MSAP FPC (Ultra-fine Circuit High-Frequency Flexible Substrate)
Formation of fine circuits using the MSAP method.
Yamashita Material's MSAP (Modified Semi-Additive Process) is a high-precision method for forming fine copper wiring on polyimide substrates. Compared to traditional subtractive methods, it has less distortion in pattern shapes due to etching, allowing for the formation of higher-density circuits. It is suitable for FPC applications that require miniaturization, high density, and fine wiring.
- Company：山下マテリアル
- Price：Other
