieves an elastic modulus of 0.6 GPa (25°C/DMA) with a thermosetting type ~ - High reliability ~ Connectivity stability after 1000 temperature cycles ~
Thick film circuits printed with conductive ink! Methods for selecting metal particles used as fillers and surface treatment techniques!
Speaker Part 1: Dr. Takeshi Suga, Engineering PhD, Technical Department, Fujikura Kasei Co., Ltd. Electronic Materials Division Part 2: Masayoshi Yoshitake, Technical Engineer (Metal Division), Research and Development Department, Fukuda Metal Foil Powder Industry Co., Ltd. Part 3: Hiroshi Otsuka, Emeritus Professor, Meisei University Target Audience: Researchers and personnel interested in conductive adhesives, metal nanoparticle fillers, and trends in testing standards. Venue: Kawasaki City Industrial Promotion Hall, Conference Room 1 Date and Time: June 20, 2011 (Monday) 11:00 AM - 4:00 PM Capacity: 30 people. *Please apply early as there may be a rush of applications. Participation Fee: 57,750 yen (tax included, lunch included, including text costs) for up to 2 people from one company. *Tech-Zone members who apply by June 6 will receive an early bird discount price of 52,500 yen (for up to 2 people from one company). ◆ When applying for the early bird discount, please select "1 person (early discount)" or "2 people (early discount)" in the number registration. ◆ Point discounts are not applicable to the early bird discount price. Point discount services can only be applied when applying at the regular price. ◆ For additional applications from the same organization, an additional fee of 23,100 yen per person will be charged.
