■ The densification of package substrates is progressing, and there is a demand for miniaturization using CO2 lasers. ■ Introducing examples of miniaturization processing using our VELA machine.
ABF Resin Direct Processing Results ■No.1-1: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ30–50μm ■No.1-2: Resin Direct (ABF GZ41 t32.5μm) Hole diameter φ60–120μm ■No.2-1: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ30–50μm ■No.2-2: Resin Direct (ABF Development Product t32.5μm) Hole diameter φ60–120μm
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[Contract Processing Request] [Specification Inquiry] Please contact us through the inquiry section on this page for contract processing requests or specification details.
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[Usage/Examples of Achievements] ■For inquiries regarding contract processing requests or specification details, please contact us using the inquiry section on this page.
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At Daifune Corporation Japan, we are developing and selling our own brand Vela products, including printed circuit board hole drilling machines and printed circuit board outline processing machines, as well as our own CO2/UV laser processing machines, and we are expanding a technology proposal-based JOBSHOP business. Furthermore, we offer various inspection devices (laser via AOI, hole AOI, fully automatic circuit AOI, X-ray inspection equipment, etc.), various spindles, parts and materials for hole drilling and outline processing machines, as well as a modification/maintenance business for used machines. We will utilize our technological capabilities to propose and realize solutions to various problems, so we look forward to your contact with us.