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Laser Processing Service Product List and Ranking from 254 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

Laser Processing Service Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. トロテック・レーザー・ジャパン 本社 Tokyo//Industrial Machinery
  2. null/null
  3. アマダ（アマダグループ） Kanagawa//Industrial Machinery
  4. 4 日本レーザー Tokyo//Electronic Components and Semiconductors
  5. 5 ヨコハマシステムズ レーザー事業部 Tokyo//Trading company/Wholesale
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Laser Processing Service Product ranking

Last Updated： Aggregation Period:Dec 17, 2025～Jan 13, 2026
This ranking is based on the number of page views on our site.

  1. Amada's domestic exhibition facility アマダ（アマダグループ）
  2. Highly operable medium-sized CO2 laser processing machine 'Speedy 300' トロテック・レーザー・ジャパン 本社
  3. High-precision compact CO2 laser processing machine 'Speedy100' トロテック・レーザー・ジャパン 本社
  4. 4 Compact Size CO2 Laser Engraving Machine 'Speedy50' トロテック・レーザー・ジャパン 本社
  5. 4 PCD tool laser processing machine that achieves improved tool quality with high processing precision. フォルマー・ジャパン

Laser Processing Service Product List

511～525 item / All 654 items

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Slit processing

Slit processing

Steel plate slitting processing

Eco Pipe Co., Ltd. owns steel plate slitting equipment and performs slitting processing at our own factory located in Higashiomi City, Shiga Prefecture. Raw materials are directly shipped from manufacturers to our factory, where we carry out slitting processing and conduct integrated production up to pipe manufacturing. In particular, we are the only company in the Shiga area capable of slitting hot coils. We also accept sales and processing of other slitted coil products. For more details, please contact us.

  • Bag making machine/slitter

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Tomeks Corporation Business Introduction

Tomeks Corporation Business Introduction

From palm-sized to a maximum length of 4 meters, we can process it!

Tomeks Co., Ltd. is a company primarily engaged in the manufacturing of logistics equipment, building materials, sheet metal processing, and painting. Having developed through two main pillars: the design and construction of painting equipment and metal processing, our company possesses top-class domestic equipment capable of meeting a wide variety of metal processing requests. We carry out total system design and construction that realizes labor-saving, quality improvement, and environmental conservation in painting. We also flexibly respond to our customers' needs with integrated orders from painting to assembly. 【Main Businesses】 ■ Manufacturing of logistics equipment and building materials ■ Sheet metal processing and painting ■ Design and construction of painting equipment ■ Sales of painting equipment and related products ■ Interior finishing work, etc. *For more details, please refer to our catalog or feel free to contact us.

  • Contract manufacturing

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[Video] △▽△ Equipment Owned △▽△ Mitsubishi Fiber Laser Processing Machine

[Video] △▽△ Equipment Owned △▽△ Mitsubishi Fiber Laser Processing Machine

We propose the most suitable laser processing for our customers. High-quality drilling and cutting with minimal heat impact is possible.

With AI assistance, we can automatically detect processing defects and adjust cutting conditions automatically, which has improved quality. (There is no longer a situation where all processing is done with cutting defects, ruining all standard materials.) The cutting speed has increased to more than twice that of our conventional equipment. We have achieved cost reduction through efficiency and energy savings. Additionally, the range of materials we can process has expanded!

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  • Other machine tools

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Main Equipment: Yonezawa Instrument Industry Co., Ltd.

Main Equipment: Yonezawa Instrument Industry Co., Ltd.

This is an introduction to the main equipment of Yonezawa Machinery Industry Co., Ltd.

【Contents】 ■Laser processing machine ■NCT turret punch press ■Press machine ■Shearing ■Measuring instrument ■Tapping machine ■Roll bender ■Bender ■Table spot welder ■TIG welder ■CO² semi-automatic welder ■Spot welder ■Robot welder ■YAG welder ■Automatic programming system ■Sheet works ■Drill press ■Forklift *For more details, please download the PDF or feel free to contact us.

  • Welding Machine
  • Special Processing Machinery

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Laminating (pouch processing)

Laminating (pouch processing)

We accept sizes from card size to large format, from single pieces to large lots. We can accommodate a wide range of items, including posters and various types of signage, as well as restaurant menus.

