Dicing processing service
Dicing processing (straight lines) and machining processing (curves) also achieve integrated processing.
Our company provides cutting (dicing) and grinding (thinning) processing technologies primarily for semiconductor silicon wafers. Additionally, this processing technology is extended to a wide range of materials that are considered difficult to process, such as optical glass, ceramics, and SiC sapphire. We cut IC chips smaller, thinner, and with greater precision. Furthermore, you can also rely on us for round processing, curves, and precision hole drilling. 【Features】 ■ Processing can be done using pure materials in a clean environment ■ Equipped with ultrasonic functions for precise processing of difficult-to-machine materials ■ Integrated processing within the same process *For more details, please download the PDF or contact us.
- Company：サンテック
- Price：Other
