We also support processing of 5G and IoT-related materials! We can propose technical solutions based on your needs, such as processing with laser composites or performing high-precision back drilling.
Our company specializes in contract processing of printed circuit boards used in 5G, IoT, automotive, HDI, Mini-LED, and base stations. We possess UV/CO2 laser processing machines capable of ultra-small diameter processing, as well as drilling machines and router processing machines. By combining these, we can propose processing technologies for printed circuit boards tailored to your needs. We also accept technical consultations and development regarding processing methods, and we handle various inspection devices (such as Hall AOI and circuit AOI). 【Examples of Processing Materials】 PTFE-based, FR-5-based, PPE/PPO-based, R-5515, R-1566, MEG6, MEG7, MEG8, RO4350B, RO3003G2, etc. 【If you have the following requests, please feel free to consult with us】 - I want to process using CO2/UV or other lasers (processing with CO2/UV or PICO/femtosecond lasers, etc.) - I want to process new materials or difficult-to-process materials (ABF materials, Rogers materials, MEGTRON materials, glass materials, etc.) ★ We are also conducting test processing! If you are interested, please apply through the inquiry form. *We are currently offering materials that introduce processing examples.
Inquire About This Product
basic information
[If you have any other requests like the following, please feel free to consult with us] - I want to process using a CO2/UV laser combination (removing thin films with a UV laser after CO2 laser processing) - I want to perform high-precision back drilling with a drill (such as removing the plating layer of communication substrates) - I am having trouble with stub residue inspection (trouble with stub residue inspection after back drilling, etc.) - I want to perform high-precision counterboring with a router (for example, counterboring of thick copper substrates, etc.) [Features of Contract Processing] - CO2/UV laser processing machines are developed in-house for contract processing - Drilling machines and router machines use development equipment from the Ofuna Group - We have numerous achievements in contract processing for customers from Japan, Taiwan, and China - Our team consists of experienced members who can also handle projects with unfamiliar materials *For more details, please refer to the materials. Feel free to contact us as well.
Price range
Delivery Time
Applications/Examples of results
*For more details, please refer to the materials. Feel free to contact us as well.*
catalog（11）
Download All Catalogs
Company information
At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.
![[Free Offer] Prevent Blade Troubles in Production Equipment! Non-Stick Thin Film Coating](https://image.mono.ipros.com/public/product/image/fde/2000612726/IPROS23915370847246220159.jpeg?w=280&h=280)