The thickness of the film comes in a lightweight type (40μ: 0.04mm) that is perfect for carrying around, a medium type (100μ: 0.1mm) that is widely used, and a thick type (150μ: 0.15mm) that has a bit more thickness and feels sturdier, although it can only accommodate up to A1 size. Like the PP processing, it is also available in a matte type. Please contact us in advance if you wish to order this. Additionally, if you provide printed materials, we can create a multi-page menu with creasing and rivet fastening after lamination. We can also accommodate a wide range of promotional materials such as drawings, POP displays, posters, and more, from a single piece to large lots. Sizes range from card size 54×86mm to B0 size 1,030×1,456mm, including non-standard sizes, but please inquire in advance due to film stock availability.

  • Processing Contract
  • Packaging materials
  • Catalog and manual creation

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UV laser processing machines (nanosecond, picosecond, etc.) 【contract processing, equipment sales】

UV laser processing machines (nanosecond, picosecond, etc.) 【contract processing, equipment sales】

Equipped with a high-speed UV oscillator with a wavelength of 355nm! A laser processing machine that also supports ultra-small diameter processing from 10μm to 30μm.

The "Vela UV" is a laser processing machine equipped with a high-speed UV oscillator operating at a wavelength of 355nm. It performs high-speed, high-precision micro-diameter processing of printed circuit boards and other materials. Additionally, it allows for the selection of suitable laser sources based on materials and purposes. The two-axis configuration enables high-speed processing of two workpieces simultaneously. 【Features】 ■ Ability to select suitable laser sources based on materials and purposes ■ High-speed processing of two workpieces simultaneously due to the two-axis configuration ■ Capable of micro-diameter processing from 10μm to 30μm ■ Comfortable operability with in-house developed CNC ■ Support for test processing ■ Contract processing and equipment sales *For more details, please refer to the PDF document or feel free to contact us.

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  • Other processing machines

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CO2 Laser Processing Machine [Contract Processing and Equipment Sales]

CO2 Laser Processing Machine [Contract Processing and Equipment Sales]

Comfortable operability with in-house developed CNC! CO2 laser processing machine.

The "CO2 Laser Processing Machine" achieves low power consumption through a design that eliminates waste. It supports various surface treatments such as blackening, browning, and untreated, as well as various processing methods like DLD and Conformal Mask. It offers comfortable operability with our in-house developed CNC. 【Features】 ■ Achieves low power consumption through a design that eliminates waste ■ Supports various surface treatments (blackening, browning, untreated) ■ Supports various processing methods (DLD, Conformal Mask, Resin Direct) ■ Comfortable operability with our in-house developed CNC ■ Contract processing and equipment sales *For more details, please refer to the PDF document or feel free to contact us.

  • Other processing machines

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Invitation to Exhibit at the 2019 Total Solutions for Electronic Devices Exhibition

Invitation to Exhibit at the 2019 Total Solutions for Electronic Devices Exhibition

Exhibition of CO2 and UV laser processing technology, hole drilling and contour processing machines, fully automatic AOI, and X-ray inspection equipment.

The Daifune Group is engaged in the manufacturing and sales of drilling machines and profile processing machines, as well as contract processing using various laser processing machines. At the "Total Solutions for Electronic Devices Exhibition 2019," starting on June 5, we will introduce our unique processing technologies and drilling/profile processing machines. We will also display actual models of fully automatic AOI and X-ray inspection equipment, and provide detailed explanations of the features of each product. [Exhibition Content] ■ CO2 and UV laser processing (we also accept prototypes for 5G laser processing) ■ Drilling machines and profile processing machines (processing technology for base stations, communications, and automotive substrates) ■ Fully automatic AOI (also for labor-saving, IoT, inline, and cloud applications) ■ X-ray inspection equipment (for multilayer boards) *You can view related product materials from the "PDF Download" section.

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  • 全自動AOIvr2.jpg
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  • Exhibition planning/construction

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Introduction to examples of inner layer copper foil machining.

Introduction to examples of inner layer copper foil machining.

【Example of Inner Layer Copper Foil Engraving】 In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil, and we will introduce examples of such processing.

In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil. By using our touch-type engraving mechanism and accurately detecting the target copper foil position, we can achieve high-precision engraving processing.

  • Circuit board processing machine

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[Contract Processing] CO2/UV Laser, Drilling, Router *Processing Examples

[Contract Processing] CO2/UV Laser, Drilling, Router *Processing Examples

We also support processing of 5G and IoT-related materials! We can propose technical solutions based on your needs, such as processing with laser composites or performing high-precision back drilling.

