Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Oct 22, 2025～Nov 18, 2025
This ranking is based on the number of page views on our site.
571～585 item / All 709 items
![CO2 Laser Processing [Cu Direct Blind Hole Processing Results]](https://image.mono.ipros.com/public/product/image/f2a/2000522228/IPROS56331496691757518541.jpeg?w=280&h=280)
Focus on the micro-diameter processing capability of CO2 lasers and the technology for controlling resin diameter.
1. Cu Direct BH Processing Results ■No.1: Example of untreated substrate Cu direct micro-diameter processing Hole diameter φ30–60μm ■No.2-1: Improvement in quality and productivity of Cu direct φ70μm processing ■No.2-2: Improvement in quality and productivity of Cu direct φ100μm processing
![CO2 Laser Processing [ABF Resin Direct Processing Results]](https://image.mono.ipros.com/public/product/image/1bd/2000522251/IPROS78001648188274828124.jpeg?w=280&h=280)
■ The densification of package substrates is progressing, and there is a demand for miniaturization using CO2 lasers. ■ Introducing examples of miniaturization processing using our VELA machine.
ABF Resin Direct Processing Results ■No.1-1: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ30–50μm ■No.1-2: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ60–120μm ■No.2-1: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ30–50μm ■No.2-2: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ60–120μm
![[Contract Processing] CO2/UV Laser, Drilling, Router *Processing Examples](https://image.mono.ipros.com/public/product/image/6c5/2000567048/IPROS27847764474310407668.png?w=280&h=280)
We also support processing of 5G and IoT-related materials! We can propose technical solutions based on your needs, such as processing with laser composites or performing high-precision back drilling.
Our company specializes in contract processing of printed circuit boards used in 5G, IoT, automotive, HDI, Mini-LED, and base stations. We possess UV/CO2 laser processing machines capable of ultra-small diameter processing, as well as drilling machines and router processing machines. By combining these, we can propose processing technologies for printed circuit boards tailored to your needs. We also accept technical consultations and development regarding processing methods, and we handle various inspection devices (such as Hall AOI and circuit AOI). 【Examples of Processing Materials】 PTFE-based, FR-5-based, PPE/PPO-based, R-5515, R-1566, MEG6, MEG7, MEG8, RO4350B, RO3003G2, etc. 【If you have the following requests, please feel free to consult with us】 - I want to process using CO2/UV or other lasers (processing with CO2/UV or PICO/femtosecond lasers, etc.) - I want to process new materials or difficult-to-process materials (ABF materials, Rogers materials, MEGTRON materials, glass materials, etc.) ★ We are also conducting test processing! If you are interested, please apply through the inquiry form. *We are currently offering materials that introduce processing examples.
Multipurpose 1-axis laser processing machine! Development of processing technology for new materials and sales of production machines (custom-made available).
The multi-purpose single-axis laser processing machine was first exhibited as a real machine at "JPCA 2022" by the Japanese company Ofuna. Customers can choose the laser oscillator and table specifications according to their processing applications and materials, allowing for custom-made solutions. We own various types of multi-purpose single-axis laser processing machines, including UV (nanosecond, picosecond) and CO2, enabling us to provide consistent support from the development of processing technology for new materials to the sale of production machines. ■ Examples of processing with UV laser Processing of micro-diameter holes in ABF material (package substrate), processing of micro-diameter holes in PI material (flexible substrate), small-diameter hole processing of SI wafers and ceramics, cutting of Cu/PP multilayer boards, cutting of Cu/LCP double-sided boards, etc. ■ Examples of processing with CO2 laser TH processing of Cu 2um double-sided boards, BH processing of Cu 2um multilayer boards, and new materials compatible with high frequency and 5G such as fluororesin, liquid crystal polymer, and PPE resin. *For more details, please refer to the PDF materials or feel free to contact us. *There are also various examples of processing applications, so please check the PDF materials.
Case study of small diameter hole drilling for package substrates
Using our unique technology, we can ensure high-quality hole shapes and achieve the desired taper rate. This document details the processing of materials with a thickness of 32.5μm using a CO2 laser, down to a minimum diameter of φ30μm.
