Contract processing "SiC & Sapphire"
Continuously responding to evolving needs! We will accommodate through consistent processing.
Rokko Electric Co., Ltd.'s contract processing can consistently perform grinding → polishing → RCA cleaning of SiC wafers using a unique method. We achieve grinding → polishing → RCA cleaning with existing silicon processing machines. Compared to current dedicated machines, we can offer high speed, low warpage, high surface roughness, and large diameter compatibility, all through integrated processing. The grinding and polishing technology of silicon wafers, which affects the characteristics and performance of semiconductors, is developed, improved, and updated with high precision. 【Features】 ○ Reduced processing time and costs with grind grinding ○ High-speed and ultra-smooth CMP ○ High quality achieved through RCA cleaning ○ Epi regeneration processing For more details, please contact us or download the catalog.
- Company:六甲電子
- Price:Other