Thermal conductivity, self-alignment, repairability, and adhesion improvement of conductive adhesives.
S20140
★What are the technical challenges of conductive adhesives that can be used from application to curing!? ★A one-day seminar to understand and master the properties of conductive adhesives!!
Lecturers Part 1: Masahiro Inoue, Assistant Professor, Institute of Industrial Science, Osaka University Part 2: Representative, Research and Development Department, Fukuda Metal Foil & Powder Co., Ltd. Part 3: Representative, Conductive Materials Technology Unit, Technical Development Headquarters, Namics Corporation Target Audience: Engineers and researchers related to implementation technologies such as conductive adhesives and lead-free solder, and those responsible for the development of conductive adhesive-related materials. Venue: Kawasaki International Exchange Center, Kanagawa, Kawasaki Date and Time: January 30, 2012 (Monday) 11:00 AM - 4:00 PM Capacity: 30 people. *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] For one person from one company, 44,100 yen (tax included, including text costs. For two people, 52,500 yen) ◆ Point discounts from the early bird price do not apply. When using the point discount service, it will only be applicable for applications at the regular price. *However, this applies only to Tech-Zone members who apply by January 16. Membership registration is free. *After January 16, the [Regular Price] will be 47,250 yen for one person from one company (tax included, including text costs. For two people from one company, 55,650 yen).
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basic information
**Summary of Lecture 2** Conductive adhesives/pastes are composites that disperse metal particles with conductive functions in a binder. With the demand for increased productivity and cost reduction in the production of electronic components, their usage has grown because they allow for the easy formation of conductive layers simply by application and curing. Additionally, while printed electronics technology is gaining attention, the use of conductive pastes is being considered as one of its promising technologies. This lecture will explain the characteristics of metal-based conductive fillers and the required properties, categorized by application. It will also introduce the development trends of metal nanoparticles. **Summary of Lecture 1** From the perspective of environmental issues related to lead, conductive adhesives have garnered attention as bonding materials alongside lead-free solder, and their application has been explored for mobile devices, which require miniaturization of components and lightweight substrates. On the other hand, in automotive parts, which are highly likely to be exposed to various environments, the flexibility of the joints has attracted attention and has been put into practical use. However, various challenges have also been pointed out, and their adoption remains limited to certain markets. Therefore, this lecture aims to introduce a comparison between conductive adhesives and solder, as well as precautions when using conductive adhesives, and approaches from the perspectives of challenges and materials.
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P2
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P2
Applications/Examples of results
Part 1: Design of Conductive Adhesives and Improvement of Electrical and Thermal Conductivity 1. Introduction: Mechanism of Transport Properties of Conductive Adhesives 2. Electrical Transport Properties of Conductive Adhesives 3. Thermal Transport Properties of Conductive Adhesives 4. Control of Inter-Filler Contact 5. Conclusion: The Role of Fundamental Research in Future Development of Conductive Adhesives Part 2: Development of Fillers for Conductive Adhesives/Pastes and Required Properties 1. Introduction 2. Manufacturing Techniques and Required Properties of Silver Particles 3. Manufacturing Techniques and Required Properties of Copper Particles 4. Other Metal Fillers 5. Trends in the Development of Metal Nanoparticles (Silver and Copper) for Conductive Pastes Part 3: Environment and Challenges Surrounding Conductive Adhesives as Mounting Materials 2. Constituent Materials of Conductive Adhesives 3. Impact on the Properties of Conductive Adhesives 3-1. Influence of Curing Temperature on Adhesion Strength and Resistivity 3-2. Influence of Component Size on Adhesion Strength and Resistivity 3-3. Influence of Load During Component Mounting on Connection Resistance 4. Challenges of Conductive Adhesives and Approaches from a Material Perspective 4-1. Adaptability to Sn-Plated Electrodes 4-2. Improvement of Thermal Conductivity 4-3. Self-Alignment Properties 4-4. Repairability
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