Our company specializes in contract processing of printed circuit boards used in 5G, IoT, automotive, HDI, Mini-LED, and base stations. We possess UV/CO2 laser processing machines capable of ultra-small diameter processing, as well as drilling machines and router processing machines. By combining these, we can propose processing technologies for printed circuit boards tailored to your needs. We also accept technical consultations and development regarding processing methods, and we handle various inspection devices (such as Hall AOI and circuit AOI). 【Examples of Processing Materials】 PTFE-based, FR-5-based, PPE/PPO-based, R-5515, R-1566, MEG6, MEG7, MEG8, RO4350B, RO3003G2, etc. 【If you have the following requests, please feel free to consult with us】 - I want to process using CO2/UV or other lasers (processing with CO2/UV or PICO/femtosecond lasers, etc.) - I want to process new materials or difficult-to-process materials (ABF materials, Rogers materials, MEGTRON materials, glass materials, etc.) ★ We are also conducting test processing! If you are interested, please apply through the inquiry form. *We are currently offering materials that introduce processing examples.

  • Processing Contract

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Laser processing machine - multipurpose single-axis laser processing machine

Laser processing machine - multipurpose single-axis laser processing machine

Multipurpose 1-axis laser processing machine! Development of processing technology for new materials and sales of production machines (custom-made available).

The multi-purpose single-axis laser processing machine was first exhibited as a real machine at "JPCA 2022" by the Japanese company Ofuna. Customers can choose the laser oscillator and table specifications according to their processing applications and materials, allowing for custom-made solutions. We own various types of multi-purpose single-axis laser processing machines, including UV (nanosecond, picosecond) and CO2, enabling us to provide consistent support from the development of processing technology for new materials to the sale of production machines. ■ Examples of processing with UV laser Processing of micro-diameter holes in ABF material (package substrate), processing of micro-diameter holes in PI material (flexible substrate), small-diameter hole processing of SI wafers and ceramics, cutting of Cu/PP multilayer boards, cutting of Cu/LCP double-sided boards, etc. ■ Examples of processing with CO2 laser TH processing of Cu 2um double-sided boards, BH processing of Cu 2um multilayer boards, and new materials compatible with high frequency and 5G such as fluororesin, liquid crystal polymer, and PPE resin. *For more details, please refer to the PDF materials or feel free to contact us. *There are also various examples of processing applications, so please check the PDF materials.

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  • Other processing machines

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CO2 Laser Processing Example: Package Substrate Processing

CO2 Laser Processing Example: Package Substrate Processing

Case study of small diameter hole drilling for package substrates

Using our unique technology, we can ensure high-quality hole shapes and achieve the desired taper rate. This document details the processing of materials with a thickness of 32.5μm using a CO2 laser, down to a minimum diameter of φ30μm.

  • Processing Contract

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CO2 Laser Processing Example_Cu Direct TH Processing

CO2 Laser Processing Example_Cu Direct TH Processing

Cu Direct Double-Sided Through Hole Processing

In a case where through-hole processing was performed on a double-sided plate with a thickness of φ2μm using a CO2 laser processing machine, we control the cross-sectional shape of the through-holes according to the customer's needs using our unique technology.

  • Processing Contract

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CO2 Laser Processing Example_Cu Direct BH Processing

CO2 Laser Processing Example_Cu Direct BH Processing

Cu Direct Blind Processing Examples

This is an example of using our equipment's unique features to ensure high-quality hole shapes and aim for a reduction in the number of shots. In this document, we have achieved a reduction from the usual 4 shots to 3 shots by utilizing these unique features.

  • Processing Contract

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UV & CO2 Laser Processing Case Study: Composite Processing of Cu + PP Materials

UV & CO2 Laser Processing Case Study: Composite Processing of Cu + PP Materials

Case study of UV and CO2 laser hybrid processing of Cu+PP materials

Our company has two types of processing technologies, UV and CO2, and by combining the advantages of these lasers, we are able to achieve high-quality laser drilling that reduces the burden of subsequent processes. This document discusses the processing of multilayer boards, and to avoid damaging the inner copper foil, we perform resin processing with CO2 after drilling, followed by UV processing to remove residues at the bottom of the holes.

  • Processing Contract

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