Cu Direct Double-Sided Through Hole Processing
In a case where through-hole processing was performed on a double-sided plate with a thickness of φ2μm using a CO2 laser processing machine, we control the cross-sectional shape of the through-holes according to the customer's needs using our unique technology.
Cu Direct Blind Processing Examples
This is an example of using our equipment's unique features to ensure high-quality hole shapes and aim for a reduction in the number of shots. In this document, we have achieved a reduction from the usual 4 shots to 3 shots by utilizing these unique features.
Case study of UV and CO2 laser hybrid processing of Cu+PP materials
Our company has two types of processing technologies, UV and CO2, and by combining the advantages of these lasers, we are able to achieve high-quality laser drilling that reduces the burden of subsequent processes. This document discusses the processing of multilayer boards, and to avoid damaging the inner copper foil, we perform resin processing with CO2 after drilling, followed by UV processing to remove residues at the bottom of the holes.
Examples of UV laser processing applications for various materials.
Our company sells in-house developed laser processing machines (from CO2 lasers to nanosecond, picosecond, and femtosecond UV lasers), and we accept contract processing from test processing for product machining technology development to small-scale production sales during our customers' initial development stages. This document includes processing examples of SI wafers, ceramics, multilayer boards, and double-sided boards using picosecond lasers.
Examples of micro-diameter hole processing for package substrates
Using the top-hat beam with a minimum beam diameter of φ10μm or less from our UV laser processing machine, we achieve high-quality drilling with a steep taper. This document includes processing examples with a minimum diameter of φ20μm for package material with a thickness of t25μm and a minimum diameter of φ10μm for package material with a thickness of t10μm.
We offer a wide range of services from the sale of UV laser processing machines to initial development and contract processing for small-scale production!
Our company sells laser processing machines developed in-house, and we also accept contract processing from prototypes to mass-produced products. We specialize in technological development, so we can handle everything from the development of processing methods for new materials and products to contract processing and manufacturing sales of mass-produced items. Please feel free to consult with us.
We offer a wide range of services from the sale of CO2 laser processing machines to initial development, contract processing for small-scale production, and manufacturing sales.
We sell our own developed laser processing machines, but we also accept contract processing from development products to mass-produced items. We specialize in technological development, so we can handle everything from the development of processing methods for new materials and products to contract processing of mass-produced items and the manufacturing and sales of equipment. Please feel free to consult with us.
A new type of CO2 laser processing machine for PKG materials that quickly processes at high speed with four beams.
The manufacturing of electronic circuits for CPUs, which are becoming increasingly miniaturized, requires more precise processing. Therefore, the selection of processing machines is crucial, with quality and productivity being important factors. The "ECO-TL4C" from Ofuna Corporation Japan is a new type of CO2 laser processing machine that enhances the processing quality of substrate materials for packaging, including interlayer insulating film materials, through its unique functions, enabling efficient processing with two tables and four beams.
Leave it to us for laser processing, three-dimensional laser, bending processing, TIG welding, argon welding, and MIG welding.
Nishida Giko Co., Ltd. specializes in sheet metal processing, focusing on laser processing, bending processing, turret punching, precision sheet metal processing, TIG welding, and spot welding. We can accept orders for integrated production. You can entrust us with everything from design and setup to material procurement, processing (sheet metal and welding), surface treatment, assembly, inspection, and shipping. We also accommodate a wide range of production volumes, from small lot production (1 or 2 pieces) to mass production (10,000 pieces), and we are open to consultations for both large and small items. 【Business Activities】 ■ Laser Processing ■ Bending Processing ■ Turret Punching ■ Welding *Please feel free to contact us for more details.
We use laser cutting machines and water jets to cut shapes according to customer specifications.
At Horie Co., Ltd., we can process various materials with thicknesses ranging from 1mm to 150mm using laser cutting machines and water jets on both axes. Not only cutting, but we also utilize bending, tapping, welding, and other techniques to accommodate any shape according to the customer's conditions and applications. Additionally, we manage the entire process from order to delivery through our network, achieving short lead times and high quality. 【Features】 ■ Achieved cutting thickness: 140mm ・ Can cut up to a maximum of 160mm ■ Processing size: 1220mm x 2440mm ・ Maximum processing water pressure: 400MPa ・ Complex shapes are acceptable *For more details, please download the PDF or feel free to contact us.
